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Micromachines
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Recent Advances in Silicon-Based MEMS Sensors and Actuators
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Recent Advances in Silicon-Based MEMS Sensors and Actuators

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 31 May 2025 | Viewed by 13172

Special Issue Editors

Prof. Dr. Linxi Dong

E-Mail Website
Guest Editor
School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China
Interests: smart micro/nano sensors; MEMS sensors; ASIC; flexible and wearable sensors; Internet of Things
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Chenying Wang

E-Mail Website
Guest Editor
School of Instrument Science and Technology, Xi'an Jiaotong University, Xi'an 710049, China
Interests: MEMS; flexible sensors; micro/nano-geometric standard material
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Weidong Wang

E-Mail Website
Guest Editor
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Interests: MEMS; NEMS; micro/nano mechanics; flexible sensors; electronic packaging
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

With the development of microelectronics technology and micro/nano manufacturing technology, Si-based MEMS sensors and actuators have progressed significantly. Due to their advantages of high precision, miniaturization and low power consumption, Si-based MEMS sensors and actuators have been widely applied in many fields, such as consumer electronics, automotive electronics, aerospace and military equipment. In order to showcase the latest research results in this field and promote technological innovation and application expansion, we would like to invite scholars, researchers and engineers from all over the world to contribute to this Special Issue.

This Special Issue will focus on research advances in Si-based MEMS sensors and actuators, covering novel sensing and execution mechanisms, advanced fabrication methods, performance optimization strategies and innovative applications in biomedical, environmental monitoring, intelligent manufacturing and communication electronics. We look forward to innovative, scientific and practical high-quality manuscripts, whether they be theoretical research, experimental exploration or practical application cases, which will bring inspiration to the development of the Si-based MEMS field.

Manuscripts must be original works with rigorous structures, accurate data and clear discussions, and they must conform to the format standard of the journal. Furthermore, manuscripts must not have been previously published in other journals. The submission deadline is May 31, 2025. Areas of interest include but are not limited to the following:

  • Structural design and optimization methods;
  • System modeling and simulation;
  • Advanced fabrication techniques;
  • Experimental explorations and practical applications.

Prof. Dr. Linxi Dong
Prof. Dr. Chenying Wang
Prof. Dr. Weidong Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS
  • sensors
  • actuators
  • flexible sensors
  • design and optimization
  • fabrication techniques
  • applications
  • haptic display and feedback

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (4 papers)

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Research

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15 pages, 4873 KiB  
Article
Near-Infrared Spectral MEMS Gas Sensor for Multi-Component Food Gas Detection
by Xiaojian Yan, Yao Tan, Yi Wang, Gongdai Chen, Weigao Xia, Gang Zhou, Hongliang Luo, Hao Liu, Tianxun Gong and Xiaosheng Zhang
Micromachines 2025, 16(2), 135; https://doi.org/10.3390/mi16020135 - 24 Jan 2025
Viewed by 1418
Abstract
The complex application environments of gas detection, such as in industrial process monitoring and control, atmospheric and environmental monitoring, and food safety, require real-time and online high-sensitivity gas detection, as well as the accurate identification and quantitative analysis of gas samples. Despite the [...] Read more.
The complex application environments of gas detection, such as in industrial process monitoring and control, atmospheric and environmental monitoring, and food safety, require real-time and online high-sensitivity gas detection, as well as the accurate identification and quantitative analysis of gas samples. Despite the progress in gas analysis and detection methods, high-precision and high-sensitivity detection requirements for target gases of multiple components in mixed gases are still challenging. Here, we demonstrate a micro-electromechanical system (MEMS) with near-infrared (NIR) spectral gas detection technology and spectral model training, which is used to improve the detection and classification of multi-component gases in food. During blind sample testing, the NIR spectral gas sensor demonstrated over 90% accuracy in identifying mixed gases, as well as achieving the classification of ethanol concentration. We envision that our design strategy of an NIR spectral gas sensor could enhance the gas detection and distinguishing ability under the conditions of background gas interference and cross-interference in multi-component detection. Full article
(This article belongs to the Special Issue Recent Advances in Silicon-Based MEMS Sensors and Actuators)
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14 pages, 7150 KiB  
Article
The Effect of Metal Shielding Layer on Electrostatic Attraction Issue in Glass–Silicon Anodic Bonding
by Wenqi Yang, Yong Ruan and Zhiqiang Song
Micromachines 2025, 16(1), 31; https://doi.org/10.3390/mi16010031 - 28 Dec 2024
Viewed by 3625
Abstract
Silicon–glass anode bonding is the key technology in the process of wafer-level packaging for MEMS sensors. During the anodic bonding process, the device may experience adhesion failure due to the influence of electric field forces. A common solution is to add a metal [...] Read more.
Silicon–glass anode bonding is the key technology in the process of wafer-level packaging for MEMS sensors. During the anodic bonding process, the device may experience adhesion failure due to the influence of electric field forces. A common solution is to add a metal shielding layer between the glass substrate and the device. In order to solve the problem of device failure caused by the electrostatic attraction phenomenon, this paper designed a double-ended solidly supported cantilever beam parallel plate capacitor structure, focusing on the study of the critical size of the window opening in the metal layer for the electric field shielding effect. The metal shield consists of 400 Å of Cr and 3400 Å of Au. Based on theoretical calculations, simulation analysis, and experimental testing, it was determined that the critical size for an individual opening in the metal layer is 180 μm × 180 μm, with the movable part positioned 5 μm from the bottom, which does not lead to failure caused by stiction due to electrostatic pull-in of the detection structure. It was proven that the metal shielding layer is effective in avoiding suction problems in secondary anode bonding. Full article
(This article belongs to the Special Issue Recent Advances in Silicon-Based MEMS Sensors and Actuators)
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Review

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15 pages, 4058 KiB  
Review
Application Prospects of a Silicon-Based MEMS Safety and Arming Device for a Micro-Explosive Train
by Wei Ren, Dongpeng Zhang, Enyi Chu, Tengjiang Hu, Anmin Yang, Hui Li, Jianhua Chen, Jiao Li and Wei Liu
Micromachines 2025, 16(5), 497; https://doi.org/10.3390/mi16050497 - 24 Apr 2025
Viewed by 181
Abstract
As the initial energetic device and driving force of weapon systems, pyrotechnics serve as the core and most sensitive explosive initiating device of weaponry. To accommodate the development requirements of various informatized and miniaturized weapons, MEMS pyrotechnics, characterized primarily by energy conversion informatization, [...] Read more.
As the initial energetic device and driving force of weapon systems, pyrotechnics serve as the core and most sensitive explosive initiating device of weaponry. To accommodate the development requirements of various informatized and miniaturized weapons, MEMS pyrotechnics, characterized primarily by energy conversion informatization, structural miniaturization, and train integration, have become a significant direction in the development of pyrotechnics technology. MEMS Safety and Arming Devices, serving as the energy transfer control mechanisms for micro-explosive trains in MEMS pyrotechnics, are one of the key technologies in the design of MEMS pyrotechnics. This study conducted a classification study of a silicon-based MEMS Safety and Arming Device from the perspective of micro-explosive train structures, analyzed the technical principles of different S&A device, explored their application progress and research status, and summarizes the trends of the micro-miniaturization, integration, and informatization of the silicon-based MEMS Safety and Arming Device, providing new ideas for the research and the design of MEMS Safety and Arming Devices. Full article
(This article belongs to the Special Issue Recent Advances in Silicon-Based MEMS Sensors and Actuators)
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34 pages, 15971 KiB  
Review
MEMS Acoustic Sensors: Charting the Path from Research to Real-World Applications
by Qingyi Wang, Yang Zhang, Sizhe Cheng, Xianyang Wang, Shengjun Wu and Xufeng Liu
Micromachines 2025, 16(1), 43; https://doi.org/10.3390/mi16010043 - 30 Dec 2024
Cited by 1 | Viewed by 4634
Abstract
MEMS acoustic sensors are a type of physical quantity sensor based on MEMS manufacturing technology for detecting sound waves. They utilize various sensitive structures such as thin films, cantilever beams, or cilia to collect acoustic energy, and use certain transduction principles to read [...] Read more.
MEMS acoustic sensors are a type of physical quantity sensor based on MEMS manufacturing technology for detecting sound waves. They utilize various sensitive structures such as thin films, cantilever beams, or cilia to collect acoustic energy, and use certain transduction principles to read out the generated strain, thereby obtaining the targeted acoustic signal’s information, such as its intensity, direction, and distribution. Due to their advantages in miniaturization, low power consumption, high precision, high consistency, high repeatability, high reliability, and ease of integration, MEMS acoustic sensors are widely applied in many areas, such as consumer electronics, industrial perception, military equipment, and health monitoring. Through different sensing mechanisms, they can be used to detect sound energy density, acoustic pressure distribution, and sound wave direction. This article focuses on piezoelectric, piezoresistive, capacitive, and optical MEMS acoustic sensors, showcasing their development in recent years, as well as innovations in their structure, process, and design methods. Then, this review compares the performance of devices with similar working principles. MEMS acoustic sensors have been increasingly widely applied in various fields, including traditional advantage areas such as microphones, stethoscopes, hydrophones, and ultrasound imaging, and cutting-edge fields such as biomedical wearable and implantable devices. Full article
(This article belongs to the Special Issue Recent Advances in Silicon-Based MEMS Sensors and Actuators)
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