Advances in Optoelectronic Co-Design: Bridging EIC and PIC Technologies
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: 31 January 2026 | Viewed by 19
Special Issue Editors
Interests: high-speed analog IC design; optical transceiver; O/E co-design
Interests: high-speed optical interconnects; silicon photonics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Recent breakthroughs in microelectronics and optoelectronics have accelerated the development of cutting-edge applications, including high-speed optical interconnects/CPO/OIO in data centers, 6G networks, and AI systems. Meanwhile, emerging photonic technologies—such as high-speed LiDAR sensing, quantum detection, and advanced optical communications—have intensified the urgent need for the seamless integration of electronic and photonic functionalities. To address the challenges of hybrid optoelectronic design, modern approaches require merging electronic integrated circuits (EICs) with photonic integrated circuits (PICs). EIC design must incorporate photonic requirements for flexible architectural adjustments, while PIC design must prioritize co-integration with EICs in functional compatibility, signal integrity, and dimensional scaling. This interdisciplinary field demands innovative methodologies, tools, and technologies. Accordingly, this Special Issue seeks to showcase research papers, short communications, and review articles that focus on (1) EIC-PIC co-design and heterogeneous integration for optical communication, LiDAR, and quantum detection; (2) EIC-PIC packaging and system-level integration technologies; and (3) EIC-PIC joint simulation and modeling methodologies. We invite contributions that advance the development of optoelectronic design and integration.
Prof. Dr. Dan Li
Prof. Dr. Binhao Wang
Guest Editors
Manuscript Submission Information
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Keywords
- EIC-PIC co-design targeting: high-speed optical interconnect
- LiDAR
- quantum
- other emerging applications
- EIC-PIC packaging and integration
- EIC-PIC joint simulation
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