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Polymers
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Advances in High-Performance Polymer Materials, 2nd Edition
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Advances in High-Performance Polymer Materials, 2nd Edition

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 513

Special Issue Editor

Dr. Xingfeng Lei

E-Mail Website
Guest Editor
School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Interests: polyimide; membrane; polyamide; epoxy resin; low Earth orbit; gas separation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

As an important branch of materials, high-performance polymer materials play an indispensable role in daily lives of humans, microelectronics, semiconductors, automobile industry, aerospace applications, sustainable development, etc. However, achieving a desirable balance between functionalities and physical properties for high-performance polymers remains a great challenge from a molecular design perspective.

This Special Issue aims to collect recent progress, achievements, breakthroughs, challenges, and future directions of different types of high-performance polymers for various applications. Studies on high-performance polymer material fabrication methods, characterization techniques, simulations, and evaluation of polymers for specific applications are also encouraged.

Manuscripts are invited on all topics related to high-performance polymer materials for gas separation, space applications, electromagnetic wave treatment, microelectronics, semiconductors, automobile industry, sustainable development, etc., including, but not limited to, the following:

  1. Composite matrices;
  2. Coatings;
  3. Adhesives;
  4. Fibers;
  5. Films and membranes;
  6. Polymer composites and hybrid polymers;
  7. Aromatic polymers;
  8. Aromatic heterocyclic polymers;
  9. Fluoropolymers and siloxanes;
  10. Polymer materials or polymer composites for potential applications in aerospace, chemicals, energy electronics, and automobile industries.

Papers from polymer scientists, organic chemists, chemical engineers, materials scientists, processing technologists, and physicists are welcome. I look forward to your submissions.

Dr. Xingfeng Lei
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • polyimide space application
  • heat resistance
  • high impact resistance
  • polymer composites
  • hybrid polymers
  • engineering plastics
  • electromagnetic shielding
  • wave-transparent

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Published Papers (2 papers)

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Research

22 pages, 10839 KiB  
Article
A Parametric Study of Epoxy-Bonded CF/QF-BMI Composite Joints Using a Method Combining RBF Neural Networks and NSGA-II Algorithm
by Xiaobo Yang, Xingyu Zou, Jingyu Zhang, Ruiqing Guo, He Xiang, Lihua Zhan and Xintong Wu
Polymers 2025, 17(13), 1769; https://doi.org/10.3390/polym17131769 - 26 Jun 2025
Abstract
The epoxy-bonded joint between carbon-fiber-reinforced bismaleimide (CF-BMI) and quartz-fiber-reinforced bismaleimide (QF-BMI) composites can meet the structure–function integration requirements of next-generation aviation equipment, and the structural design of their bonding zones directly affects their service performance. Hence, in this study, the carbon-fiber-reinforced bismaleimide composite [...] Read more.
The epoxy-bonded joint between carbon-fiber-reinforced bismaleimide (CF-BMI) and quartz-fiber-reinforced bismaleimide (QF-BMI) composites can meet the structure–function integration requirements of next-generation aviation equipment, and the structural design of their bonding zones directly affects their service performance. Hence, in this study, the carbon-fiber-reinforced bismaleimide composite ZT7H/5429, the woven quartz-fiber-reinforced bismaleimide composite QW280/5429, and epoxy adhesive film J-116 were used as research materials to investigate the influence of the bonding area size on the mechanical properties, and this study proposes a novel design methodology combining radial basis function (RBF) neuron machine learning with the NSGA-II algorithm to enhance the mechanical properties of the bonded components. First, a finite element simulation model considering 3D hashin criteria and cohesion was established, and its accuracy was verified with experiments. Second, the RBF neuron model was trained using the finite element tensile strength and shear strength data from various adhesive layer parameter combinations. Then, the multi-objective parameter optimization of the surrogate model was accomplished through the NSGA-II algorithm. The research results demonstrate a high consistency between the finite element simulation results and experimental outcomes for the epoxy-bonded CF/QF-BMI composite joint. The stress distribution of the adhesive layers is similar under the different structural parameters of adhesive films, though the varying structural dimensions of the adhesive layers lead to distinct failure modes. The trained RBF neuron model controls the prediction error within 2.21%, accurately reflecting the service performance under various adhesive layer parameters. The optimized epoxy-bonded CF/QF-BMI composite joint exhibits 16.1% and 11.2% increases in the tensile strength and shear strength, respectively. Full article
(This article belongs to the Special Issue Advances in High-Performance Polymer Materials, 2nd Edition)
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17 pages, 4826 KiB  
Article
Effect of Diamine Monomers with Varied Backbone Structures on Dielectric and Other Comprehensive Properties of Fluorinated Polyimide Films
by Wenhao Xu, Xiaojie He, Yu Zhou, Lan Jiang, Weiyou Yang, Qinghua Lu and Peng Xiao
Polymers 2025, 17(11), 1505; https://doi.org/10.3390/polym17111505 - 28 May 2025
Viewed by 368
Abstract
Fluorinated polyimide (FPI), renowned for its exceptional low-dielectric properties, colorless transparency, high-temperature resistance, and flexibility, has emerged as an ideal material for addressing challenges in 5G/6G high-frequency signal transmission and flexible electronic substrates. Nevertheless, the structure–property relationship between molecular architectures and the dielectric [...] Read more.
Fluorinated polyimide (FPI), renowned for its exceptional low-dielectric properties, colorless transparency, high-temperature resistance, and flexibility, has emerged as an ideal material for addressing challenges in 5G/6G high-frequency signal transmission and flexible electronic substrates. Nevertheless, the structure–property relationship between molecular architectures and the dielectric characteristics of FPI films remains insufficiently understood, necessitating urgent elucidation of the underlying mechanisms. In this study, a diamine monomer containing bis-amide bonds, 4-amino-N-{4-[(4-aminobenzoyl)amino]phenyl}benzamide (PABA), was synthesized. Subsequently, six FPI films (FPAIs, FPEIs, and FPEsIs) with distinct structural features were prepared through homopolymerization of PABA and five other diamines (containing amide bonds, ether, and ester groups) with fluorinated dianhydride (6FDA). Systematic characterization of thermal, mechanical, optical, and dielectric properties revealed that these films exhibit excellent thermal stability (Tg: 296–388 °C), mechanical strength (σ: 152.5–248.1 MPa, E: 2.1–3.4 GPa), and optical transparency (T550 nm: 82–86%). Notably, they demonstrated a low dielectric constant (Dk as low as 2.8) and dielectric loss (Df down to 0.002) under both low- and high-frequency electric fields. Furthermore, molecular dynamics simulations and quantum chemical were employed to calculate critical physical parameters and HOMO–LUMO energy levels of the six FPIs. This computational analysis provides deeper insights into the structure–performance correlations governing dielectric behavior and optical transparency in FPIs. The findings establish valuable theoretical guidance for designing advanced PI films with tailored dielectric properties and high transparency. Full article
(This article belongs to the Special Issue Advances in High-Performance Polymer Materials, 2nd Edition)
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