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In Situ Full-Field Deformation Measurements on Advanced Manufacturing Processes

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A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (31 December 2022) | Viewed by 14252

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Special Issue Editors

Dr. José Xavier

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Guest Editor

UNIDEMI, Department of Mechanical and Industrial Engineering, NOVA School of Science and Technology, Universidade NOVA de Lisboa, Caparica, Portugal
Interests: biomechanics; mechanical characterisation of materials and structures; full-field optical methods in experimental mechanics; mechanical and fracture identification methods
Special Issues, Collections and Topics in MDPI journals

Prof. Telmo G. Santos

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Guest Editor

UNIDEMI, Department of Mechanical and Industrial Engineering, NOVA School of Science and Technology, Universidade NOVA de Lisboa, 2928-516 Caparica, Portugal
Interests: nondestructive testing (NDT) and advanced manufacturing processes, namely, additive manufacturing (WAAM); hybrid processes; solid-state (friction stir welding/processing—FSW/P)

Special Issue Information

Dear Colleagues,

In the Digital Era novel technologies has been germinating. This special issue aims at highlighting research synergies among three major technologies: full-field optical techniques, additive manufacturing, and advanced materials.

In the discipline of photomechanics, full-field optical techniques have been developing, including digital image correlation. The data provided by these techniques is full-field and contact free. The access of deformation measurements across a whole region of interest have been gradually opening new research interests and perspectives in the branch of experimental and computational mechanics.

This Era has been witnessing the advance of technologies in the digitalisation of industry. Among them there is additive manufacturing. This process has already achieved a high impact into industry and modern society. A consistent evolution of this novel manufacturing tool is the synthesis of materials and parts with specific-oriented structure and functionality. This approach claims an unprecedented potential in which materials can evolve into the bio-inspired paradigm of heterogeneity and gradient mechanical properties.

Prof. José Xavier
Prof. Telmo G. Santos
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

Full-field optical methods
Digital image correlation
Additive manufacturing
Functionally graded materials
Material characterisation
In situ monitoring

Published Papers (4 papers)

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Research

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19 pages, 15409 KiB

Open AccessArticle

Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components

by Dibakor Boruah, Nele Dewagtere, Bilal Ahmad, Rafael Nunes, Jeroen Tacq, Xiang Zhang, Hua Guo, Wim Verlinde and Wim De Waele

Materials 2023, 16(4), 1702; https://doi.org/10.3390/ma16041702 - 17 Feb 2023

Cited by 1 | Viewed by 2020

Abstract

This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction. Full article

(This article belongs to the Special Issue In Situ Full-Field Deformation Measurements on Advanced Manufacturing Processes)

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Figure 1

12 pages, 18100 KiB

Open AccessArticle

An Alternative Digital Image Correlation-Based Experimental Approach to Estimate Fracture Parameters in Fibrous Soft Materials

by João Filho, José Xavier and Luiz Nunes

Materials 2022, 15(7), 2413; https://doi.org/10.3390/ma15072413 - 25 Mar 2022

Cited by 11 | Viewed by 1856

Abstract

One of the main challenges in experimental fracture mechanics is to correctly estimate fracture parameters of a nonhomogeneous and nonlinear material under large deformation. The crack tip detection is strongly affected by fibers at crack tip, leading to inaccurate measures. To overcome this limitation, a novel methodology based on the Digital Image Correlation (DIC) method for crack tip detection of fibrous soft composites is proposed in this work. The unidirectional composite was manufactured using a matrix of polydimethylsiloxane reinforced with a single layer of extensible cotton knit fabric. For two different fiber orientations, the crack growth (

d a

), Crack Tip Opening Displacement (CTOD) and Crack Tip Opening Angle (CTOA) were determined using pure shear specimens under mode I fracture. A consistent estimation of fracture parameters was obtained. The location of the crack tip position during the fracture test using the DIC-based methodology was validated against a visual inspection approach. Results indicated that the DIC-based methodology is easily replicable, precise and robust. Full article

(This article belongs to the Special Issue In Situ Full-Field Deformation Measurements on Advanced Manufacturing Processes)

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24 pages, 14383 KiB

Open AccessArticle

Identification of Orthotropic Elastic Properties of Wood by a Synthetic Image Approach Based on Digital Image Correlation

by João Henriques, José Xavier and António Andrade-Campos

Materials 2022, 15(2), 625; https://doi.org/10.3390/ma15020625 - 14 Jan 2022

Cited by 14 | Viewed by 2227

Abstract

This work aims to determine the orthotropic linear elastic constitutive parameters of Pinus pinaster Ait. wood from a single uniaxial compressive experimental test, under quasi-static loading conditions, based on two different specimen configurations: (a) on-axis rectangular specimens oriented on the radial-tangential plane, (b) off-axis specimens with a grain angle of about 60° (radial-tangential plane). Using digital image correlation (DIC), full-field displacement and strain maps are obtained and used to identify the four orthotropic elastic parameters using the finite element model updating (FEMU) technique. Based on the FE data, a synthetic image reconstruction approach is proposed by coupling the inverse identification method with synthetically deformed images, which are then processed by DIC and compared with the experimental results. The proposed methodology is first validated by employing a DIC-levelled FEA reference in the identification procedure. The impact of the DIC setting parameters on the identification results is systematically investigated. This influence appears to be stronger when the parameter is less sensitive to the experimental setup used. When using on-axis specimen configuration, three orthotropic parameters of Pinus pinaster (

E_{R}

E_{T}

and

ν_{RT}

) are correctly identified, while the shear modulus (

G_{RT}

) is robustly identified when using off-axis specimen configuration. Full article

(This article belongs to the Special Issue In Situ Full-Field Deformation Measurements on Advanced Manufacturing Processes)

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Review

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22 pages, 3787 KiB

Open AccessReview

In Situ Monitoring of Additive Manufacturing Using Digital Image Correlation: A Review

by Filipa G. Cunha, Telmo G. Santos and José Xavier

Materials 2021, 14(6), 1511; https://doi.org/10.3390/ma14061511 - 19 Mar 2021

Cited by 41 | Viewed by 6879

Abstract

This paper is a critical review of in situ full-field measurements provided by digital image correlation (DIC) for inspecting and enhancing additive manufacturing (AM) processes. The principle of DIC is firstly recalled and its applicability during different AM processes systematically addressed. Relevant customisations of DIC in AM processes are highlighted regarding optical system, lighting and speckled pattern procedures. A perspective is given in view of the impact of in situ monitoring regarding AM processes based on target subjects concerning defect characterisation, evaluation of residual stresses, geometric distortions, strain measurements, numerical modelling validation and material characterisation. Finally, a case study on in situ measurements with DIC for wire and arc additive manufacturing (WAAM) is presented emphasizing opportunities, challenges and solutions. Full article

(This article belongs to the Special Issue In Situ Full-Field Deformation Measurements on Advanced Manufacturing Processes)

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