Laser Precision Processing and Intelligent Inspection Technologies for Transparent and Selectively Transmissive Materials

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 30 April 2027 | Viewed by 236

Editor

School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
Interests: additive manufacturing; laser manufacturing; intelligent manufacturing; difficult–to–machine materials
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Special Issue Information

Dear Colleagues,

Transparent and selectively transmissive materials are widely used in micro/nano manufacturing, optoelectronic displays, semiconductor fabrication, precision optics, and high-end equipment industries. Representative materials include glass, quartz glass, TGV glass, optical glass, sapphire, transparent ceramics, optical crystals, transparent polymers, polarizers, PI, PDMS, and functional optical films. Their geometric accuracy, edge quality, surface integrity, and optical transmission characteristics directly affect assembly precision, device performance, processing consistency, and long-term reliability. However, these materials often present significant manufacturing and inspection challenges. Hard–brittle transparent materials are prone to edge chipping, microcracks, dimensional deviations, thermal damage, and surface defects during cutting, edge grinding, chamfering, drilling, and microstructure fabrication. Flexible or selectively transmissive materials may suffer from deformation, weak boundary features, low image contrast, multilayer interference, and complex optical responses during online inspection. Laser precision processing, with its advantages of non-contact operation, controllable energy input, high flexibility, and localized material modification, provides an effective approach for precision cutting, micro-hole and micro-groove fabrication, edge finishing, chamfering, surface modification, and micro/nano structuring. Meanwhile, intelligent inspection technologies, including machine vision, optical imaging, image processing, deep learning, in situ sensing, and data fusion, are urgently needed to realize accurate measurement, defect detection, quality evaluation, and closed-loop feedback control for transparent and selectively transmissive materials.

This Micromachines Special Issue, ‘Laser Precision Processing and Intelligent Inspection Technologies for Transparent and Selectively Transmissive Materials’, welcomes research articles, communications, and reviews. The scope covers laser precision processing, online inspection, dimensional measurement, defect detection, quality evaluation, and intelligent manufacturing technologies for transparent, weakly textured, and selectively transmissive material systems. Topics of interest include, but are not limited to, (i) laser cutting, drilling, grooving, chamfering, edge finishing, surface modification, and micro/nano structuring of transparent and selectively transmissive materials; (ii) mechanisms, modeling, and simulation of laser–material interaction in glass-based materials, sapphire, transparent ceramics, optical crystals, transparent polymers, functional optical films, and multilayer optoelectronic materials; (iii) online inspection, geometric dimensional measurement, defect detection, and edge microstructure characterization for transparent, weakly textured, and selectively transmissive materials; (iv) machine vision, optical imaging, image processing, deep learning, and intelligent recognition for precision inspection; (v) beam shaping, ultrafast laser processing, scanning strategies, multi-axis motion control, and integrated processing systems; and (vi) in situ sensing, online quality assessment, data fusion, intelligent feedback control, equipment integration, and engineering applications. This Special Issue aims to promote the coordinated development of Laser Precision Processing and Intelligent Inspection Technologies for Transparent and Selectively Transmissive Materials, and to further expand their applications in optoelectronic displays, semiconductor manufacturing, precision optics, hard–brittle material processing, and advanced micro/nano manufacturing.

Dr. Congyi Wu
Guest Editor

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Keywords

  • transparent materials
  • selectively transmissive materials
  • glass chamfering
  • laser precision processing
  • ultrafast laser processing
  • machine vision
  • dimensional measurement
  • defect detection
  • online inspection

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Published Papers (1 paper)

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Research

17 pages, 17879 KB  
Article
Process and Mechanism of Cutting Polyamide Films with an Ultraviolet Picosecond Laser
by Qin Xie, Tian Wang, Yan Zhou, Zeyue Gao, Jie Jiang, Congyi Wu, Bing Wei and Yu Huang
Micromachines 2026, 17(7), 804; https://doi.org/10.3390/mi17070804 - 30 Jun 2026
Viewed by 164
Abstract
Polyamide (PA) films have been widely utilized in high-precision medical devices and aerospace components, while laser precision cutting technology has significantly broadened their application scope. Although ultraviolet (UV) picosecond lasers are effective for high-precision cutting of PA films, their cutting mechanism and the [...] Read more.
Polyamide (PA) films have been widely utilized in high-precision medical devices and aerospace components, while laser precision cutting technology has significantly broadened their application scope. Although ultraviolet (UV) picosecond lasers are effective for high-precision cutting of PA films, their cutting mechanism and the optimization method for the process remain to be elucidated. First, the mechanism of UV picosecond laser cutting of PA films was investigated through a simulation of the thermal degradation process and analysis of the solid/gas byproduct composition. The results indicate that the photochemical reaction primarily dominates the process, with the photothermal effect contributing synergistically. Second, a cutting quality evaluation framework was established, with the kerf width and heat-affected zone (HAZ) width as its primary metrics, followed by an orthogonal experiment. The experimental results revealed the influence of process parameters on the cutting quality, and it was determined that an optimal process parameter combination exists, identified as 80 mm/s, 1.67 W, and three times (cutting speed, laser power, repetition number of cutting). Under this optimal configuration, narrow kerf (23.6 ± 2.7 μm) and HAZ (28.4 ± 3.3 μm) were achieved. Full article
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