Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
5.2
3.0
Journals
Micromachines
Special Issues
JCK MEMS/NEMS 2024
share announcement

JCK MEMS/NEMS 2024

A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (31 December 2024) | Viewed by 1712

Special Issue Editors

Prof. Dr. Zhuqing Wang

E-Mail Website
Guest Editor
School of Mechanical Engineering, Sichuan University, Chengdu 610065, China
Interests: micro- electromechanical systems (MEMS); nanoelectromechanical systems; and ultrasensitive sensing based on thermal-bio device for application
Prof. Dr. Norihisa Miki

E-Mail Website
Guest Editor
Department of Mechanical Engineering, Keio University, Kanagawa 223-8522, Japan
Interests: micro/nano engineering and science; human interface; interaction/cognitive science/media art; medical engineering; artificial organ; machine learning; artificial intelligence (AI); MEMS (microelectromechanical systems)
Special Issues, Collections and Topics in MDPI journals
Dr. Jeongdai Jo

E-Mail Website
Guest Editor
Department of Flexible and Printed Electronics, Korea Institute of Machinery and Materials, 212, 14-C Bldg., 156, Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Republic of Korea
Interests: printing, coating, and pattering process; roll-to-roll system; flexible and printed sensors and electronics devices; micro/nano-electro-mechanical systems (M/NEMS)

Special Issue Information

Dear Colleagues,

This Special Issue will publish selected papers from the 15th Japan-China-Korea Joint Conference on MEMS/NEMS (JCK MEMS/NEMS 2024, www.jckmemsnems2024.com), 19–21 September 2024 in Chengdu, China.

The JCK MEMS/NEMS Conference is organized to provide an annual East Asian forum for the recent progress in MEMS/NEMS technology with a special emphasis on international collaboration to solve environmental and social issues among East Asian Economies. The conference will cover the following main topics:

  • Micro/Nano Electro-Mechanical Systems (M/NEMS);
  • Micro/Nano-Fabrication including 3D printing;
  • Micro/Nano-Actuators and Robotics;
  • Micro/Nano-Chemical and Physical Sensors;
  • Micro/Nano-Bio Devices and Systems;
  • Micro/Nano-Electronics including Flexible Electronics;
  • Micro/Nano-Enabled Wearable Devices;
  • Networked Microsystems and IoT Technologies;
  • Materials and Device Characterization;
  • Integration and Packaging Technologies;
  • Modeling and Simulation of Manufacturing Processes;
  • Medical Engineering Technology.

Papers attracting the most interest at the conference, or that provide novel contributions, will be selected for publication in Micromachines. These papers will be peer-reviewed for validation of research results, developments and applications.

In addition, submissions from others that are not associated with this conference but with themes focusing on MEMS/NEMS technology are also welcome.

We hope that this Special Issue benefits the efficient sharing of the latest significant results and inspired viewpoints on an international scale, and thus propels the research on MEMS/NEMS technology across the globe.

Prof. Dr. Zhuqing Wang
Prof. Dr. Norihisa Miki
Dr. Jeongdai Jo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • M/NEMS
  • micro/nano-fabrication
  • micro/nano-actuators and robotics
  • micro/nano-chemical and physical sensors
  • micro/nano-bio devices and systems
  • micro/nano-electronics
  • micro/nano-enabled wearable devices

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (1 paper)

Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

13 pages, 3358 KiB  
Article
Optimization of Hot Embossing Condition Using Taguchi Method and Evaluation of Microchannels for Flexible On-Chip Proton-Exchange Membrane Fuel Cell
by Yubo Huang, Han Gao, Zhiheng Wu, Hongyang Xiao, Cao Xia, Yuanlin Xia and Zhuqing Wang
Micromachines 2024, 15(8), 1033; https://doi.org/10.3390/mi15081033 - 14 Aug 2024
Viewed by 1138
Abstract
Hot embossing is a manufacturing technique used to create microchannels on polymer substrates. In recent years, microchannel fabrication technology based on hot embossing has attracted considerable attention due to its convenience and low cost. A new evaluation method of microchannels, as well as [...] Read more.
Hot embossing is a manufacturing technique used to create microchannels on polymer substrates. In recent years, microchannel fabrication technology based on hot embossing has attracted considerable attention due to its convenience and low cost. A new evaluation method of microchannels, as well as an approach to obtaining optimal hot embossing conditions based on the Taguchi method, is proposed in this paper to fabricate precise microchannels for a flexible proton-exchange membrane fuel cell (PEMFC). Our self-made hot embossing system can be used to fabricate assorted types of micro-channel structures on polymer substrates according to various applications, whose bottom width, top width, height and cross-sectional area vary in the aims of different situations. In order to obtain a high effective filling ratio, a new evaluation method is presented based on the four parameters of channel structures, and the Taguchi method is utilized to arrange three main factors (temperature, force and time) affecting the hot embossing in orthogonal arrays, quickly finding the optimal condition for the embossing process. The evaluation method for microchannels proposed in this paper, compared to traditional evaluation methods, incorporates the area factor, providing a more comprehensive assessment of the fabrication completeness of the microchannels. Additionally, it allows for the quick and simple identification of optimal conditions. The experimental results indicate that after determining the optimal embossing temperature, pressure and time using the Taguchi method, the effective filling rate remains above 95%, thereby enhancing the power density. Through variance analysis, it was found that temperature is the most significant factor affecting the hot embossing of microchannels. The high filling rate makes the process suitable for PEMFCs. The results demonstrate that under optimized process conditions, a self-made hot embossing system can effectively fabricate columnar structure microchannels for PEMFCs. Full article
(This article belongs to the Special Issue JCK MEMS/NEMS 2024)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-1
Back to TopTop