Special Issue "Recent Advances in Modeling for Reliability Analysis"

A special issue of Mathematics (ISSN 2227-7390).

Deadline for manuscript submissions: 31 August 2019

Special Issue Editors

Guest Editor
Prof. Dr. Willem van Driel

1. Electronic Components, Technology and Materials (ECTM), Department of Microelectronics, Delft University of Technology, Mekelweg 4, 2628 CD Delft, The Netherlands; 2. Signify, 5656 AE Eindhoven, The Netherlands
Website | E-Mail
Interests: Reliability; systems; integration; virtual prototyping; statistics; health monitoring
Guest Editor
Dr. R.T.H. Rongen

NXP Semiconductors
Website | E-Mail
Interests: Reliability Physics; Robustness Validation; Mission Profiles; Reliability Prediction and Modeling; Health Monitoring

Special Issue Information

Dear Colleagues,

When creating new (integrated) electronic functionalities and/or increasing performance, the concerns of reliability and functional safety should be accounted for right from the start of development. This avoids wrong choices that otherwise may lead to costly and time-consuming repetitions of several development steps or even major parts of the development. In the worst case, unreliable products could enter the market with dramatic consequences for customers and suppliers. The main challenges in the electronic industry are related to:

  • Continuous growth in the number, complexity, and diversity of the functional features, of the devices and components integrated, as well as of the technologies and the materials involved in each product;
  • Increase in the reliability and safety level to be achieved by the products, which will simultaneously and more frequently be deployed in ever harsher environments;
  • Decrease in time-to-market and cost-per-product due to stronger global competition;
  • Higher complexity and depth of the supply chain raises the risk of hidden quality and reliability issues, in particular at the interface between electronic components, the system in which they are built-in and the application in which the system is used.

In this Special Issue, we invite you to present your advances in the reliability domain that take into the account the above-mentioned challenges.

Prof. Dr. Willem van Driel
Dr. René T.H. Rongen
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Mathematics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 850 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • knowledge-based qualification
  • acceleration models
  • failure modes
  • structural similarity
  • failure analysis

Published Papers

This special issue is now open for submission.
Mathematics EISSN 2227-7390 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top