Silicon Photonics–CMOS Integration and Device Applications

Dear Colleagues,

Silicon photonics and photonic integrated circuits (PICs) using CMOS processes will take a key role in new emerging applications such as artificial intelligence (AI), light detection and ranging (LiDAR) sensors for autonomous vehicles and drones, next-generation nuromorphic computing systems, and quantum computing systems. Following the surprisingly fast increase in AI industry demands for high-performance transceivers to process data at speeds up to terabits per second, power-efficient high-speed optical interconnects have become more and more crucial for AI-driven world industries. Although CMOS PICs face various challenges including material limitations, complicated integration levels, initial cost issues, and long manufacturing times, a number of key players in semiconductor industries have paid a great deal of attention to these PICs to build high-speed transceivers for AI and data center applications. In this respect, silicon photonis and PICs using CMOS processes represent the leading technologoies in the imminent AI-driven market.

Hence, the goal of this Special Issue is to invite the submission of high-quality, state-of-the-art research articles that deal with challenging issues in silicon photonics and CMOS integration and device applications. We solicit original papers of unpublished and completed research that are not currently under review elsewhere.

Topics of interest include, but are not limited to, the following:

• Silicon photonics;·       
• CMOS photonic integrated circuits;      
• High-performance transceivers for data centers, on-device optical interconnects, AI accelerators, neuromorphic computing, quantum computing, LiDAR sensors, etc. 

Prof. Dr. Sung Min Park
Guest Editor

Manuscript Submission Information

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