Nanomaterials for Thermal Conductivity and Management in Next-Generation Systems
A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Energy and Catalysis".
Deadline for manuscript submissions: 15 February 2027 | Viewed by 53
Editor
Interests: integrated chip packaging and thermal management; flexible electronic devices and system integration
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the rapid development of Next-Generation Systems, including advanced electronic packaging, flexible electronics, soft robotics and aerospace electronics, the continuously increasing power density have made efficient thermal management a critical challenge for ensuring system reliability. Meanwhile, the growing demande for flexible electronic devices and system integration requires thermally conductive nanomaterials that simultaneously exhibit high thermal conductivity and mechanical compliance.
Over the past several years, nanomaterials have become a driving force in the development of advanced thermal management technologies, with significant progress being achieved in thermal conductivity enhancement. Various thermally conductive nanomaterials, including boron nitride, graphene, MXenes, carbon nanotubes, diamond, and other nanofillers, have been extensively investigated for reducing thermal resistance. Benefiting from continuous innovations in nanotechnology, advanced fabrication technologies, and computational design strategies such as topology optimization, thermally conductive nanomaterials have evolved from conventional filler-enhanced composites to multifunctional systems with architected structures and integrated functionalities. This evolution has not only enabled substantial improvements in thermal transport, but has also enhanced mechanical reliability, flexibility, and system integration, thereby expanding the applications of nanomaterials from integrated chip packaging and thermal management to flexible electronic devices and next-generation systems.
This Special Issue aims to highlight recent advances in nanomaterials for thermal conductivity enhancement and thermal management in next-generation systems, with particular emphasis on integrated chip packaging, flexible electronic devices, and system integration. Original research articles, communications, and comprehensive review papers are welcome.
Topics of interest for publication include, but are not limited to:
- Nanomaterials for thermal conductivity enhancement and thermal management
- Thermal management for integrated chip packaging and flexible electronic devices
- Thermally conductive polymer nanocomposites
- Thermal interface materials and heat spreaders
- Electronic packaging technologies
- Flexible and stretchable thermal management materials
- Electrospinning and advanced manufacturing
- Thermal transport mechanisms
- Multiphysics modeling and simulation
- Reliability and thermo-mechanical performance
- Intelligent thermal management
- Nanomaterials for next-generation electronic systems
Dr. Bin Xie
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Nanomaterials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermal interface materials
- thermal management
- flexible electronics
- system integration
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