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Journal: Sensors, 2015
Volume: 15
Number: 22049
Article:
Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer
Authors:
by
Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong and Toshitsugu Ueda
Link:
https://www.mdpi.com/1424-8220/15/9/22049
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