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Journal: Energies, 2024
Volume: 17
Number: 5692
Article:
Analysis of Key Factors Affecting Case-to-Ambient Thermal Resistance in Thermal Modeling of Power Devices
Authors:
by
Kaixin Wei, Peiji Shi, Pili Bao, Chuanchao Liu and Yanzhou Qin
Link:
https://www.mdpi.com/1996-1073/17/22/5692
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