Electronics | Highly Cited Papers in 2023 in the Section “Microelectronics”
The “Microelectronics” Section of Electronics (ISSN: 2079-9292) is dedicated to publishing original research articles and cutting-edge reviews on the applications of microelectronics in emerging and challenging technologies. Electronics operating in extreme environments, such as a vacuum, space, harsh radiation, extreme cold and other niche applications, advances microelectronic designs.
You have free and unlimited access to the full texts of all of the open access articles published in our journal. We welcome you to read our most highly cited papers published in 2023 below:
1. “Enhancing Fault Awareness and Reliability of a Fault-Tolerant RISC-V System-on-Chip”
by Douglas A. Santos, André M. P. Mattos, Douglas R. Melo and Luigi Dilillo
Electronics 2023, 12(12), 2557; https://doi.org/10.3390/electronics12122557
Available online: https://www.mdpi.com/2079-9292/12/12/2557
2. “Conversion Electrode and Drive Capacitance for Connecting Microfluidic Devices and Triboelectric Nanogenerator”
by Zhiyuan Zhu, Fan Zeng, Zhihua Pu and Jiyu Fan
Electronics 2023, 12(3), 522; https://doi.org/10.3390/electronics12030522
Available online: https://www.mdpi.com/2079-9292/12/3/522
3. “Phase Diffusion in Low-EJ Josephson Junctions at Milli-Kelvin Temperatures”
by Wen-Sen Lu, Konstantin Kalashnikov, Plamen Kamenov, Thomas J. DiNapoli and Michael E. Gershenson
Electronics 2023, 12(2), 416; https://doi.org/10.3390/electronics12020416
Available online: https://www.mdpi.com/2079-9292/12/2/416
4. “Development of Temperature Sensor Based on AlN/ScAlN SAW Resonators”
by Min Wei, Yan Liu, Yuanhang Qu, Xiyu Gu, Yilin Wang, Wenjuan Liu, Yao Cai, Shishang Guoand and Chengliang Sun
Electronics 2023, 12(18), 3863; https://doi.org/10.3390/electronics12183863
Available online: https://www.mdpi.com/2079-9292/12/18/3863
5. “Compact CMOS Wideband Instrumentation Amplifiers for Multi-Frequency Bioimpedance Measurement: A Design Procedure”
by Israel Corbacho, Juan M. Carrillo, José L. Ausín, Miguel Á. Domínguez, Raquel Pérez-Aloe and Juan Francisco Duque-Carrillo
Electronics 2022, 11(11), 1668; https://doi.org/10.3390/electronics11111668
Available online: https://www.mdpi.com/2079-9292/11/11/1668
6. “Ultra-Low-Power Compact Neuron Circuit with Tunable Spiking Frequency and High Robustness in 22 nm FDSOI”
by Jiale Quan, Zhen Liu, Bo Li and Jiajun Luo
Electronics 2023, 12(12), 2648; https://doi.org/10.3390/electronics12122648
Available online: https://www.mdpi.com/2079-9292/12/12/2648
7. “Review of Nanoscale Vacuum Devices”
by Xinghui Li and Jinjun Feng
Electronics 2023, 12(4), 802; https://doi.org/10.3390/electronics12040802
Available online: https://www.mdpi.com/2079-9292/12/4/802
8. “Study of Single Event Latch-Up Hardness for CMOS Devices with a Resistor in Front of DC-DC Converter”
by Jindou Xin, Xiang Zhu, Yingqi Ma and Jianwei Han
Electronics 2023, 12(3), 550; https://doi.org/10.3390/electronics12030550
Available online: https://www.mdpi.com/2079-9292/12/3/550
9. “A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding”
by Song Wang, Xiping Jiang, Fujun Bai, Wenwu Xiao, Xiaodong Long, Qiwei Ren and Yi Kang
Electronics 2023, 12(5), 1077; https://doi.org/10.3390/electronics12051077
Available online: https://www.mdpi.com/2079-9292/12/5/1077
10.“Study of the Within-Batch TID Response Variability on Silicon-Based VDMOS Devices”
by Xiao Li, Jiangwei Cui, Qiwen Zheng, Pengwei Li, Xu Cui, Yudong Li and Qi Guo
Electronics 2023, 12(6), 1403; https://doi.org/10.3390/electronics12061403
Available online: https://www.mdpi.com/2079-9292/12/6/1403