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Journal: Sensors, 2021
Volume: 21
Number: 2011

Article: Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor
Authors: by Yunfan Zhang, Bowen Li, Hui Li, Shengnan Shen, Feng Li, Wentao Ni and Wan Cao
Link: https://www.mdpi.com/1424-8220/21/6/2011

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