Advanced Thermal Management of Integrated Electronic Devices

Dear Colleagues,

With the rising power density and ever-shrinking size of electronic devices, thermal issues related to the high junction temperature of chips are becoming rather severe. Thermal management is essential for boosting both the performance and stability of integrated electronic devices. Especially, third-generation semiconductor-based HEMTs, IGBTs, lasers, 3D-stacked chips, etc., are now desperate for efficient and compact thermal management solutions to maintain a safe junction temperature. Fortunately, advanced thermal management strategies, thermal characterization methods, and thermal modeling and analyzing approaches have been rapidly developed within the past decade.

This Special Issue is intended to present research papers and review articles that report on the recent advances in thermal management of integrated electronic devices, including thermal materials, heat dissipation system designs, thermal characterizations, thermal transport analysis, and thermal modeling. The topics covered in this Special Issue include, but are not limited to:

• Emerging thermal interfacial materials
• Advanced thermal characterization techniques
• New concepts in thermal management of electronic devices
• Forced air and liquid cooling techniques
• Phase change materials
• Thermal modeling and simulations
• Thermal reliability analysis of integrated electronic devices
• Chip-level thermal management
• Liquid Metal and its system design
• Energy conversion and management

Dr. Bin Xie
Dr. Bofeng Shang
Guest Editors

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