Numerical Modeling of Grain Boundary Migration at the Polycrystal Scale

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: closed (20 October 2019) | Viewed by 4197

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CEMEF - MINES ParisTech, 06904 Sophia Antipolis, France
Interests: multiscale modeling; numerical methods; numerical metallurgy
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Dear Colleagues,

The mechanical and functional properties of metallic materials are strongly related to their microstructures, which are themselves inherited from thermal and mechanical processing. The understanding and modeling of microstructural evolutions, at the polycrystal scale are thus of prime importance for the control of the final in-use material properties (mechanical strength, fatigue limit, crack resistance, stress corrosion resistance, etc.). Being able to accurately predict the microstructure obtained after complex processing routes recently became crucial for the metallurgy industry and remains a real challenge from a scientific point of view. Completing this challenge requires the development of numerical modeling capabilities based on realistic description of the intricate multiscale physical phenomena undergone by the material. In this context, numerous mesoscale methods have been developed, over the last decades, to simulate migration of grain boundaries at the polycrystal scale. Nowadays, new challenges, arising from an ever-increasing complexity of metallic alloys coupled to a better understanding of the involved mechanisms and a surge in the available experimental data, await responses. We propose, in this Special Issue, to focus on recent trends and advances concerning full field simulations of grain boundary migration at the polycrystal scale in metallic materials.

Prof. Marc Bernacki
Guest Editor

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Keywords

  • Grain boundary migration
  • Recrystallization
  • Grain growth
  • Nucleation
  • Full field methods
  • Multi phase field models
  • Cellular Automata approaches
  • Vertex methods
  • Monte Carlo algorithms
  • Level Set method

Published Papers (1 paper)

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19 pages, 7771 KiB  
Article
Kinetics of Grain Boundary Networks Controlled by Triple Junction and Grain Boundary Mobility
by Ernst Gamsjäger, Daniel M. Ogris and Jiří Svoboda
Metals 2018, 8(12), 977; https://doi.org/10.3390/met8120977 - 22 Nov 2018
Cited by 3 | Viewed by 3837
Abstract
The kinetics of a triple junction of grain boundaries with distinct specific energies and mobilities and a finite mobility of the triple junction is investigated. The microstructure is approximated by different 2D settings consisting of typical structural elements. First, the migration of the [...] Read more.
The kinetics of a triple junction of grain boundaries with distinct specific energies and mobilities and a finite mobility of the triple junction is investigated. The microstructure is approximated by different 2D settings consisting of typical structural elements. First, the migration of the triple point together with the adjacent grain boundaries, is simulated, assuming that the grains are infinitely large. Secondly, growth or shrinkage of finite n-sided grains is simulated by altering the boundary conditions and the results are compared to the already published analytical solution. The numerical results coincide with the corrected analytical solution. This solution can be derived either by applying the principle of maximum dissipation, or by applying the force balance at the triple junction within the framework of linear irreversible thermodynamics. The change of the area of infinite and finite grains is investigated analytically and numerically. By comparing the results of both approaches, the influence of the initial topology of the structural elements on the kinetics of grain growth can be estimated. Furthermore, the kinetics of grain growth of different idealized grain boundary networks is investigated. It is shown that square shaped grains surrounded by hexagons and dodecagons result in a more realistic grain growth scenarios than squares surrounded by octagons. A deviation from idealized grain boundary arrangements is e.g., observed, due to different triple junction mobilities, and the initially n-sided regular grain deforms in a complex manner. Full article
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