Recent Advances in Printed Electronics and Flexible Electronics: Materials and Applications

Dear Colleagues,

Printed electronics and flexible electronics endow electronic devices with novel flexibility, foldability, high efficiency, and scalability, overcoming the restrictions of silicon-based electronics and greatly expanding the range of application in various fields, e.g., in flexible displays, electronic textiles, energy storage devices, sensory skins, and so on. Consequently, printed electronics and flexible electronics have attracted widespread attention from both academic and industrial communities and have witnessed remarkable breakthroughs in terms of material development, device fabrication, packaging, and integration.

The aim of this Special Issue on “Recent Advances in Printed Electronics and Flexible Electronics: Materials and Applications” is to provide a forum for researchers and practitioners to present and review the latest advances regarding the development, challenges, and future perspective of multiscale manufacturing toward printed electronics and flexible electronics, with new materials, processes, printing technology and applications. Topics of interest include but are not limited to:

• Materials synthesis, characterization, modeling, and applications, along with device fabrication and testing;
• Organic light-emitting diodes, organic transistors, memory devices, energy storage devices, sensors, and functional devices, conductive electrodes or circuits;
• Novel applications, including in displays, large-area sensors, functional devices, RFID tags, smart sensors, fabric, and paper-based devices;
• Novel, large-area processing methods, such as inkjet printing, spray pyrolysis, screen printing, solution deposition, and roll-to-roll processing.

Dr. Yan Wang
Guest Editor

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