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Technology for 3D System Integration for Flexible Wireless Biomedical Applications

Department of Mechanical and Automation Engineering, National Kaohsiung University of Science and Technology, 2 Jhuoyue Rd., Nanzih, Kaohsiung 811, Taiwan
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Micromachines 2018, 9(5), 213; https://doi.org/10.3390/mi9050213
Received: 16 March 2018 / Revised: 24 April 2018 / Accepted: 27 April 2018 / Published: 2 May 2018
(This article belongs to the Special Issue Wafer Level Packaging of MEMS)
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Abstract

This paper presents a new 3D bottom-up packing technology for integrating a chip, an induction coil, and interconnections for flexible wireless biomedical applications. Parylene was used as a flexible substrate for the bottom-up embedding of the chip, insulation layer, interconnection, and inductors to form a flexible wireless biomedical microsystem. The system can be implanted on or inside the human body. A 50-μm gold foil deposited through laser micromachining by using a picosecond laser was used as an inductor to yield a higher quality factor than that yielded by thickness-increasing methods such as the fold-and-bond method or thick-metal electroplating method at the operation frequency of 1 MHz. For system integration, parylene was used as a flexible substrate, and the contact pads and connections between the coil and chip were generated using gold deposition. The advantage of the proposed process can integrate the chip and coil vertically to generate a single biocompatible system in order to reduce required area. The proposed system entails the use of 3D integrated circuit packaging concepts to integrate the chip and coil. The results validated the feasibility of this technology. View Full-Text
Keywords: parylene; 3D package; biomedical system; MEMS parylene; 3D package; biomedical system; MEMS
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Kuo, W.-C.; Huang, C.-W. Technology for 3D System Integration for Flexible Wireless Biomedical Applications. Micromachines 2018, 9, 213.

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