Emerging Packaging and Interconnection Technology, Second Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: 31 August 2025 | Viewed by 2894
Special Issue Editor
Interests: micro/nano-structure; MEMS packaging; surface and interface engineering; additive/subtractive packaging manufacturing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
As the integrated circuit industry becomes increasingly oriented by the "More than Moore" wave, electronic packaging is under the spotlight more than ever. This particular industrial sector is developing a fusion with cutting-edge micro/nano-scale science and engineering, with a significant impact on modern manufacturing. This Special Issue aims to provide a forum for the researchers and engineers of microelectronics packaging to share their latest ideas and discoveries, with an emphasis on advanced science and technology at the micro/nano-scale, a major topic covered by the journal Micromachines. In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following: design and implementation of new packaging architecture, advanced chip-to-substrate interconnection, high-density and low-temperature interconnection, micro/nano-structures for surface and interface engineering in packaging, new materials and processes of advanced packaging, modeling and simulation, heterogeneous integration, MEMS packaging and integration, packaging reliability, and manufacturing tooling.
Dr. Zhuo Chen
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- advanced packaging
- micro/nano-structure
- MEMS packaging
- high-density interconnection
- modeling and simulation
- heterogeneous integration
- surface and interface engineering
- manufacturing tooling
- additive/subtractive packaging manufacturing
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Related Special Issue
- Emerging Packaging and Interconnection Technology in Micromachines (5 articles)
