Special Issue "Hot Deformation and Microstructure Evolution of Metallic Materials"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: 30 November 2020.

Special Issue Editor

Prof. Ivo Schindler
Website
Guest Editor
VSB—Technical University of Ostrava, Ostrava, Czech Republic
Interests: metallic materials; hot deformation behaviour; hot flow stress; structure forming processes; hot rolling; controlled forming and cooling

Special Issue Information

Dear Colleagues,

Hot deformation is a key method of processing metallic materials and controlling their final properties through the structure forming processes. The efficiency of the forming processes contributes significantly to the environmental aspects of the sustainable development of our civilization. The ability to exploit the structural potentiality of both traditional alloys and new progressive materials is crucial in terms of economic growth.

Thus, the content of this Special Issue “Hot Deformation and Microstructure Evolution of Metallic Materials” focuses not only on standard technologies (e.g., rolling or forging), but also on modern procedures, such as the severe plastic deformation methods or various types of the complex thermomechanical processing. Contributions to this Issue will represent research papers from the academic and the production sphere, preferably within their close cooperation. The strong physical basis of the research work, the application of advanced hot deformation simulators and structural analysis methods, and the optimization computer simulations of forming processes are welcome. Papers should become the basis for the dissemination of new knowledge in the scientific and technological spheres.

This Special Issue is open to anyone who is familiar with the hot forming and final cooling procedures, and the relevant structure forming processes (recrystallization, phase transformations, precipitation, etc.).

Prof. Ivo Schindler
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • hot deformation
  • hot formability
  • steels and non-ferrous alloys
  • metal matrix composites
  • hot forming technologies (rolling, forging, etc.)
  • hot SPD processes
  • dynamic and postdynamic softening
  • controlled forming and controlled cooling
  • simulation and optimization of hot forming
  • structure analysis
  • phase transformations
  • DCCT diagrams
  • grain refinement by recrystallization
  • final microstructure and mechanical properties
  • hot flow stress models
  • processing maps

Published Papers

This special issue is now open for submission.
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