Topical Advisory Panel for section 'Engineering and Materials'

Please see the section webpage for more information on this section.

Members


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Department for Graphic Materials and Printing Plates, University of Zagreb, Trg Republike Hrvatske 14, 10000 Zagreb, Croatia
Interests: realization and design of graphic products
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Department of Engineering Graphics, University of Seville, 41092 Seville, Spain
Interests: descriptive geometry; computational geometric modeling; multilevel dynamic modeling and simulation; physiological modeling; cyborgs modeling; wearable sensors; bioengineering
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School of Mathematical Sciences, Zhejiang University, Hangzhou 310027, China
Interests: catalytic materials; nano-structured catalyst materials; catalysis of sustainable energy
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College of Control Science and Engineering, Shandong University, Shandong 250061, China
Interests: optical fiber sensors and instrumentation; non-destructive detection technology; intelligent diagnosis and machine learning

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School of Information Science and Engineering, Shandong University, Jinan, China
Interests: computational imaging; ghost imaging; single-pixel imaging; quantum optics

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1. Associate Professor, ESILV, Léonard de Vinci, Pôle Universitaire, La Défense, Paris, France
2. Researcher, Arts et Métiers Institute of Technology, CNAM, LIFSE, HESAM University, 75013 Paris, France
Interests: machine learning; 3D/4D printing; 3D bioprinting; material science; pipeline integrity
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Dpto. Física Aplicada, Universidad de Salamanca, Plaza de la Merced s/n, 37008 Salamanca, Spain
Interests: semiconductor devices; bio-inspired electronic devices and circuits; noise behavior in semiconductor devices
Campus de Arrosadía, Universidad Pública de Navarra, 31006 Pamplona, Spain
Interests: manufacturing engineering; machining
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Graduate Institute of Opto-Mechatronics, National Chung Cheng University, 168 University Rd., Min-Hsiung, Chia-Yi 62102, Taiwan
Interests: biomedical science and engineering; biomedical sensors and images; hyperspectral imaging; optoelectronic semiconductor materials and devices; artificial intelligence
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Department of Aerospace Engineering, Sejong University, Seoul 05006, Republic of Korea
Interests: autonomous vehicles; control systems; UAVs
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College of Liberal Arts, Konkuk University Glocal Campus, Chungju 27478, Republic of Korea
Interests: metallic materials; alloy design; hydrogen embrittlement

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Department of Automation, Xiamen University, Xiamen, China
Interests: multi-agent control systems; mobile robotics; nonlinear control
State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
Interests: vibration (inverse problem); MEMS/NEMS; contact mechanics; surface/interface effects

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Department of Electronic and Information Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing, China
Interests: UAV channel modeling; UAV channel hardware emulation; spectrum sensing and mapping; UAV communications
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School of Geography and Information Engineering, China University of Geosciences, Wuhan, China
Interests: spatio-temporal data mining; map generalization; large language model
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School of Materials and Energy, Guangdong University of Technology, University Mega Center, Guangzhou, China
Interests: renewable energy; energy systems optimization
Department of Engineering Mechanics, South China University of Technology, Guangzhou, China
Interests: metamaterial design and performance optimization (wave characteristics, impact resistance, energy absorption, etc.); elastic wave theory and its calculation methods; smart materials and structural mechanics, advanced protective structural design; performance prediction and inverse design of advanced structures based on machine learning; impact dynamics of composite materials and structures
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School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510641, China
Interests: advance manufacturing; optimization control technology; symmetry in the mathematics and physics
School of Power and Energy, Northwestern Polytechnical University, Xi’an 710072, China
Interests: fluid behavior and heat transfer of roller bearings in high-speed rotating power machinery
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Department of Mechanical Engineering, Bialystok Technical University, Białystok, Poland
Interests: technical diagnosis; nondestructive testing (NDT); signal/image processing; computer vision
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Ultrasound Research Institute, Kaunas University of Technology, K. Baršausko St. 59, LT-51423 Kaunas, Lithuania
Interests: ultrasonic guided waves measurements; non-destructive testing; structural health monitoring; material characterization; guided waves applications for testing of the composite materials; signal processing
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Center for Advanced Sensor Technology, University of Maryland Baltimore County, Baltimore, MD 21250, USA
Interests: thin films; plasmonic surfaces; multilayer coatings; interfacial engineering
College of Electronic and Information Engineering, Southwest University, Chongqing 400715, China
Interests: smart grid; network control; signal processing; neural network; dynamic system fault diagnosis; cyber-physical fusion system
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School of Mechanical and Electrical Engineering, Soochow University, Suzhou 215031, China
Interests: intelligent control; artificial intelligence; image processing; robotics
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School of Physics, Xidian University, Xi’an 710071, China
Interests: vortex beam; light scattering; beam propagation; optical design; neural network
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School of Aeronautics and Astronautics, Purdue University, West Lafayette, IN, USA
Interests: wave propagation; solid mechanics; partial differential equations
1. Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
2. Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China
3. Department of Electrical and Electronic Engineering, Imperial College London, London SW7 2AZ, UK
Interests: reconfigurable RF/microwave/millimetre-wave devices; multilevel inverters; power electronics; thermal-hydraulic instrumentation; application security; sentiment analysis
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