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Keywords = on-chip photodetectors

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10 pages, 3517 KB  
Article
High-Extinction-Ratio Chiral Mid-Wave Infrared Photodetector Using Trapezoidal Si Pillars
by Yingsong Zheng, Longfeng Lv, Yuxiao Zou, Bo Cheng, Hanxiao Shao, Guofeng Song and Kunpeng Zhai
Micromachines 2026, 17(2), 181; https://doi.org/10.3390/mi17020181 - 28 Jan 2026
Viewed by 165
Abstract
Although the polarization state, as a key physical dimension of light, plays an irreplaceable role in many frontier fields such as quantum communication and chiral sensing, traditional photodetectors are limited by the inherent optical isotropy of materials and thus are unable to directly [...] Read more.
Although the polarization state, as a key physical dimension of light, plays an irreplaceable role in many frontier fields such as quantum communication and chiral sensing, traditional photodetectors are limited by the inherent optical isotropy of materials and thus are unable to directly distinguish circular polarization information. This paper numerically reports a miniature circular polarization photodetector based on chiral metasurfaces, which achieves an excellent extinction ratio of up to 31 dB through the collaborative regulation of geometric displacement manipulation and tilt angle operation. This device utilizes the symmetry-breaking effect to construct significantly different transmission spectral responses between left circularly polarized light (LCP) and right circularly polarized light (RCP). Our research not only provides a high-performance implementation solution for on-chip polarization detection but also opens up new paths for the future development of quantum optics, integrated sensing, and ultra-compact polarization optical systems. Full article
(This article belongs to the Special Issue Photonic and Optoelectronic Devices and Systems, 4th Edition)
14 pages, 61684 KB  
Article
A CMOS-Compatible Silicon Nanowire Array Natural Light Photodetector with On-Chip Temperature Compensation Using a PSO-BP Neural Network
by Mingbin Liu, Xin Chen, Jiaye Zeng, Jintao Yi, Wenhe Liu, Xinjian Qu, Junsong Zhang, Haiyan Liu, Chaoran Liu, Xun Yang and Kai Huang
Micromachines 2026, 17(1), 23; https://doi.org/10.3390/mi17010023 - 25 Dec 2025
Viewed by 318
Abstract
Silicon nanowire (SiNW) photodetectors exhibit high sensitivity for natural light detection but suffer from significant performance degradation due to thermal interference. To overcome this limitation, this paper presents a high-performance, CMOS-compatible SiNW array natural light photodetector with monolithic integration of an on-chip temperature [...] Read more.
Silicon nanowire (SiNW) photodetectors exhibit high sensitivity for natural light detection but suffer from significant performance degradation due to thermal interference. To overcome this limitation, this paper presents a high-performance, CMOS-compatible SiNW array natural light photodetector with monolithic integration of an on-chip temperature sensor and an embedded intelligent compensation system. The device, fabricated via microfabrication techniques, features a dual-array architecture that enables simultaneous acquisition of optical and thermal signals, thereby simplifying peripheral circuitry. To achieve high-precision decoupling of the optical and thermal signals, we propose a hybrid temperature compensation algorithm that combines Particle Swarm Optimization (PSO) with a Back Propagation (BP) neural network. The PSO algorithm optimizes the initial weights and thresholds of the BP network, effectively preventing the network from getting trapped in local minima and accelerating the training process. Experimental results demonstrate that the proposed PSO-BP model achieves superior compensation accuracy and a significantly faster convergence rate compared to the traditional BP network. Furthermore, the optimized model was successfully implemented on an STM32 microcontroller. This embedded implementation validates the feasibility of real-time, high-accuracy temperature compensation, significantly enhancing the stability and reliability of the photodetector across a wide temperature range. This work provides a viable strategy for developing highly stable and integrated optical sensing systems. Full article
(This article belongs to the Special Issue Emerging Trends in Optoelectronic Device Engineering, 2nd Edition)
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29 pages, 5223 KB  
Review
Multifunctional Colloidal Quantum Dots-Based Light-Emitting Devices for On-Chip Integration
by Ruoyang Li, Jie Zhao, Yifei Qiao, Xiaoyan Liu and Shiliang Mei
Nanomaterials 2025, 15(18), 1422; https://doi.org/10.3390/nano15181422 - 16 Sep 2025
Cited by 1 | Viewed by 2422
Abstract
Colloidal quantum dots (CQDs) have attracted significant attention in optoelectronics due to their size-tunable bandgap, high photoluminescence quantum yield, and solution processability, which enable integration into compact and energy-efficient systems. This review consolidates recent progress in multifunctional CQD-based light-emitting devices and on-chip integration [...] Read more.
Colloidal quantum dots (CQDs) have attracted significant attention in optoelectronics due to their size-tunable bandgap, high photoluminescence quantum yield, and solution processability, which enable integration into compact and energy-efficient systems. This review consolidates recent progress in multifunctional CQD-based light-emitting devices and on-chip integration strategies. This review systematically examines fundamental CQD properties (quantum confinement, carrier dynamics, and core–shell heterostructures), key synthesis methods including hot injection, ligand-assisted reprecipitation, and microfluidic flow synthesis, and device innovations such as light-emitting field-effect transistors, light-emitting solar cells, and light-emitting memristors, alongside on-chip components including ongoing electrically pumped lasers and photodetectors. This review concludes that synergies in material engineering, device design, and system innovation are pivotal for next-generation optoelectronics, though challenges such as environmental instability, Auger recombination, and CMOS compatibility require future breakthroughs in atomic-layer deposition, 3D heterostructures, and data-driven optimization. Full article
(This article belongs to the Section Nanophotonics Materials and Devices)
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10 pages, 2570 KB  
Article
Demonstration of Monolithic Integration of InAs Quantum Dot Microdisk Light Emitters and Photodetectors Directly Grown on On-Axis Silicon (001)
by Shuaicheng Liu, Hao Liu, Jihong Ye, Hao Zhai, Weihong Xiong, Yisu Yang, Jun Wang, Qi Wang, Yongqing Huang and Xiaomin Ren
Micromachines 2025, 16(8), 897; https://doi.org/10.3390/mi16080897 - 31 Jul 2025
Cited by 1 | Viewed by 1295
Abstract
Silicon-based microcavity quantum dot lasers are attractive candidates for on-chip light sources in photonic integrated circuits due to their small size, low power consumption, and compatibility with silicon photonic platforms. However, integrating components like quantum dot lasers and photodetectors on a single chip [...] Read more.
Silicon-based microcavity quantum dot lasers are attractive candidates for on-chip light sources in photonic integrated circuits due to their small size, low power consumption, and compatibility with silicon photonic platforms. However, integrating components like quantum dot lasers and photodetectors on a single chip remains challenging due to material compatibility issues and mode field mismatch problems. In this work, we have demonstrated monolithic integration of an InAs quantum dot microdisk light emitter, waveguide, and photodetector on a silicon platform using a shared epitaxial structure. The photodetector successfully monitored variations in light emitter output power, experimentally proving the feasibility of this integrated scheme. This work represents a key step toward multifunctional integrated photonic systems. Future efforts will focus on enhancing the light emitter output power, improving waveguide efficiency, and scaling up the integration density for advanced applications in optical communication. Full article
(This article belongs to the Special Issue Silicon-Based Photonic Technology and Devices)
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16 pages, 2714 KB  
Article
On the Implementation of a Micromachining Compatible MOEMS Tri-Axial Accelerometer
by Ahmed Hamouda Elsayed, Samir Abozyd, Abdelrahman Toraya, Mohamed Abdelsalam Mansour and Noha Gaber
Chips 2025, 4(2), 28; https://doi.org/10.3390/chips4020028 - 13 Jun 2025
Cited by 1 | Viewed by 3285
Abstract
On-chip optical accelerometers can be a promising alternative to capacitive, piezo-resistive, and piezo-electric accelerometers in some applications due to their immunity to electromagnetic interference and high sensitivity, which allow for robust operation in electromagnetically noisy environments. This paper focuses on the characterization of [...] Read more.
On-chip optical accelerometers can be a promising alternative to capacitive, piezo-resistive, and piezo-electric accelerometers in some applications due to their immunity to electromagnetic interference and high sensitivity, which allow for robust operation in electromagnetically noisy environments. This paper focuses on the characterization of an easy-to-fabricate tri-axial fiber-free optical MEMS accelerometer, which employs a simple assembly consisting of a light emitting diode (LED), a quadrant photodetector (QPD), and a suspended proof mass, measuring acceleration through light power modulation. This configuration enables simple readout circuitry without the need for complex digital signal processing (DSP). Performance modeling was conducted to simulate the LED’s irradiance profile and its interaction with the proof mass and QPD. Additionally, experimental tests were performed to measure the device’s mechanical sensitivity and validate the mechanical model. Lateral mechanical sensitivity is obtained with acceptable discrepancy from that obtained from FEA simulations. This work consolidates the performance of the design adapted and demonstrates the accelerometer’s feasibility for practical applications. Full article
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12 pages, 2636 KB  
Article
MoTe2 Photodetector for Integrated Lithium Niobate Photonics
by Qiaonan Dong, Xinxing Sun, Lang Gao, Yong Zheng, Rongbo Wu and Ya Cheng
Nanomaterials 2025, 15(1), 72; https://doi.org/10.3390/nano15010072 - 5 Jan 2025
Cited by 9 | Viewed by 2435
Abstract
The integration of a photodetector that converts optical signals into electrical signals is essential for scalable integrated lithium niobate photonics. Two-dimensional materials provide a potential high-efficiency on-chip detection capability. Here, we demonstrate an efficient on-chip photodetector based on a few layers of MoTe [...] Read more.
The integration of a photodetector that converts optical signals into electrical signals is essential for scalable integrated lithium niobate photonics. Two-dimensional materials provide a potential high-efficiency on-chip detection capability. Here, we demonstrate an efficient on-chip photodetector based on a few layers of MoTe2 on a thin film lithium niobate waveguide and integrate it with a microresonator operating in an optical telecommunication band. The lithium-niobate-on-insulator waveguides and micro-ring resonator are fabricated using the femtosecond laser photolithography-assisted chemical–mechanical etching method. The lithium niobate waveguide-integrated MoTe2 presents an absorption coefficient of 72% and a transmission loss of 0.27 dB µm−1 at 1550 nm. The on-chip photodetector exhibits a responsivity of 1 mA W−1 at a bias voltage of 20 V, a low dark current of 1.6 nA, and a photo–dark current ratio of 108 W−1. Due to effective waveguide coupling and interaction with MoTe2, the generated photocurrent is approximately 160 times higher than that of free-space light irradiation. Furthermore, we demonstrate a wavelength-selective photonic device by integrating the photodetector and micro-ring resonator with a quality factor of 104 on the same chip, suggesting potential applications in the field of on-chip spectrometers and biosensors. Full article
(This article belongs to the Section Nanofabrication and Nanomanufacturing)
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8 pages, 1914 KB  
Article
A Reconfigurable Polarimetric Photodetector Based on the MoS2/PdSe2 Heterostructure with a Charge-Trap Gate Stack
by Xin Huang, Qinghu Bai, Yang Guo, Qijie Liang, Tengzhang Liu, Wugang Liao, Aizi Jin, Baogang Quan, Haifang Yang, Baoli Liu and Changzhi Gu
Nanomaterials 2024, 14(23), 1936; https://doi.org/10.3390/nano14231936 - 1 Dec 2024
Cited by 3 | Viewed by 2279
Abstract
Besides the intensity and wavelength, the ability to analyze the optical polarization of detected light can provide a new degree of freedom for numerous applications, such as object recognition, biomedical applications, environmental monitoring, and remote sensing imaging. However, conventional filter-integrated polarimetric sensing systems [...] Read more.
Besides the intensity and wavelength, the ability to analyze the optical polarization of detected light can provide a new degree of freedom for numerous applications, such as object recognition, biomedical applications, environmental monitoring, and remote sensing imaging. However, conventional filter-integrated polarimetric sensing systems require complex optical components and a complicated fabrication process, severely limiting their on-chip miniaturization and functionalities. Herein, the reconfigurable polarimetric photodetection with photovoltaic mode is developed based on a few-layer MoS2/PdSe2 heterostructure channel and a charge-trap structure composed of Al2O3/HfO2/Al2O3 (AHA)-stacked dielectrics. Because of the remarkable charge-trapping ability of carriers in the AHA stack, the MoS2/PdSe2 channel exhibits a high program/erase current ratio of 105 and a memory window exceeding 20 V. Moreover, the photovoltaic mode of the MoS2/PdSe2 Schottky diode can be operated and manipulable, resulting in high and distinct responsivities in the visible broadband. Interestingly, the linear polarization of the device can be modulated under program/erase states, enabling the reconfigurable capability of linearly polarized photodetection. This study demonstrates a new prototype heterostructure-based photodetector with the capability of both tunable responsivity and linear polarization, demonstrating great potential application toward reconfigurable photosensing and polarization-resolved imaging applications. Full article
(This article belongs to the Special Issue 2D Materials for Advanced Sensors: Fabrication and Applications)
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11 pages, 3451 KB  
Article
High-Performance Terahertz Coherent Perfect Absorption with Asymmetric Graphene Metasurface
by Jintao Chen, Lujun Hong, Jiangtao Lei, Yun Shen, Xiaohua Deng, Jing Chen and Tianjing Guo
Photonics 2024, 11(6), 544; https://doi.org/10.3390/photonics11060544 - 7 Jun 2024
Cited by 5 | Viewed by 2730
Abstract
In this work, we introduce a novel coherent perfect absorber, accentuating its novelty by emphasizing the broad bandwidth, reduced thickness, tunable property, and straightforward design achieved through the use of an asymmetric graphene metasurface. This design incorporates both square and circular graphene patches [...] Read more.
In this work, we introduce a novel coherent perfect absorber, accentuating its novelty by emphasizing the broad bandwidth, reduced thickness, tunable property, and straightforward design achieved through the use of an asymmetric graphene metasurface. This design incorporates both square and circular graphene patches arranged on either side of a silicon substrate. With an optimized structural design, this absorber consistently captures over 90% of incoming waves across the frequency range of 1.65 to 4.49 THz, with a graphene Fermi level of 0.8 eV, and the whole device measures just 1.5 um thick. This makes our absorber significantly more effective and compact than previous designs. The absorber’s effectiveness can be significantly enhanced by combining the metasurface’s geometric design with the graphene Fermi level. It is anticipated that this ultrathin, wideband coherent perfect absorption device will play a crucial role in emerging on-chip THz communication technologies, including light modulators, photodetectors, and so on. Full article
(This article belongs to the Special Issue Advanced Lasers and Their Applications, 2nd Edition )
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23 pages, 6446 KB  
Review
On-Chip Lasers for Silicon Photonics
by Jiangwen Zhang, Aadithya G. Shankar and Xihua Wang
Photonics 2024, 11(3), 212; https://doi.org/10.3390/photonics11030212 - 27 Feb 2024
Cited by 4 | Viewed by 11000
Abstract
With the growing trend in the information industry, silicon photonics technology has been explored in both academia and industry and utilized for high-bandwidth data transmission. Thanks to the benefits of silicon, such as high refractive index contrast with its oxides, low loss, substantial [...] Read more.
With the growing trend in the information industry, silicon photonics technology has been explored in both academia and industry and utilized for high-bandwidth data transmission. Thanks to the benefits of silicon, such as high refractive index contrast with its oxides, low loss, substantial thermal–optical effect, and compatibility with CMOS, a range of passive and active photonic devices have been demonstrated, including waveguides, modulators, photodetectors, and lasers. The most challenging aspect remains to be the on-chip laser source, whose performance is constrained by the indirect bandgap of silicon. This review paper highlights the advancements made in the field of integrated laser sources on the silicon photonics platform. These on-chip lasers are classified according to their gain media, including V semiconductors, III–V semiconductors, two-dimensional materials, and colloidal quantum dots. The methods of integrating these lasers onto silicon are also detailed in this review. Full article
(This article belongs to the Special Issue Novel Advances in Integrated Optics)
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10 pages, 3937 KB  
Communication
Bound States in the Continuum Empower Subwavelength Gratings for Refractometers in Visible
by Gunjan Yadav, Subrat Sahu, Ritesh Kumar and Rajan Jha
Photonics 2022, 9(5), 292; https://doi.org/10.3390/photonics9050292 - 25 Apr 2022
Cited by 16 | Viewed by 5015
Abstract
This paper describes a compact refractometer in visible with optical bounds states in the continuum (BICs) using silicon nitride (Si3N4) based sub-wavelength medium contrast gratings (MCGs). The proposed device is highly sensitive to different polarization states of light and [...] Read more.
This paper describes a compact refractometer in visible with optical bounds states in the continuum (BICs) using silicon nitride (Si3N4) based sub-wavelength medium contrast gratings (MCGs). The proposed device is highly sensitive to different polarization states of light and allows a wide dynamic range from 1.330 (aqueous environment) to 1.420 (biomolecules) monitoring, apart from its being thermally stable. The proposed sensor has a sensitivity of 363 nm/RIU for X polarized light and 137 nm/RIU for Y polarized light. The spectral characteristics have been obtained with a high angular resolution for the smaller angle of incidence, which confirms the BIC hybrid modes with good quality factors and enhanced field confinement. The device is based on a normal-to-the-surface optical launching strategy to achieve exceptional interrogation stability and alignment-free performance. This system can also be used in the CMOS photodetectors for on-chip label-free biosensing. Full article
(This article belongs to the Special Issue Integrated Optics and Devices)
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34 pages, 4360 KB  
Review
Optical Interconnects Finally Seeing the Light in Silicon Photonics: Past the Hype
by Hosam Mekawey, Mohamed Elsayed, Yehea Ismail and Mohamed A. Swillam
Nanomaterials 2022, 12(3), 485; https://doi.org/10.3390/nano12030485 - 29 Jan 2022
Cited by 51 | Viewed by 12672
Abstract
Electrical interconnects are becoming a bottleneck in the way towards meeting future performance requirements of integrated circuits. Moore’s law, which observes the doubling of the number of transistors in integrated circuits every couple of years, can no longer be maintained due to reaching [...] Read more.
Electrical interconnects are becoming a bottleneck in the way towards meeting future performance requirements of integrated circuits. Moore’s law, which observes the doubling of the number of transistors in integrated circuits every couple of years, can no longer be maintained due to reaching a physical barrier for scaling down the transistor’s size lower than 5 nm. Heading towards multi-core and many-core chips, to mitigate such a barrier and maintain Moore’s law in the future, is the solution being pursued today. However, such distributed nature requires a large interconnect network that is found to consume more than 80% of the microprocessor power. Optical interconnects represent one of the viable future alternatives that can resolve many of the challenges faced by electrical interconnects. However, reaching a maturity level in optical interconnects that would allow for the transition from electrical to optical interconnects for intra-chip and inter-chip communication is still facing several challenges. A review study is required to compare the recent developments in the optical interconnects with the performance requirements needed to reach the required maturity level for the transition to happen. This review paper dissects the optical interconnect system into its components and explains the foundational concepts behind the various passive and active components along with the performance metrics. The performance of different types of on-chip lasers, grating and edge couplers, modulators, and photodetectors are compared. The potential of a slot waveguide is investigated as a new foundation since it allows for guiding and confining light into low index regions of a few tens of nanometers in cross-section. Additionally, it can be tuned to optimize transmissions over 90° bends. Hence, high-density opto-electronic integrated circuits with optical interconnects reaching the dimensions of their electrical counterparts are becoming a possibility. The latest complete optical interconnect systems realized so far are reviewed as well. Full article
(This article belongs to the Special Issue Plasmonic Nanostructures and Their Applications)
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10 pages, 2889 KB  
Article
Semiconductor Nanowire Field-Effect Transistors as Sensitive Detectors in the Far-Infrared
by Mahdi Asgari, Leonardo Viti, Valentina Zannier, Lucia Sorba and Miriam Serena Vitiello
Nanomaterials 2021, 11(12), 3378; https://doi.org/10.3390/nano11123378 - 13 Dec 2021
Cited by 4 | Viewed by 3406
Abstract
Engineering detection dynamics in nanoscale receivers that operate in the far infrared (frequencies in the range 0.1–10 THz) is a challenging task that, however, can open intriguing perspectives for targeted applications in quantum science, biomedicine, space science, tomography, security, process and quality control. [...] Read more.
Engineering detection dynamics in nanoscale receivers that operate in the far infrared (frequencies in the range 0.1–10 THz) is a challenging task that, however, can open intriguing perspectives for targeted applications in quantum science, biomedicine, space science, tomography, security, process and quality control. Here, we exploited InAs nanowires (NWs) to engineer antenna-coupled THz photodetectors that operated as efficient bolometers or photo thermoelectric receivers at room temperature. We controlled the core detection mechanism by design, through the different architectures of an on-chip resonant antenna, or dynamically, by varying the NW carrier density through electrostatic gating. Noise equivalent powers as low as 670 pWHz−1/2 with 1 µs response time at 2.8 THz were reached. Full article
(This article belongs to the Special Issue Advances in Nanowire)
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40 pages, 7120 KB  
Review
A Review of Self-Seeded Germanium Nanowires: Synthesis, Growth Mechanisms and Potential Applications
by Adrià Garcia-Gil, Subhajit Biswas and Justin D. Holmes
Nanomaterials 2021, 11(8), 2002; https://doi.org/10.3390/nano11082002 - 4 Aug 2021
Cited by 15 | Viewed by 6620
Abstract
Ge nanowires are playing a big role in the development of new functional microelectronic modules, such as gate-all-around field-effect transistor devices, on-chip lasers and photodetectors. The widely used three-phase bottom-up growth method utilising a foreign catalyst metal or metalloid is by far the [...] Read more.
Ge nanowires are playing a big role in the development of new functional microelectronic modules, such as gate-all-around field-effect transistor devices, on-chip lasers and photodetectors. The widely used three-phase bottom-up growth method utilising a foreign catalyst metal or metalloid is by far the most popular for Ge nanowire growth. However, to fully utilise the potential of Ge nanowires, it is important to explore and understand alternative and functional growth paradigms such as self-seeded nanowire growth, where nanowire growth is usually directed by the in situ-formed catalysts of the growth material, i.e., Ge in this case. Additionally, it is important to understand how the self-seeded nanowires can benefit the device application of nanomaterials as the additional metal seeding can influence electron and phonon transport, and the electronic band structure in the nanomaterials. Here, we review recent advances in the growth and application of self-seeded Ge and Ge-based binary alloy (GeSn) nanowires. Different fabrication methods for growing self-seeded Ge nanowires are delineated and correlated with metal seeded growth. This review also highlights the requirement and advantage of self-seeded growth approach for Ge nanomaterials in the potential applications in energy storage and nanoelectronic devices. Full article
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16 pages, 6647 KB  
Article
Design of Differential Variable-Gain Transimpedance Amplifier in 0.18 µm SiGe BiCMOS
by Samuel B.S. Lee, Hang Liu, Kiat Seng Yeo, Jer-Ming Chen and Xiaopeng Yu
Electronics 2020, 9(7), 1058; https://doi.org/10.3390/electronics9071058 - 27 Jun 2020
Cited by 6 | Viewed by 4837
Abstract
This paper presents two new inductorless differential variable-gain transimpedance amplifiers (DVGTIA) with voltage bias controlled variable gain designed in TowerJazz’s 0.18 µm SiGe BiCMOS technology (using CMOS transistors only). Both consist of a modified differential cross-coupled regulated cascode preamplifier stage and a cascaded [...] Read more.
This paper presents two new inductorless differential variable-gain transimpedance amplifiers (DVGTIA) with voltage bias controlled variable gain designed in TowerJazz’s 0.18 µm SiGe BiCMOS technology (using CMOS transistors only). Both consist of a modified differential cross-coupled regulated cascode preamplifier stage and a cascaded amplifier stage with bias-controlled gain-variation and third-order interleaving feedback. The designs have wide measured transimpedance gain ranges of 24.5–60.6 dBΩ and 27.8–62.8 dBΩ with bandwidth above 6.42 GHz and 5.22 GHz for DVGTIA designs 1 and 2 respectively. The core power consumptions are 30.7 mW and 27.5 mW from a 1.8 V supply and the input referred noise currents are 10.3 pA/√Hz and 21.7 pA/√Hz. The DVGTIA designs 1 and 2 have a dynamic range of 40.4 µA to 3 mA and 76.8 µA to 2.7 mA making both suitable for real photodetectors with an on-chip photodetector capacitive load of 250 fF. Both designs are compact with a core area of 100 µm × 85 µm. Full article
(This article belongs to the Special Issue Millimeter-Wave Integrated Circuits and Systems for 5G Applications)
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18 pages, 2457 KB  
Article
Photodetector with Controlled Relocation of Carrier Density Peaks: Concept and Numerical Simulation
by Ivan Pisarenko and Eugeny Ryndin
Photonics 2020, 7(1), 21; https://doi.org/10.3390/photonics7010021 - 5 Mar 2020
Cited by 5 | Viewed by 3532
Abstract
Modern electronics faces the degradation of metal interconnection performance in integrated circuits with nanoscale feature dimensions of transistors. The application of constructively and technologically integrated optical links instead of metal wires is a promising way of the problem solution. Previously, we proposed the [...] Read more.
Modern electronics faces the degradation of metal interconnection performance in integrated circuits with nanoscale feature dimensions of transistors. The application of constructively and technologically integrated optical links instead of metal wires is a promising way of the problem solution. Previously, we proposed the advanced design of an on-chip injection laser with an AIIIBV nanoheterostructure, and a functionally integrated optical modulator. To implement the efficient laser-modulator-based optical interconnections, technologically compatible photodetectors with subpicosecond response time and sufficient sensitivity are required. In this paper, we introduce the concept of a novel high-speed photodetector with controlled relocation of carrier density peaks. The device includes a traditional p-i-n photosensitive junction and an orthogonally oriented control heterostructure. The transverse electric field displaces the peaks of electron and hole densities into the regions with low carrier mobilities and lifetimes during the back edge of an optical pulse. This relocation results in the fast decline of photocurrent that does not depend on the longitudinal transport of electrons and holes. We develop a combined numerical model based on the Schrodinger-Poisson equation system to estimate the response time of the photodetector. According to the simulation results, the steep part of the photocurrent back edge has a duration of about 0.1 ps. Full article
(This article belongs to the Section Optoelectronics and Optical Materials)
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