Gate definition is a major challenge in p-GaN gate AlGaN/GaN HEMT structures because of the high selectivity and low plasma damage required during the etching process. In this work, self-terminated etching, developed to limit surface damage and loss...
On the way toward MEMS miniaturization, the quantification of geometric uncertainties stands as a primary challenge. In this paper, an approach that combines genetic algorithms and proper orthogonal decomposition with kriging surrogate modeling was p...
Fabrication imperfections strongly influence the functioning of Micro-Electro-Mechanical Systems (MEMS) if not taken into account during the design process. They must be indeed identified or precisely predicted to guarantee a proper compensation duri...
In this work, we provide a numerical/experimental investigation of the micromechanics-induced scattered response of a polysilicon on-chip MEMS testing device, whose moving structure is constituted by a slender cantilever supporting a massive perforat...
When the dimensions of polycrystalline structures become comparable to the average grain size, some reliability issues can be reported for the moving parts of inertial microelectromechanical systems (MEMS). Not only the overall behavior of the device...
Microscale uncertainties related to the geometry and morphology of polycrystalline silicon films, constituting the movable structures of micro electro-mechanical systems (MEMS), were investigated through a joint numerical/experimental approach. An on...
The response of micromachines to the external actions is typically affected by a scattering, which is, on its own, induced by their microstructure and by stages of the microfabrication process. The progressive reduction in size of the mechanical comp...
This study investigated the effect of over-etching and prolonged application time of a universal adhesive on dentin bond strength. Ninety extracted human molars were ground to dentin and randomly allocated into nine groups (G1–9; n = 10 per gro...
Microelectromechanical systems (MEMS) have been already successfully commercialized for around 20 years. The design of novel MEMS sensors currently targets two important features: smaller dimensions and higher reliability. As the characteristic size...
The inclination effect caused by fabrication errors on the periodic response of a symmetric MEMS gyroscope is investigated. The dynamic equation is established considering the inclination effect on support stiffness and electrostatic forces. The peri...
Conventional etchants for multi-metal/alloy stacked structures often suffer from nonuniform etching, residual layers, or undercutting, failing to meet high-generation production standards. This study presents a stable copper-molybdenum (Cu-Mo) etchan...
Six dentin adhesives were tested in vitro regarding their cytotoxicity on human fibroblasts. The adhesives Hybrid Bond, One-up Bond F Plus, AdheSE, Clearfil SE Bond, Optibond Solo Plus and Syntac were eluted with culture medium as single or sequentia...
Objectives: Six dentin adhesives were tested in vitro regarding their cytotoxicity toward human fibroblasts. AdheSE, Clearfil SE Bond, Hybrid Bond, One-up Bond F Plus, Optibond Solo Plus, and Syntac were tested using a cell culture model. The several...
Monte Carlo analyses on statistical volume elements allow quantifying the effect of polycrystalline morphology, in terms of grain topology and orientation, on the scattering of the elastic properties of polysilicon springs. The results are synthesize...
This study compared the shear bond strength (SBS) and micromorphology of composite resin to human dentin after pre-treatment with silica-modified aluminum oxide air abrasion. Forty-six molar teeth were treated with either Scotchbond Multi-Purpose (SC...
The study assessed the bonding performance of three universal adhesives on desensitized dentin with etch-and-rinse mode or self-etch mode after nano-hydroxyapatite (nHAp)-based desensitizers application. Simulated sensitive dentin specimens were prep...
Etch pits could form on an exposed surface of a crystal when the crystal is exposed to an etching environment or chemicals. Due to different dissolution rates along various crystalline directions in a crystal, the dissolution process is anisotropic;...
For advanced semiconductor nodes, the demand for high-precision patterning of complex foundry circuits drives the widespread use of Lithography-Etch-Lithography-Etch (LELE)—a key Multiple Patterning Technology (MPT)—in Deep Ultraviolet (D...
Anisotropic etching of silicon in potassium hydroxide (KOH) is an important technology in micromachining. The residue deposition from KOH etching of Si is typically regarded as a disadvantage of this technology. In this report, we make use of this re...
Resonance features of slender mechanical parts of Lorentz force MEMS magnetometers are affected by the (weakly) coupled thermo-electro-magneto-mechanical multi-physics governing their dynamics. We recently showed that reduced-order models for such pa...
Engine blade maintenance can extend engine service life, with coating removal being the initial step in the regeneration process. Silicon-modified diffusion aluminum-silicon coating (AlSi coating) is well-established as a protective coating for nicke...
A wet-etching technique based on a mixture of hydrochloric (HCl) and nitric (HNO3) acids is introduced, demonstrating exceptional 42:1 selectivity for etching N-polar GaN over Al0.24Ga0.76N. In the absence of an AlGaN etch stop layer, the etchant pri...
This study’s aim was to assess whether the Renewal MI composite can self-etch enamel, seal sound cavities, and stabilize demineralized dentine. Etching was assessed using scanning electron microscopy (SEM). Cavity sealing was quantified using t...
With the scaling down of integrated circuit dimensions and the increasing complexity of transistor structures, the role of etching in manufacturing has become increasingly critical. We propose an etching simulation approach based on a video generatio...
Acid corrosion is a problem pertaining to corrosion that involves an acid solution. It is important to treat metal to preserve its integrity. Thus, acids are utilized to clean and treat metal surfaces. In return, this may lead to over-etching and met...
In the fabrication of micro-electro-mechanical systems (MEMS) devices, manufacturing process variations are usually involved. For these devices sensitive to process variations such as doubly-clamped beams, mismatches between designs and final product...
The ability to manufacture complex 3D structures with nanometer-scale resolution, such as Fresnel Zone Plates (FZPs), is crucial to achieve state-of-the-art control in X-ray sources for use in a diverse range of cutting-edge applications. This study...
This study aimed to investigate adhesive techniques applied to MIH-affected teeth by analyzing the one-year failure rate of restorations performed using total-etch and self-etch adhesive methods. This systematic review was conducted in accordance wit...
The optical properties of indium phosphide (InP) quantum dots (QDs) are significantly influenced by their surface native oxides, which are generally removed by treating InP cores with hydrofluoric acid (HF). Besides the harmful health effects of HF,...
In this paper, we investigate the stochastic effects of the microstructure of polysilicon films on the overall response of microelectromechanical systems (MEMS). A device for on-chip testing has been purposely designed so as to maximize, in complianc...
The proton exchange membrane water electrolyzer (PEMWE) requires a high operating voltage for hydrogen production to accelerate the decomposition of hydrogen molecules so that the PEMWE ages or fails. According to the prior findings of this R&D t...
Laser marking on wafers can introduce various defects such as inconsistent mark quality; under- or over-etching, and misalignment. Excessive laser power and inadequate cooling can cause burning or warping. These defects were inspected using machine v...
Recently, the uniformity in the wafer edge area that is normally abandoned in the fabrication process has become important for improving the process yield. The wafer edge structure normally has a difference of height between wafer and electrode, whic...
A novel method has been developed to fabricate submicron beams with galvanic etch stop for Si in TMAH. The different Au:Si area ratios before and after the release of the beams are used to trigger the galvanic etch stop to fabricate submicron single...
The voltage, current, temperature, humidity, pressure, flow, and hydrogen in the high-pressure proton exchange membrane water electrolyzer (PEMWE) can influence its performance and life. For example, if the temperature is too low to reach the working...
In the deep submicron regime, FinFET successfully suppresses the leakage current using a 3D fin-like channel substrate, which gets depleted and blocks possible leakage as the gate is applied with a bias wholly wrapping the channel. Fortunately, a sca...
Chemical processes are very important for the development of high-efficiency crystalline solar cells, mainly for surface texturing to improve light absorption and cleaning processes to reduce surface recombination. Recently, research has been focusin...
The aim of the study was to evaluate the stability, reactivity, and bond strength with a lithium disilicate ceramic of a self-etch silane primer (Monobond Etch and Prime/MEP). The stability was evaluated by 1H-,31P-NMR spectroscopy (before/after agin...
The path towards miniaturization for micro-electro-mechanical systems (MEMS) has recently increased the effects of stochastic variability at the (sub)micron scale on the overall performance of the devices. We recently proposed and designed an on-chip...
Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive-ion etching (DRIE) for releasing the device; however, the DRIE process with a glass substrate can potentia...
The electro-thermal performance of silicon nanosheet field-effect transistors (NSFETs) with various parasitic bottom transistor (trpbt)-controlling schemes is evaluated. Conventional punch-through stopper, trench inner-spacer (TIS), and bottom oxide...
The current investigation evaluated a novel acid-etching solution containing hydrochloric acid (HCl), hydrofluoric acid (HF), nitric acid (HNO3), orthophosphoric acid (H3PO4), and sulfuric acid (H2SO4) designed for etching zirconia ceramics. Achievin...
In this article, we focus on the development of a multiscale modeling and recurrent neural network (RNN) based optimization framework of a plasma etch process on a three-dimensional substrate with uniform thickness using the inductive coupled plasma...
The change in electrode impedance of semiconductor equipment due to repetitive processes is a major issue that creates process drift. In the current plasma etch chamber with a dual-frequency power system, the high-powered radio frequency (RF) source...
The study aimed to evaluate the influence of the manipulation surfaces on the physical properties of one-step self-etch adhesives (1-SEAs). Scotchbond Universal (SBU), Clearfil Universal Bond Quick ER (UBQ), and an experimental adhesive (UBQexp) were...
This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress de...
The objectives of this study were to evaluate the bonding durability of four different self-etch adhesives to dentin after 24 h and thermal cycling (TC) and to measure the degree of polymerization conversion (DC) in situ. Two-step self-etch adhesives...
Air-shielding radial ultrasonic rolling electrochemical micromachining (AS-RUREMM) is proposed to fabricate high-quality micro-dimple textures on cylindrical SS304 surfaces while suppressing stray corrosion. In AS-RUREMM, an annular air sheath coaxia...
Background: This study investigated a new multi-acid-etching formulation for zirconia ceramics, containing hydrochloric, hydrofluoric, nitric, orthophosphoric, and sulfuric acids. The solution was tested on polycrystalline (5Y-TZP zirconia), lithium...
This study investigates a metal-contact etching process that differs from conventional device contact etching by focusing on the film-stack configuration and the associated super-contact etching characteristics. Because metal-contact etching is close...
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