Search Results (38)

The design, fabrication, and characterization of a highly transparent and flexible monopole antenna optimized for the 3–6 GHz frequency band are presented in this study. In traditional Transparent Conductive Oxide (TCO) designs, there is always a trade-off between RF efficiency and optical transparency. Therefore, an Aerosol Jet^® 5X system was used to directly print a silver nanoparticle mesh onto a 50 μm colorless polyimide (PI) substrate. Using this fabrication method, a durable structure was obtained that exhibits reliable electrical and mechanical performance, achieving 85% optical transmittance in the visible spectrum and a gain of −2.5 dBi. To evaluate the flexibility and compatibility of the antenna, it was bent over a cylindrical surface and integrated with a commercial solar panel in both simulation and experimental environments. The results demonstrate that the impedance matching and radiation characteristics remain stable under bending conditions, with no critical decrease observed in solar energy harvesting. Consequently, this design has strong potential as a solution for energy-autonomous Internet of Things systems, smart windows, and CubeSat applications. Full article

This study presents colorless polyimides (PIs) suitable for use as plastic substrates in flexible displays, designed to be compatible with controlled soft adhesion and easy delamination (temporary adhesion) processes. For this purpose, we focused on a PI system derived from norbornane-2-spiro-α-cyclopentanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic dianhydride (CpODA) and 2,2′-bis(trifluoromethyl)benzidine (TFMB). This system was selected with the aim of exhibiting excellent optical transparency and low linear coefficient of thermal expansion (CTE) properties. However, fabricating this PI film via the conventional two-step process was challenging because of crack formation. In contrast, modified one-pot polymerization at 200 °C using a combined catalyst resulted in a homogeneous solution of PI with an exceptionally high molecular weight, yielding a flexible cast film. The solubility of PI plays a crucial role in its success. This study delves into the mechanism behind the significant catalytic effect on enhancing molecular weight. The CpODA/TFMB PI cast film simultaneously achieved very high optical transparency, an extremely high glass transition temperature (T_g = 411 °C), a significantly low linear coefficient of thermal expansion (CTE = 16.7 ppm/K), and sufficient film toughness, despite the trade-off between low CTE and high film toughness. The CpODA/TFMB system was modified by copolymerization with minor contents of another cycloaliphatic tetracarboxylic dianhydride, 5,5′-(1,4-phenylene)-exo-bis(hexahydro-4,7-methanoisobenzofuran-cis-exo-1,3-dione) (BzDAxx). This approach was effective in improving the film toughness without sacrificing the low CTE and other target properties. The peel strengths (σ_peel) of laminates comprising surface-modified glass substrates and various colorless PI films were measured to evaluate the compatibility with the temporary adhesion process. Most colorless PI films studied were found to be incompatible. Additionally, no correlation between σ_peel and PI structure was observed, making it challenging to identify the structural factors influencing σ_peel control. Surprisingly, a strong correlation was observed between σ_peel and CTE of the PI films, suggesting that the observed solid–solid lamination is closely linked to the unexpectedly high surface mobility of the PI films. The laminate using CpODA(90);BzDAxx(10)/TFMB copolymer exhibited suitable adhesion strength for the temporary adhesion process, while meeting other target properties. The modified one-pot polymerization method significantly contributed to the development of colorless PIs suitable for plastic substrates. Full article

Fluorinated polyimide (FPI), renowned for its exceptional low-dielectric properties, colorless transparency, high-temperature resistance, and flexibility, has emerged as an ideal material for addressing challenges in 5G/6G high-frequency signal transmission and flexible electronic substrates. Nevertheless, the structure–property relationship between molecular architectures and the dielectric characteristics of FPI films remains insufficiently understood, necessitating urgent elucidation of the underlying mechanisms. In this study, a diamine monomer containing bis-amide bonds, 4-amino-N-{4-[(4-aminobenzoyl)amino]phenyl}benzamide (PABA), was synthesized. Subsequently, six FPI films (FPAIs, FPEIs, and FPEsIs) with distinct structural features were prepared through homopolymerization of PABA and five other diamines (containing amide bonds, ether, and ester groups) with fluorinated dianhydride (6FDA). Systematic characterization of thermal, mechanical, optical, and dielectric properties revealed that these films exhibit excellent thermal stability (T_g: 296–388 °C), mechanical strength (σ: 152.5–248.1 MPa, E: 2.1–3.4 GPa), and optical transparency (T_{550 nm}: 82–86%). Notably, they demonstrated a low dielectric constant (D_k as low as 2.8) and dielectric loss (D_f down to 0.002) under both low- and high-frequency electric fields. Furthermore, molecular dynamics simulations and quantum chemical were employed to calculate critical physical parameters and HOMO–LUMO energy levels of the six FPIs. This computational analysis provides deeper insights into the structure–performance correlations governing dielectric behavior and optical transparency in FPIs. The findings establish valuable theoretical guidance for designing advanced PI films with tailored dielectric properties and high transparency. Full article

A mechanically robust flexible transparent conductor with high thermal and chemical stability was fabricated from welded silver nanowire networks (w-Ag-NWs) sandwiched between multilayer graphene (MLG) and polyimide (PI) films. By modifying the gas flow dynamics and surface chemistry of the Cu surface during graphene growth, a highly crystalline and uniform MLG film was obtained on the Cu foil, which was then directly coated on the Ag-NW networks to serve as a barrier material. It was found that the highly crystalline layers in the MLG film compensate for structural defects, thus forming a perfect barrier film to shield Ag NWs from oxidation and sulfurization. MLG/w-Ag-NW composites were then embedded into the surface of a transparent and colorless PI thin film by spin-coating. This allowed the MLG/w-Ag-NW/PI composite to retain its original structural integrity due to the intrinsic physical and chemical properties of PI, which also served effectively as a binder. In view of its unique sandwich structure and the chemical welding of the Ag NWs, the flexible substrate-cum-electrode had an average sheet resistance of ≈34 Ω/sq and a transmittance of ≈91% in the visible range, and also showed excellent stability against high-temperature annealing and sulfurization. Full article

Traditional polyimides have highly conjugated structures, causing significant coloration under visible light. Fluorinated colorless polyimides, known for their light weight and excellent optical properties, are considered ideal for future aerospace optical lenses. However, their lifespan in low Earth orbit is severely limited by high-density atomic oxygen (AO) erosion, and the degradation behavior of fluorinated polyimides under AO exposure is not well understood. This study uses reactive molecular dynamics simulations to model two fluorinated polyimides, PMDA-TFMB and 6FDA-TFMB, with different fluorine contents, to explore their degradation mechanisms under varying AO concentrations. The results indicate that 6FDA-TFMB has slightly better resistance to erosion than PMDA-TFMB, mainly due to the enhanced chemical stability from its -CF₃ groups. As AO concentration increases, widespread degradation of the polyimides occurs, with AO-induced cleavage and temperature-driven pyrolysis happening simultaneously, producing CO and OH as the main degradation products. This study uncovers the molecular-level degradation mechanisms of fluorinated polyimides, offering new insights for the design of AO erosion protection systems. Full article

In order to prepare polyimide (PI) films with a low dielectric constant and excellent comprehensive performance, a two-step method was employed in this study to integrate β-cyclodextrin into a semi-aromatic fluorine-containing polyimide ternary system. By introducing trifluoromethyl groups to reduce the dielectric constant, the dielectric constant was further reduced to 2.55 at 10 MHz. Simultaneously, the film exhibited noteworthy thermal stability (a glass transition temperature exceeding 300 °C) and a high coefficient of thermal expansion. The material also demonstrated outstanding mechanical properties, boasting a strength of 122 MPa and a modulus of 2.2 GPa, along with high optical transparency (transmittance reaching up to 89% at 450 nm). Moreover, the inherent high transparency of colorless polyimide (CPI) combined with good stretchability contributed to the attainment of a low dielectric constant. This strategic approach not only opens up new opportunities for novel electroactive polymers but also holds potential applications in flexible displays, circuit printing, and chip packaging. Full article

Colorless and transparent polyimide (CPI) films with good atomic oxygen (AO) resistance and high thermal endurance are highly required in low earth orbit (LEO) space exploration. Conventional CPI films based on fluoro-containing 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) have been widely used in space applications. However, the AO erosion yields and glass transition temperatures (T_g) of the 6FDA-based CPI films have to be modified in order to meet the severe serving environments. In the current work, novel CPI films based on a multi-ring fluoro-containing 9,9-bis(trifluoromethyl)xanthene-2,3,6,7-tetracarboxylicdianhydride (6FCDA) monomer were developed. In order to enhance the AO resistance of the derived CPI film, a phosphorus-containing aromatic diamine, 2,5-bis[(4-aminophenoxy)phenyl]diphenylphosphine oxide (BADPO) was used to polymerize with the dianhydride to create the organo-soluble resin. Then, two phosphorus-containing CPI films (PPI), including PPI-1 (6FDA-BADPO) and PPI-2 (6FCDA-BADPO) were prepared by thermally curing of the PPI solutions at elevated temperatures. The PPI films maintained good optical transparency with transmittance values over 80% at a wavelength of 450 nm. PPI-2 exhibited a T_g value of 311.0 °C by differential scanning calorimetry (DSC) measurement, which was 46.7 °C higher than that of the PPI-1 counterpart (T_g = 264.3 °C). In addition, the PPI-2 film showed a coefficient of linear thermal expansion (CTE) value of 41.7 × 10⁻⁶/K in the range of 50~250 °C, which was apparently lower than that of the PPI-1 sample (CTE = 49.2 × 10⁻⁶/K). Lastly, both of the two PPI films exhibited good AO resistance with the erosion yields (E_y) of 6.99 × 10⁻²⁵ cm³/atom for PPI-1 and 7.23 × 10⁻²⁵ cm³/atom for PPI-2 at an exposure flux of 5.0 × 10²⁰ atoms/cm². The E_y values of the current PPI films were obviously lower than that of the standard polyimide (PI) film based on pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) (E_y = 3.0 × 10⁻²⁴ cm³/atom). Full article

With the demand for healthy life and the great advancement of flexible electronics, flexible sensors are playing an irreplaceably important role in healthcare monitoring, wearable devices, clinic treatment, and so on. In particular, the design and application of polyimide (PI)-based sensors are emerging swiftly. However, the tremendous potential of PI in sensors is not deeply understood. This review focuses on recent studies in advanced applications of PI in flexible sensors, including PI nanofibers prepared by electrospinning as flexible substrates, PI aerogels as friction layers in triboelectric nanogenerator (TENG), PI films as sensitive layers based on fiber Bragg grating (FBG) in relative humidity (RH) sensors, photosensitive PI (PSPI) as sacrificial layers, and more. The simple laser-induced graphene (LIG) technique is also introduced in the application of PI graphitization to graphene. Finally, the prospect of PIs in the field of electronics is proposed in the review. Full article

A tert-butyldiphenylsilyl-containing polyimide (PI-OSi) has been established as a colorimetric and ratiometric chemosensor for rapid detecting fluoride ions (F⁻). The UV-vis absorbance ratio value (A₃₂₂/A₂₈₈) of PI-OSi in a DMF solution displays a wide linear range change to F⁻ concentrations with a detection limit (DL) value of 2.13 μM. Additionally, adding incremental amounts of F⁻ to a DMF solution of PI-OSi shows an immediate color change to yellow and finally to green from colorless. More interestingly, the resulting PI-OSi plus F⁻ system (PI-OSi·F) could detect trace water in DMF. The A₂₉₂/A₃₂₂ value of PI-OSi·F almost linearly increases with low water content, which suggests convenient quantitative sensing of trace water content in DMF. The DL value of PI-OSi·F for sensing water in DMF is determined to be 0.00149% (v/v). The solution color of PI-OSi·F returns to colorless when the water content increases, indicating that PI-OSi·F can conveniently estimate water content in DMF by naked-eye detection. The detection mechanisms confirmed by an ¹H NMR study and a DFT calculation involve a F⁻-induced desilylation reaction of PI-OSi to form phenolate anion followed by protonation with trace water. Finally, PI-OSi film was fabricated for the colorimetric detection of F⁻ and water in CH₃CN. Full article

A novel approach to fabricating a transparent and flexible one-transistor–one-diode (1T-1D) image sensor array on a flexible colorless polyimide (CPI) film substrate is successfully demonstrated with laser lift-off (LLO) techniques. Leveraging transparent indium tin oxide (ITO) electrodes and amorphous indium gallium zinc oxide (a-IGZO) channel-based thin-film transistor (TFT) backplanes, vertically stacked p-i-n hydrogenated amorphous silicon (a-Si:H) photodiodes (PDs) utilizing a low-temperature (<90 °C) deposition process are integrated with a densely packed 14 × 14 pixel array. The low-temperature-processed a-Si:H photodiodes show reasonable performance with responsivity and detectivity for 31.43 mA/W and 3.0 × 10¹⁰ Jones (biased at −1 V) at a wavelength of 470 nm, respectively. The good mechanical durability and robustness of the flexible image sensor arrays enable them to be attached to a curved surface with bending radii of 20, 15, 10, and 5 mm and 1000 bending cycles, respectively. These studies show the significant promise of utilizing highly flexible and rollable active-matrix technology for the purpose of dynamically sensing optical signals in spatial applications. Full article

In this paper, novel colorless polyimides (PIs) derived from 5,5′-bis(2,3-norbornanedicarboxylic anhydride) (BNBDA) were presented. The results of single-crystal X-ray structural analysis using a BNBDA-based model compound suggested that it had a unique steric structure with high structural linearity. Therefore, BNBDA is expected to afford new colorless PI films with an extremely high glass transition temperature (T_g) and a low linear coefficient of thermal expansion (CTE) when combined with aromatic diamines with rigid and linear structures (typically, 2,2′-bis(trifluoromethyl)benzidine (TFMB)). However, the polyaddition of BNBDA and TFMB did not form a PI precursor with a sufficiently high molecular weight; consequently, the formation of a flexible, free-standing PI film via the two-step process was inhibited because of its brittleness. One-pot polycondensation was also unsuccessful in this system because of precipitation during the reaction, probably owing to the poor solubility of the initially yielded BNBDA/TFMB imide oligomers. The combinations of (1) the structural modification of the BNBDA/TFMB system, (2) the application of a modified one-pot process, in which the conditions of the temperature-rising profile, solvents, azeotropic agent, catalysts, and reactor were refined, and (3) the optimization of the film preparation conditions overcame the trade-off between low CTE and high film toughness and afforded unprecedented PI films with well-balanced properties, simultaneously achieving excellent optical transparency, extremely high T_g, sufficiently high thermal stability, low CTE, high toughness, relatively low water uptake, and excellent solution processability. Full article

Colorless polyimide (PI)-based flexible cover windows are a critical component of flexible electronics to protect devices from unwanted chemical and mechanical damage. The integration of flexible colorless PI-based windows into electronics applications is limited by the embrittlement of some colorless PI films when they are coated with hard coats. Here, we investigate the embrittlement mechanism of hard-coated colorless PI films and the role of interlayers in toughening the colorless PI-based cover windows for flexible electronics applications. A fracture mechanics approach combined with finite element analysis (FEA) models is employed to compute fracture strain, ε_c, for different crack cases in the bilayer (hard coated colorless PI) and trilayer (with an additional interlayer) cover windows. For the model inputs and validation, the material properties of the cover windows are characterized. We show that the embrittlement is attributed to the fracture behavior of the cover windows, and placing a ductile interlayer increases the ε_c of colorless PI films. Using the fracture analysis as a design guide, we fabricate a trilayer cover window with an acrylic thermoset interlayer and demonstrate an improvement of the ε_c of the colorless PI cover window by ~42%. We believe our analysis provides insights into design guides for mechanically robust cover windows using colorless PI films and flexible HCs for emerging flexible electronics. Full article

Polyimide (PI) optical films with high glass transition temperatures (high-T_g), high optical transparency, and low optical retardations (low-R_th) are highly desired in advanced optoelectronic applications. However, the standard PI films usually suffer from deep colors, high optical anisotropies and limited T_g values. In the current work, a series of semi-alicyclic colorless and transparent PI (CPI) films were developed from hydrogenated pyromellitic dianhydride stereoisomers, 1S,2R,4S,5R-hydrogenated pyromellitic dianhydride and 1R,2S,4S,5R-hydrogenated pyromellitic dianhydride, and fluorene-containing diamines, including 9,9-bis(4-aminophenyl)fluorene and 9,9-bis(3-fluoro-4-aminophenyl)fluorene, respectively. The derived CPI films showed T_g values higher than 420 °C according to differential scanning calorimetry measurements. In addition, the fluorene-based CPI film showed optical transmittances higher than 80% at the wavelength of 400 nm, with yellow indices in the range of 0.60~1.01 and haze values below 3.0%. The CPI films showed average refractive indices from 1.5407 to 1.6309, extremely low birefringence at the level of minus fourth power of ten, and further exhibited quite low optical retardations below 10 nm. Full article

High-resolution nanotransfer printing (nTP) technologies have attracted a tremendous amount of attention due to their excellent patternability, high productivity, and cost-effectiveness. However, there is still a need to develop low-cost mold manufacturing methods, because most nTP techniques generally require the use of patterned molds fabricated by high-cost lithography technology. Here, we introduce a novel nTP strategy that uses imprinted metal molds to serve as an alternative to a Si stamp in the transfer printing process. We present a method by which to fabricate rigid surface-patterned metallic molds (Zn, Al, and Ni) based on the process of direct extreme-pressure imprint lithography (EPIL). We also demonstrate the nanoscale pattern formation of functional materials, in this case Au, TiO₂, and GST, onto diverse surfaces of SiO₂/Si, polished metal, and slippery glass by the versatile nTP method using the imprinted metallic molds with nanopatterns. Furthermore, we show the patterning results of nanoporous crossbar arrays on colorless polyimide (CPI) by a repeated nTP process. We expect that this combined nanopatterning method of EPIL and nTP processes will be extendable to the fabrication of various nanodevices with complex circuits based on micro/nanostructures. Full article

Various lithography techniques have been widely used for the fabrication of next-generation device applications. Micro/nanoscale pattern structures formed by lithographic methods significantly improve the performance capabilities of the devices. Here, we introduce a novel method that combines the patterning of nanotransfer printing (nTP) and laser micromachining to fabricate multiscale pattern structures on a wide range of scales. Prior to the formation of various nano-in-micro-in-millimeter (NMM) patterns, the nTP process is employed to obtain periodic nanoscale patterns on the target substrates. Then, an optimum laser-based patterning that effectively engraves various nanopatterned surfaces, in this case, spin-cast soft polymer film, rigid polymer film, a stainless still plate, and a Si substrate, is established. We demonstrate the formation of well-defined square and dot-shaped multiscale NMM-patterned structures by the combined patterning method of nTP and laser processes. Furthermore, we present the generation of unusual text-shaped NMM pattern structures on colorless polyimide (CPI) film, showing optically excellent rainbow luminescence based on the configuration of multiscale patterns from nanoscale to milliscale. We expect that this combined patterning strategy will be extendable to other nano-to-micro fabrication processes for application to various nano/microdevices with complex multiscale pattern geometries. Full article