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Micromachines
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Recent Advances in Micro/Nanofabrication, 2nd Edition
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Recent Advances in Micro/Nanofabrication, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 July 2025 | Viewed by 3703

Special Issue Editors

Dr. Yao Liu

E-Mail Website
Guest Editor
School of Mechanical Engineering, North University of China, Taiyuan 030051, China
Interests: micromachining; laser machining; ceramic grinding; semiconductor manufacturing
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Jinjie Zhou

E-Mail Website
Guest Editor
School of Mechanical Engineering, North University of China, Taiyuan 030051, China
Interests: micro instrument and microfabrication; ultrasonic transducer; micro defect detection in industry
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In recent decades, micro/nanofabrication technologies have been widely used to prepare non-destruction testing transducers, semiconductors, special functional surfaces, and key medical interventional components. These technologies are the key factors determining the functions of micro/nanodevices and include traditional cutting/dicing, laser machining, micro-3D printing, printed circuits, chemical machining, and optical machining. We are pleased to invite you to contribute recent original research papers and reviews on the micro/nanofabrication, construction, performance, and functional integration of microdevices, alongside their multiple applications. This Special Issue will collect and present recent advances in micro/nanofabrication, providing deep insights for future works on research areas including (but not limited to) micro/nanomaterials, their processing, and the related engineering and technology.

We look forward to receiving your contributions.

Dr. Yao Liu
Prof. Dr. Jinjie Zhou
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micromachining
  • micro-3D printing
  • laser machining
  • textured surface
  • microdevice

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Further information on MDPI's Special Issue policies can be found here.

Related Special Issue

Published Papers (5 papers)

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Research

20 pages, 25702 KiB  
Article
Mechanism-Oriented Analysis of Core–Shell Structured CIP@SiO2 Magnetic Abrasives for Precision-Enhanced Magnetorheological Polishing
by Chunyu Li, Shusheng Chen, Zhuoguang Zheng, Yicun Zhu, Bingsan Chen and Yongchao Xu
Micromachines 2025, 16(5), 495; https://doi.org/10.3390/mi16050495 - 24 Apr 2025
Viewed by 224
Abstract
This study addresses the critical challenge of precise control over active abrasive particles in magnetorheological polishing (MRP) through innovative core–shell particle engineering. A sol–gel synthesized CIP@SiO2 magnetic composite abrasive with controlled SiO2 encapsulation (20 nm shell thickness) was developed using tetraethyl [...] Read more.
This study addresses the critical challenge of precise control over active abrasive particles in magnetorheological polishing (MRP) through innovative core–shell particle engineering. A sol–gel synthesized CIP@SiO2 magnetic composite abrasive with controlled SiO2 encapsulation (20 nm shell thickness) was developed using tetraethyl orthosilicate (TEOS) as the silicon precursor, demonstrating significant advantages in optical-grade fused silica finishing. Systematic polishing experiments reveal that the core–shell architecture achieves a remarkable 20.16% improvement in surface quality (Ra = 1.03 nm) compared to conventional CIP/SiO2 mixed abrasives, with notably reduced surface defects despite a modest 8–12% decrease in material removal rate. Through synergistic analysis combining elastic microcontact mechanics modeling and molecular dynamics simulations, we establish that the SiO2 shell mediates stress distribution at tool–workpiece interfaces, effectively suppressing deep subsurface damage while maintaining nano-scale material removal efficiency. The time-dependent performance analysis further demonstrates that extended polishing durations with CIP@SiO2 composites progressively eliminate mid-spatial frequency errors without introducing new surface artifacts. These findings provide fundamental insights into designed abrasive architectures for precision finishing applications requiring sub-nanometer surface integrity control. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nanofabrication, 2nd Edition)
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30 pages, 23922 KiB  
Article
The Influence of Contour Form Geometric Features and the Number of Cutting Passes on the Surface Quality Characteristics and Critical Points of Cutting Tools Fabricated by Wire Electrical Discharge Machining (WEDM)
by Amir Alinaghizadeh, Bahman Azarhoushang and Mohammadjafar Hadad
Micromachines 2025, 16(2), 227; https://doi.org/10.3390/mi16020227 - 17 Feb 2025
Viewed by 416
Abstract
Since one of the effective methods for producing the form-cutting tools used in the form-turning process involves utilizing a wire cut machine, the effect of the geometric characteristics of the form contour on reducing the negative effects of the recast layer was investigated [...] Read more.
Since one of the effective methods for producing the form-cutting tools used in the form-turning process involves utilizing a wire cut machine, the effect of the geometric characteristics of the form contour on reducing the negative effects of the recast layer was investigated in this research. The basic assumption of the components for each type of profile form is based on a combination of four modes, i.e., concave arc, convex arc, flat surface, and oblique surface. Based on this, samples were fabricated as cutting tools with three different radii: a convex arc, a concave arc, and a flat surface. During the wire electrical discharge machining (WEDM) operation, one-pass mode was used to create a rough surface, two passes resulted in a semi-finished surface, and three passes resulted in a finished surface. Furthermore, the difference between the surface quality of the recast layer in the two areas above the workpiece or the wire entry point and the bottom area of the workpiece or the wire exit point was studied. Finally, the effect of the direction, size of the curvature and the number of passes in the electric discharge process of the wire on the recast layer was shown, and it was observed that with the increase in the number of passes in WEDM, the thickness of the recast layer was reduced, along with the uniformity of the cutting contour section in the areas close to the cutting region. The entry of the wire was greater than that in the areas near the exit of the wire. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nanofabrication, 2nd Edition)
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20 pages, 23708 KiB  
Article
Multi-Channel Electrical Discharge Machining of Ti-6Al-4V Enabled by Semiconductor Potential Differences
by Xuyang Zhu, Tao Wei, Sipei Li, Guangxian Li and Songlin Ding
Micromachines 2025, 16(2), 147; https://doi.org/10.3390/mi16020147 - 26 Jan 2025
Viewed by 753
Abstract
Titanium alloys are difficult to machine using conventional metal cutting methods due to their low thermal conductivity and high chemical reactivity. This study explores the new multi-channel discharge machining of Ti-6Al-4V using silicon electrodes, leveraging their internal resistivity to generate potential differences for [...] Read more.
Titanium alloys are difficult to machine using conventional metal cutting methods due to their low thermal conductivity and high chemical reactivity. This study explores the new multi-channel discharge machining of Ti-6Al-4V using silicon electrodes, leveraging their internal resistivity to generate potential differences for multi-channel discharges. To investigate the underlying machining mechanism, the equivalent circuit model was developed and a theoretical simulation was carried out. Comparative experiments with silicon and conventional copper electrodes under identical parameters were also conducted to analyze discharge waveforms, material removal rate, surface quality, and heat-affected zones (HAZ). The results demonstrate that the bulk resistance of silicon is the main mechanism for generating multi-channel discharges. This process efficiently disperses the discharge energy of the single discharge pulse, resulting in smaller craters, smoother machined surfaces, and shallower recast layers and HAZ. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nanofabrication, 2nd Edition)
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18 pages, 18098 KiB  
Article
High-Efficiency Precision Polishing Using Fiber Brush–Shear-Thickening Fluid Composites
by Zepeng Gong, Yaodong Jin, Qianqian Cao, Xiaoxing Dong, Yongjie Shi, Fengli Huang, Lujuan Li and Zhongyu Piao
Micromachines 2024, 15(12), 1497; https://doi.org/10.3390/mi15121497 - 15 Dec 2024
Viewed by 922
Abstract
Shear-thickening fluid (STF) is widely applied in various practical engineering fields due to its rheological properties of increased viscosity under load. We investigated the integration of STF with fiber brushes to prepare a novel composite material for polishing applications. The impact of composite [...] Read more.
Shear-thickening fluid (STF) is widely applied in various practical engineering fields due to its rheological properties of increased viscosity under load. We investigated the integration of STF with fiber brushes to prepare a novel composite material for polishing applications. The impact of composite material properties is studied in surface finish, specifically roughness and morphology, across flat and uneven surfaces. The effects of the critical variables, including polishing speed, feed depth, and STF concentration, are analyzed through experimentation and simulation. After the STF polishing, the surface roughness of the aluminum alloy sample decreases from 3.125 μm to 0.528 μm, which increases the processing efficiency by 40% compared to Newton polishing slurry. The unique shear-thickening performance of the composite material ensures excellent surface quality and high efficiency in the precision machining of workpieces. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nanofabrication, 2nd Edition)
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13 pages, 5482 KiB  
Article
In Situ Pre-Metallization Cleaning of CoSi2 Contact-Hole Patterns with Optimized Etching Process
by Tae-Min Choi, Eun-Su Jung, Jin-Uk Yoo, Hwa-Rim Lee, Songhun Yoon and Sung-Gyu Pyo
Micromachines 2024, 15(12), 1409; https://doi.org/10.3390/mi15121409 - 22 Nov 2024
Viewed by 886
Abstract
We examined how controlling variables in a pre-metallization Ar sputter-etching process for in situ contact-hole cleaning affects the contact-hole profile, etching rate, and substrate damage. By adjusting process parameters, we confirmed that increasing plasma power lowered the DC bias but enhanced the etching [...] Read more.
We examined how controlling variables in a pre-metallization Ar sputter-etching process for in situ contact-hole cleaning affects the contact-hole profile, etching rate, and substrate damage. By adjusting process parameters, we confirmed that increasing plasma power lowered the DC bias but enhanced the etching rate of SiO2, while increasing RF power raised both, with RF power having a more pronounced effect. Higher Ar flow rate reduced etching uniformity and slightly lowered the DC bias. There was no significant difference in the amount of etching between the oxide film types, but the nitride/oxide selectivity ratio was about 1:2. Physical damage during Ar sputter-etching was closely linked to DC bias. finally, Finally, etching of the Si and CoSi2 sublayers was performed on the device contact hole model. At this time, Si losses of up to about 31.7 Å/s occurred, and the etch speed was strongly affected by the DC bias. By optimizing the RF power and plasma power, we achieved a Si/CoSi2 etch selectivity ratio of about 1:2. Full article
(This article belongs to the Special Issue Recent Advances in Micro/Nanofabrication, 2nd Edition)
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