Search Results (15)

In mobile dynamic random access memory (DRAM) receivers, the data strobe complement (DQS_c) and data strobe true (DQS_t) signals must be maintained at high and low voltage levels in the write data strobe off (WDQS_OFF) mode. Therefore, we developed a voltage regulation circuit to optimize the differential voltage signals of DQS_c and DQS_t, ensuring a high voltage level above 0.9 V and a low voltage level below 0.3 V. Experimental results showed that the circuit stably maintained DQS_c above 0.9 V and DQS_t below 0.3 V before the write preamble time (tWPRE) and in WDQS_OFF mode. This configuration effectively prevents unintended activation in the mobile DRAM DQS input receiver. Full article

A simple-to-implement and easy-to-integrate strategy for image processing is proposed in this paper, which effectively and efficiently optimizes the power consumption of both DRAM and SRAM. Since the power consumption of DRAM is proportional to the number of bit-‘1’s and the power consumption of SRAM is linear relative to the flip probability, the proposed strategy first drops and encodes the image to minimize the number of bit-‘1’s per pixel. The processed data are then decoded, with the flag bit set to “1” to reduce the flip probability. In the experimental simulations, the power consumption of DRAM was reduced by up to 64.88%, while that of SRAM was reduced by up to 62.01%, with negligible circuit costs. In image display applications, the proposed strategy effectively compensates for certain errors in the JPEG system. In image classification tasks, there was only a 1–2% reduction in test set accuracy, demonstrating the superiority of truncation compensation. Additionally, the performance of the robot was negligibly affected by the approximate strategy, which shows the significant potential of the proposed strategy in the field of artificial intelligence and robotics. Full article

A multi-layer stacked Dynamic Random Access Memory (DRAM) platform is introduced to address the memory wall issue. This platform features high-density vertical interconnects established between DRAM units for high-capacity memory and logic units for computation, utilizing Wafer-on-Wafer (WoW) hybrid bonding and mini Through-Silicon Via (TSV) technologies. This 3DIC architecture includes commercial DRAM, logic, and 3DIC manufacturing processes. Their design documents typically come from different foundries, presenting challenges for signal integrity design and analysis. This paper establishes a lumped circuit based on 3DIC physical structure and calculates all values of the lumped elements in the circuit model with the transmission line model. A Cross-Process Signal Integrity Analysis (CPSIA) method is introduced, which integrates three different manufacturing processes by modeling vertical stacking cells and connecting DRAM and logic netlists in one simulation environment. In combination with the dedicated buffer driving method, the CPSIA method is used to analyze 3DIC impacts. Simulation results show that the timing uncertainty introduced by 3DIC crosstalk ranges from 31 ps to 62 ps. This analysis result explains the stable slight variation in the maximum frequency observed in vertically stacked memory arrays from different DRAM layers in the physical testing results, demonstrating the effectiveness of this CPSIA method. Full article

Using DNA as the next-generation medium for data storage offers unparalleled advantages in terms of data density, storage duration, and power consumption as compared to existing data storage technologies. To meet the high-speed data writing requirements in DNA data storage, this paper proposes a novel design for an ultra-high-density and high-throughput DNA synthesis platform. The presented design mainly leverages two functional modules: a dynamic random-access memory (DRAM)-like integrated circuit (IC) responsible for electrode addressing and voltage supply, and the static droplet array (SDA)-based microfluidic structure to eliminate any reaction species diffusion concern in electrochemical DNA synthesis. Through theoretical analysis and simulation studies, we validate the effective addressing of 10 million electrodes and stable, adjustable voltage supply by the integrated circuit. We also demonstrate a reaction unit size down to 3.16 × 3.16 μm², equivalent to 10 million/cm², that can rapidly and stably generate static droplets at each site, effectively constraining proton diffusion. Finally, we conducted a synthesis cycle experiment by incorporating fluorescent beacons on a microfabricated electrode array to examine the feasibility of our design. Full article

This paper introduces an n-type pseudo-static gain cell (PS-nGC) embedded within dynamic random-access memory (eDRAM) for high-speed processing-in-memory (PIM) applications. The PS-nGC leverages a two-transistor (2T) gain cell and employs an n-type pseudo-static leakage compensation (n-type PSLC) circuit to significantly extend the eDRAM’s retention time. The implementation of a homogeneous NMOS-based 2T gain cell not only reduces write access times but also benefits from a boosted write wordline technique. In a comparison with the previous pseudo-static gain cell design, the proposed PS-nGC exhibits improvements in write and read access times, achieving 3.27 times and 1.81 times reductions in write access time and read access time, respectively. Furthermore, the PS-nGC demonstrates versatility by accommodating a wide supply voltage range, spanning from 0.7 to 1.2 V, while maintaining an operating frequency of 667 MHz. Fabricated using a 28 nm complementary metal oxide semiconductor (CMOS) process, the prototype features an efficient active area, occupying a mere 0.284 µm² per bitcell for the 4 kb eDRAM macro. Under various operational conditions, including different processes, voltages, and temperatures, the proposed PS-nGC of eDRAM consistently provides speedy and reliable read and write operations. Full article

With the significant growth in modern computing systems, dynamic random access memory (DRAM) has become a power/performance/energy bottleneck in data-intensive applications. Both the power management mechanism and downscaling method face decreasing performance or difficulties in the smaller footprint of the DRAM capacitor. Since optimizing the circuit of sense amplifier (SA) is an efficient method to reduce energy consumption, we propose two single bitline load sense amplifier (SBLSA) circuits, i.e., a redundant voltage discharged SBLSA (RVD-SBLSA) circuit and a bit aware SBLSA (BA-SBLSA) circuit, to improve conventional and single bitline write (SBW) circuits. The RVD-SBLSA circuit utilizes a clamp diode to discharge redundant voltage over VDD/2 with an additional working stage. The BA-SBLSA circuit abandons the single bitline load (SBL) circuit during read and write ‘1’ operations. The RVD-SBLSA circuit can offer the lowest total energy consumption, and the BA-SBLSA circuit can make a better balance between energy consumption and latency. Through the simulation results, the proposed circuits can efficiently reduce energy consumption or balance energy consumption and latency and show huge potentials in very large-scale integrated circuits. Full article

In response to the increasing manufacturing complexity/cost in maintaining DRAM advancements through traditional scaling, three-dimensional integrated circuits (3D ICs) and 2.5-dimensional ICs with Si interposers are known as promising candidates to overcome these challenges due to their advantages of low power, small form factor, high density, and high bandwidth. In this work, we present a true process-heterogeneous stacked embedded DRAM (SeDRAM) using hybrid bonding 3D integration process, achieving high bandwidth of 34 GBps/Gbit and high energy efficiency of 0.88 pJ/bit. Moreover, the critical factors of the SeDRAM design are presented (e.g., the low data movement energy, high-density physical interface, simplified protocol definition, process compatibility, density extensibility, and hybrid bonding connection fast test by DFT (design for test). Our results and design methodology have paved the way to realize applications of hybrid bonding to high bandwidth and energy efficiency DRAM. More importantly, the SeDRAM solution can also support the maximum storage density of 48 Gbit and the bandwidth capability of TBps. It can greatly alleviate the “memory wall” problem and thus improve its competitiveness in near-memory computing/computing-in-memory fields. Full article

In this work we report on the improvement in cold temperature characteristics of PMOSFETs and inverter circuits by removing the plasma-damaged layer of the source/drain contacts. We removed the plasma-induced damage on the Si using a simple in situ Si soft treatment technique. We found by transmission electron microscope (TEM) analysis that the damaged amorphous layer reduced from 52 Å to 42 Å and 35 Å with a treatment time of 10 and 20 s, respectively. As a result, the resistances of both the n+ and p+ contacts decreased for all contact sizes and the standard deviations at the cold temperature were suppressed by 45%. At −25 °C, the saturation current of the PMOSFET increased by 3% and the propagation delay time (t_PD) decreased by 2%. The t_PD increases by 19.3% when the temperature decreases from 85 °C to −25 °C, and the operating voltage decreases from 1.2 V to 0.95 V at the same time. However, this increase can be reduced to 17% by applying the soft treatment for 10 s. This simple and short time process will be considered essential for both mobile applications and automotive applications of dynamic random access memory (DRAM) devices requiring a low-voltage and low-temperature operation. Full article

A capacitorless one-transistor dynamic random-access memory device (1T-DRAM) is proposed to resolve the scaling problem in conventional one-transistor one-capacitor random-access memory (1T-1C-DRAM). Most studies on 1T-DRAM focus on device-level operation to replace 1T-1C-DRAM. To utilize 1T-DRAM as a memory device, we must understand its circuit-level operation, in addition to its device-level operation. Therefore, we studied the memory performance depending on device location in an array circuit and the circuit configuration by using the 1T-DRAM structure reported in the literature. The simulation results show various disturbances and their effects on memory performance. These disturbances occurred because the voltages applied to each device during circuit operation are different. We analyzed the voltage that should be applied to each voltage line in the circuit to minimize device disturbance and determine the optimized bias condition and circuit structure to achieve a large sensing margin and realize operation as a memory device. The results indicate that the memory performance improves when the circuit has a source line and the bias conditions of the devices differ depending on the write data at the selected device cell. Therefore, the sensing margin of the 1T-DRAM used herein can expectedly be improved by applying the proposed source line (SL) structure. Full article

Due to the advance of dynamic random access memory (DRAM) technologies with the steadfast increase of density with aggressively scaled storage capacitors, the supply voltage has been lowered to under 1 V to reduce power consumption. The above progress has been accompanied by the increasingly difficult task of sensing cell data reliably. One of the essential methods to preserve sustainable data retention characteristic is to curtail the sub-threshold leakage current by using a negative voltage bias for the bulk of access transistors. This negative back-bias is generated by a back-bias voltage generator. This paper proposes a novel high-speed back-bias voltage (VBB) generator with a cross-coupled hybrid pumping scheme. The conventional circuit uses one fixed voltage to control the gates of discharge of the p-channel metal oxide semiconductor (PMOS) and transfer n-channel metal oxide semiconductor (NMOS), respectively. However, the proposed circuit adds an auxiliary pump, thereby able to control more aptly with a lower negative voltage when discharging and a higher positive voltage when transferring. As a result, the proposed circuit achieves a faster pump-down speed and higher pumping current at a lower supply voltage compared to conventional circuits. The H-simulation program with integrated circuit emphasis (HSPICE) simulation results with the Taiwan semiconductor manufacturing company (TSMC) 0.18 um process technology indicates that the proposed circuit has about a 20% faster pump-down speed at a supply voltage of voltage common collector (VCC) = 1.2 V and about 3% higher pumping current at VBB from −0.6 V to −1 V with the ability to generate a near 3% higher ratio of |VBB|/VCC at VCC = 0.6 V compared to conventional circuits. Hence, the proposed circuit is extremely suitable and promising for future low-power and high-performance DRAM applications. Full article

As the supply voltage decreases, there is a need for a high-speed negative charge pump circuit, for example, to produce the back-bias voltage (V_BB) with high pumping efficiency at a low supply voltage (V_DD). Beyond the basic negative charge pump circuit with the small area overhead, advanced schemes such as hybrid pump circuit (HCP) and cross-coupled hybrid pump circuits (CHPC) were introduced to improve the pumping efficiency and pump down speed. However, they still suffer from pumping efficiency degradation, low level |V_BB|, and small pumping currents at very low V_DD. A novel negative charge pump using an enhanced pumping clock is proposed. The proposed cross-coupled charge pump consists of the enhanced pumping clock generator (ECG) having a pair of inverters and PMOS latch circuit to produce an enhanced control signal with a greater amplitude, thereby working efficiently especially at low supply voltages. The proposed scheme is validated with a HSPICE simulation using the TSMC 180 nm process. The proposed scheme can be operated down to V_DD = 0.4 V, and |V_BB|/V_DD is obtained to be 86.1% at V_DD = 0.5 V and C_load = 20 nF. Compared to the state-of-the-art CHPC scheme, the pumping efficiency is larger by 35% at V_DD = 0.6 V and R_L = 10 KΩ, and the pumping current is 2.17 times greater at V_DD = 1.2 V and V_BB = 0 V, making the circuit suitable for very low supply voltage applications in DRAMs. Full article

Dynamic random access memory (DRAM) circuits require periodic refresh operations to prevent data loss. As DRAM density increases, DRAM refresh overhead is even worse due to the increase of the refresh cycle time. However, because of few the cells in memory that have lower retention time, DRAM has to raise the refresh frequency to keep the data integrity, and hence produce unnecessary refreshes for the other normal cells, which results in a large refresh energy and performance delay of memory access. In this paper, we propose an integration scheme for DRAM refresh based on the retention-aware auto-refresh (RAAR) method and 2x granularity auto-refresh simultaneously. We also explain the corresponding modification need on memory controllers to support the proposed integration refresh scheme. With the given profile of weak cells distribution in memory banks, our integration scheme can choose the most appropriate refresh technique in each refresh time. Experimental results on different refresh cycle times show that the retention-aware refresh scheme can properly improve the system performance and have a great reduction in refresh energy. Especially when the number of weak cells increased due to the thermal effect of 3D-stacked architecture, our methodology still keeps the same performance and energy efficiency. Full article

The environment-dependent feature of physical unclonable functions (PUFs) is capable of sensing environment changes. This paper presents an analysis and categorization of a variety of PUF sensors. Prior works have demonstrated that PUFs can be used as sensors while providing a security authentication assurance. However, most of the PUF sensors need a dedicated circuit. It can be difficult to implemented in commercial off-the-shelf devices. This paper focuses on the intrinsic Dynamic Random Access Memory (DRAM) PUF-based sensors, which requires no modifications for hardware. The preliminary experimental results on Raspberry Pi have demonstrated the feasibility of our design. Furthermore, we configured the DRAM PUF-based sensor in a DRAM PUF-based key generation scheme which improves the practicability of the design. Full article

The current status of High K dielectrics in Very Large Scale Integrated circuit (VLSI) manufacturing for leading edge Dynamic Random Access Memory (DRAM) and Complementary Metal Oxide Semiconductor (CMOS) applications is summarized along with the deposition methods and general equipment types employed. Emerging applications for High K dielectrics in future CMOS are described as well for implementations in 10 nm and beyond nodes. Additional emerging applications for High K dielectrics include Resistive RAM memories, Metal-Insulator-Metal (MIM) diodes, Ferroelectric logic and memory devices, and as mask layers for patterning. Atomic Layer Deposition (ALD) is a common and proven deposition method for all of the applications discussed for use in future VLSI manufacturing. Full article

In digital pixel sensors (DPS), memory elements typically occupy large silicon area of the pixel, which significantly reduces the pixel’s fill factor while increases its size, power and cost. In this work, we propose to reduce DPS memory’s area and power overhead by reducing the memory requirements with a multi-reset integration scheme, and meanwhile employing a dynamic memory instead of traditionally exploited large 6T-SRAM cell. The operation of the DPS takes advantage from the chronological change of the code, which results in reduced memory needs without affecting the light resolution. In the proposed implementation, a 4-bit in-pixel memory is used to reduce the pixel size, and an 8-bit resolution is achieved with multi-reset scheme. In addition, full complementary metal-oxide-semiconductor (CMOS) 2T DRAM and selective refresh scheme are adoptedto implement the memory elements and further increase the area savings. This paper presents the proposed multi-reset integration methodology and its implementation with dedicated memory circuits. Proposed architecture is validated by a prototype chip fabricated using AMS 0.35 μm CMOS technology. Reported experimental results are compared with relative works. Full article