Interfacial Relationships and Behavior in Metal-Ceramic and Metal-Metal Joining Systems
A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Welding and Joining".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 6
Special Issue Editor
Interests: interfacial phenomena; joining processes; chemical processing; electromagnetic processing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Material joining is commonly used in varied engineering applications including the automotive, aerospace, energy, construction, tooling, electrical, electronics and biomedical sectors. The single-most notable factor that affects joint behavior is the nature of the joint interface where components of the same or different materials combine to form a joint. During joining, interfacial regions can experience complex physical and chemical interactions involving melting, diffusion, phase/microstructural changes and the development of residual stresses. The mechanical behavior of a joint is determined by the interfacial bond as this controls the load transfer, while a poor interfacial bond leads to cracks and failure. Understanding the development of interfaces and the control of interfacial phenomena are, therefore, of immense significance for developing robust joined structures.
In this Special Issue, we welcome articles from any engineering sector with a particular focus on joining processes involving metal–ceramic and metal–metal interfaces. Processes may include conventional welding, laser welding, solid-state welding (diffusion, friction stir, ultrasonic, etc.), brazing, soldering, adhesive bonding, mechanical joining (bolting / screwing, riveting, clinching, etc.) and hybrid joining methods (weld-bonding, rivet-bonding, etc.). The joined structures may be metal-to-metal and metal-to-ceramic. Contributions involving ceramic-to-ceramic joining using metallic brazes or solders are also welcome.
Prof. Dr. Andreas Chrysanthou
Guest Editor
Manuscript Submission Information
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Keywords
- metal joining
- metal-to-ceramic joining
- interfacial phenomena
- welding
- laser welding
- brazing
- soldering
- residual stresses
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