Silicon Photonic Devices and Integration
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".
Deadline for manuscript submissions: closed (30 April 2024) | Viewed by 27725
Special Issue Editor
Interests: silicon photonic devices and integration; photonic signal processing and applications; transmission, switching and sensing photonics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Silicon photonic devices and integration have been investigated widely for the unique features, such as compatibility with CMOS fabrication and potential to be monolithically integrated with microelectronic circuits. Rapid progresses have been made in design and fabrication of new concept devices, larger scale photonic integration, hybrid integration with other material platforms such as lithium niobate, III-V, two-dimensional material, and phase change material. Multiple new applications are enabled by the development of silicon photonics in addition to the traditional ones, such as optical phase arrays for Radar and Lidar systems, photonic neural networks for fast computing. Silicon photonic chips are expected to meet the ever-increasing demand of bandwidth, high integration density and low power consumption in existing and emerging systems. Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on novel designs, fabrication of photonic devices and chips, and new developments of their applications in intra/inter-chip, short-reach and long-haul optical communications, high-frequency and broadband signal processing and optical computing.
Prof. Dr. Jianping Chen
Guest Editor
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Keywords
- silicon photonics
- silicon-photonic chips
- silicon-based hybrid integration
- CMOS-compatible fabrication
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