Special Issue "Recent Progress in Hydrogels with Novel Functionality"

A special issue of Sci (ISSN 2413-4155).

Deadline for manuscript submissions: 31 December 2021.

Special Issue Editors

Prof. Dr. Chih-Feng Huang
E-Mail Website
Guest Editor
Department of Chemical Engineering, i-Center for Advanced Science and Technology (iCAST), National Chung Hsing University, Taichung 40227, Taiwan
Interests: living polymerizations; nanocomposites; biomaterial modifications; stimuli-responsive polymers
Special Issues, Collections and Topics in MDPI journals
Dr. Cheng-Wei Tu
E-Mail Website
Guest Editor
Green Energy and Environment Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan
Interests: polymer hydrogels; cellulose nanofibers; stimuli-responsive materials; polymer nanocomposites; sorption materials; thermal management materials and devices.

Special Issue Information

Dear Colleagues,

Hydrogels, three-dimensional network hydrophilic polymeric materials with physical or chemical crosslinks, have been developed over a century and have diverse applications, such as hygiene products, cosmetics, water purification, pharmaceutics, etc. Hydrogels can adsorb a large amount of water after swelling in aqueous environments through hydrophilic interaction and hydrogen bonding between polymers and water in addition to some dissociated electrolyte groups on the main chain or side groups. Due to the intrinsic structural factors and complex interactions inside the hydrogel, physical properties such as strength, morphology, and shape of a swelled hydrogel are commonly sensitive to the environment and affected by external stimuli.

This Special Issue aims to provide a comprehensive collection of the latest progress in the field of functional hydrogels, including the synthesis, characterization of hydrogels, and their responsivity, structure, swelling, mechanical or other particular properties. This Special Issue will published significant recent research efforts that have been devoted to tailoring a functional hydrogel and subjected to new fields of potential applications through special or responsive properties. Both review articles and regular original papers are welcome.

Prof. Dr. Chih-Feng Huang
Dr. Cheng-Wei Tu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sci is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Hydrogels for potential applications in new fields
  • Stimuli-responsive hydrogels
  • Zwitterionic hydrogels
  • Tough hydrogels
  • 3D-printing of hydrogels
  • Self-healing hydrogels
  • Environmentally sustainable hydrogels
  • Design, preparation, and characterization of special hydrogels.

Published Papers

This special issue is now open for submission.
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