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Special Issue "Silicon Nanoparticles: Synthesis and Application"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials".

Deadline for manuscript submissions: 30 April 2019

Special Issue Editor

Guest Editor
Dr. Yimin Chao

School of Chemistry, University of East Anglia, Norwich NR4 7TJ, UK
Website | E-Mail
Interests: quantum dots; porous silicon; electrochemical etching; micelle template; solution growth; lithography template; ball milling; plasma synthesis; surface ligands; surface functionalization; energy conversion; solar cell; thermoelectrics; energy storage; battery anode; energetic bridge; biosensor; drug delivery; bioimaging; cancer targeting and diagnosis

Special Issue Information

Dear Colleagues,

Since the novel optical properties of porous silicon were discovered by Leigh Canham in the early 1990s, the research community has been carrying out intensive research on developing silicon quantum dots (SiQDs) and silicon nanoparticles (SiNPs) from classical porous silicon and from nanotechnology-based synthesis methods. For example, inverse micelle template formation, laser plasma synthesis, and lithography template methods are among typical bottom–up and top–down routes. During synthesis procedures, a critical issue is to prevent oxidation, which can be done by conjugation with functional groups on the surface.

The quantum confined optical and electronic properties render wide applications of SiQDs in biomedical imaging, drug delivery, and cancer targeting. The key step for such applications is to modify the surface with various functional ligands. Alkyl group capped SiQDs are among the earliest versions, but the surfaces are well protected from oxidation, which is still the best choice in terms of stability and the reliability of emission intensity. Amine-terminated SiQDs are acting as a platform for further functionalization. Recently-developed thiourea-functionalized SiQDs possess a strong ability to target epidermal growth factor receptors (EGFR) that are overexpressed in cancer cells. Other complex designs, such as encapsulations with drugs, provide vehicles for drug delivery and monitoring.

Silicon is the foundation for modern electronics and is still unreplaceable in the semiconductor industry, such as in information technology, artificial intelligence, and energy conversion and storage. Silicon nanostructures have been playing extraordinary roles in memory devices, thermoelectrics, solar energy conversion, and have been acting as powerful anodes in batteries and supercapacitors.

Nanotoxicity, reliability, stability, and reactivity of nanoparticles are important topics for environmentally-friendly synthesis and sustainable applications. The research field is advancing to new areas very rapidly.

It is my great pleasure to invite you to submit your manuscripts to this Special Issue. Research articles, communications, and reviews are all welcome.   

Dr. Yimin Chao
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • Porous silicon
  • silicon quantum dots
  • synthesis and functionalization
  • energy and environment
  • biomedical imaging
  • biosensor
  • drug delivery
  • cancer targeting and diagnosis

Published Papers (1 paper)

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Open AccessArticle Microstructure and Thermal Insulation Property of Silica Composite Aerogel
Materials 2019, 12(6), 993; https://doi.org/10.3390/ma12060993
Received: 24 December 2018 / Revised: 15 March 2019 / Accepted: 22 March 2019 / Published: 26 March 2019
PDF Full-text (5847 KB) | HTML Full-text | XML Full-text
Tetraethyl orthosilicate was selected as a matrix of heat insulating materials among three silanes, and an anti-infrared radiation fiber was chosen as a reinforcement for silica aerogel insulation composite. The silica aerogel was combined well and evenly distributed in the anti-infrared radiation fiber. [...] Read more.
Tetraethyl orthosilicate was selected as a matrix of heat insulating materials among three silanes, and an anti-infrared radiation fiber was chosen as a reinforcement for silica aerogel insulation composite. The silica aerogel was combined well and evenly distributed in the anti-infrared radiation fiber. The heat insulation effect was improved with the increase in thickness of the aerogel insulation material, as determined by the self-made aerospace insulation material insulation performance test equipment. The 15 mm and 30 mm thick thermal insulation material heated at 250 °C for 3 h, the temperatures at the cold surface were about 80 °C and 60 °C, respectively, and the temperatures at 150 mm above the cold surface were less than 60 °C and 50 °C, respectively. The silica aerogel composites with various thicknesses showed good thermal insulation stability. The silica insulation composite with a thickness of 15 mm exhibited good heat insulation performance, meets the thermal insulation requirements of general equipment compartments under low-temperature and long-term environmental conditions. The thermal conductivity of prepared silica aerogel composite was 0.0191 W·m−1·k−1 at room temperature and 0.0489 W·m−1·k−1 at 500 °C. Full article
(This article belongs to the Special Issue Silicon Nanoparticles: Synthesis and Application)

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