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Special Issue "Advances in Semi-solid Forming"
A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Metal Casting, Forming and Heat Treatment".
Deadline for manuscript submissions: 30 June 2023 | Viewed by 5315
Special Issue Editors
Interests: Semi-solid forming/processing
Interests: solidificaiton and casting; electron microscopy; high performance alloys; phase transformation
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Semi-solid metal forming has developed since the 1970s. Thixoforming has been widely used in Europe, America, Japan and other countries to manufacture high-performance automobile, aircraft and other parts. Rheological forming technology has more advantages in energy saving and cost reduction. With the development and maturity of semi-solid slurry preparation technology, rheological forming is developing more and more rapidly. Rheological forming technology has been widely used in 5G communication filter boxes, new energy vehicle battery packs and other complex and thin-walled radiator parts. The large-scale complex thin-walled aluminum alloy devices made of special semi-solid die-casting aluminum alloy with high thermal conductivity have broad application prospects that can be utilized in the future. This issue provides some representative achievements in this field to exchange.
Prof. Dr. Renguo Guan
Dr. Jiehua Li
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- 5G communication filter box
- New energy vehicle battery pack
- Large-scale complex thin-walled aluminum alloy devices
- Aluminum alloy with high thermal conductivity