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Processes
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Recent Advances in Printed Electronics and Flexible Electronics: Materials and...
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Recent Advances in Printed Electronics and Flexible Electronics: Materials and Applications

A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Materials Processes".

Deadline for manuscript submissions: closed (30 April 2022) | Viewed by 7478

Special Issue Editor

Dr. Yan Wang

E-Mail Website
Guest Editor
School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: printed electronic technology; flexible electronics; functional electronic devices; energy materials and devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Printed electronics and flexible electronics endow electronic devices with novel flexibility, foldability, high efficiency, and scalability, overcoming the restrictions of silicon-based electronics and greatly expanding the range of application in various fields, e.g., in flexible displays, electronic textiles, energy storage devices, sensory skins, and so on. Consequently, printed electronics and flexible electronics have attracted widespread attention from both academic and industrial communities and have witnessed remarkable breakthroughs in terms of material development, device fabrication, packaging, and integration.

The aim of this Special Issue on “Recent Advances in Printed Electronics and Flexible Electronics: Materials and Applications” is to provide a forum for researchers and practitioners to present and review the latest advances regarding the development, challenges, and future perspective of multiscale manufacturing toward printed electronics and flexible electronics, with new materials, processes, printing technology and applications. Topics of interest include but are not limited to:

  • Materials synthesis, characterization, modeling, and applications, along with device fabrication and testing;
  • Organic light-emitting diodes, organic transistors, memory devices, energy storage devices, sensors, and functional devices, conductive electrodes or circuits;
  • Novel applications, including in displays, large-area sensors, functional devices, RFID tags, smart sensors, fabric, and paper-based devices;
  • Novel, large-area processing methods, such as inkjet printing, spray pyrolysis, screen printing, solution deposition, and roll-to-roll processing.

Dr. Yan Wang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • inkjet printing
  • screen printing
  • self-assembly manufacturing
  • 3D printing
  • roll-to-roll manufacturing
  • flexible organic optoelectronics
  • nanoelectronic materials and devices
  • printed flexible energy devices
  • surface modification/functionalization for thin films/substrates
  • conductive electrodes or circuits

Published Papers (2 papers)

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Research

11 pages, 3378 KiB  
Article
Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)
by Sarthak Acharya, Shahid Sattar, Shailesh Singh Chouhan and Jerker Delsing
Processes 2022, 10(4), 636; https://doi.org/10.3390/pr10040636 - 24 Mar 2022
Cited by 1 | Viewed by 1946
Abstract
To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the [...] Read more.
To bridge the technology gap between IC-level and board-level fabrications, a fully additive selective metallization has already been demonstrated in the literature. In this article, the surface characterization of each step involved in the fabrication process is outlined with bulk metallization of the surface. This production technique has used polyurethane as epoxy resin and proprietary grafting chemistry to functionalize the surface with covalent bonds on an FR-4 base substrate. The surface was then metalized using an electroless copper (Cu) bath. This sequential growth of layers on top of each other using an actinic laser beam and palladium (Pd) ions to deposit Cu is analyzed. State-of-the-art material characterization techniques were employed to investigate process mechanism at the interfaces. Density functional theory calculations were performed to validate the experimental evidence of covalent bonding of the layers. This manufacturing approach is capable of adding metallic layers in a selective manner to the printed circuit boards at considerably lower temperatures. A complete analysis of the process using bulk deposition of the materials is illustrated in this work. Full article
(This article belongs to the Special Issue Recent Advances in Printed Electronics and Flexible Electronics: Materials and Applications)
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14 pages, 6372 KiB  
Article
Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging
by Sarthak Acharya, Shailesh Singh Chouhan and Jerker Delsing
Processes 2021, 9(9), 1634; https://doi.org/10.3390/pr9091634 - 10 Sep 2021
Cited by 7 | Viewed by 4936
Abstract
Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) [...] Read more.
Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) laminates on the base substrate and patterning the structures using lithography processes. As a result, significant amounts of metallic parts are etched away during any mass production process, causing unnecessary disposables leading to pollution. In this work, a new approach for Cu metallization is demonstrated with considerable step-reducing pattern-transfer mechanism. In the fabrication steps, a seed layer of covalent bonded metallization (CBM) chemistry on top of a dielectric epoxy resin is polymerized using actinic radiation intensity of a 375 nm UV laser source. The proposed method is capable of patterning any desirable geometries using the above-mentioned surface modification followed by metallization. To metallize the patterns, a proprietary electroless bath has been used. The metallic layer grows only on the selective polymer-activated locations and thus is called selective metallization. The highlight of this production technique is its occurrence at a low temperature (20–45 °C). In this paper, FR-4 as a base substrate and polyurethane (PU) as epoxy resin were used to achieve various geometries, useful in electronics packaging. In addition, analysis of the process parameters and some challenges witnessed during the process development are also outlined. As a use case, a planar inductor is fabricated to demonstrate the application of the proposed technique. Full article
(This article belongs to the Special Issue Recent Advances in Printed Electronics and Flexible Electronics: Materials and Applications)
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