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The Heat Equation: The Theoretical Basis for Materials Processing

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Simulation and Design".

Deadline for manuscript submissions: 20 February 2026 | Viewed by 3

Special Issue Editors


E-Mail Website
Guest Editor Assistant
National Institute for Laser, Plasma and Radiation Physics, Magurele, Ilfov, Romania
Interests: carbon nanomaterials; graphene; electrochemistry; carbon aerogels; plasma deposition; platinic catalysts; polymeric membranes; PEM fuel cells

Special Issue Information

Dear Colleagues,

Two centuries have passed since Fourier introduced the heat equation, yet the subject continues to be of significant scientific interest. This sustained relevance is driven by ongoing advancements in both the mathematical theory of heat conduction and the expanding technological domains that rely on its applications. The heat equation can be studied through a variety of modeling approaches, including analytical, semi-analytical, semi-analytical-numerical, and fully numerical methods. Among numerical tools, the finite element method stands out due to its versatility and accuracy, and it is effectively implemented using advanced software packages such as COMSOL Multiphysics.

Light has long held a central role across the disciplines of physics, chemistry, and biology. Over the last century, the advent of lasers—devices that stimulate atoms and molecules to emit and amplify light at specific wavelengths—has driven transformative advances in fields such as medicine, industrial material processing, data storage, printing, and defense. In each of these applications, the interaction between laser light and solid matter is of fundamental importance. To model and understand these interactions, the classical heat equation has been widely employed, serving as a foundational tool in numerous theoretical and practical analyses.

Despite certain criticisms regarding its limitations in extreme or ultrafast regimes, the classical heat equation remains a powerful and widely used tool for describing thermal effects in laser‒solid interactions. It is applicable to both homogeneous and inhomogeneous materials, providing valuable insights into heat transport dynamics. Particular attention has been devoted to its application in multi-layered structures and thin films, where thermal gradients and interfacial effects play a critical role in governing the overall response to laser irradiation.

Over the years, various Fourier and non-Fourier heat conduction models—incorporating thermal relaxation times—have been developed to address the limitations of classical approaches, particularly under conditions of rapid energy deposition. Among these, the two-temperature model (TTM), introduced nearly five decades ago, has become a cornerstone in the study of laser‒solid interactions. The TTM accounts for the distinct thermal responses of the electron and lattice subsystems, making it especially relevant for modeling ultrafast laser irradiation of metals. This model has significantly influenced the field and continues to be the subject of active investigation. Ultra-short laser processing has emerged as a widely explored researched topic due to its broad range of applications, spanning industry, medicine, fundamental research, and defense. Moreover, the field has expanded into micro- and nanotechnologies, with impactful contributions in electronics, mechanics, and biology.

Recent advancements in ultra-short laser pulse technology, particularly through the development of chirped pulse amplification, have enabled precise control over pulse duration—ranging from several nanoseconds down to the atto-seconds regime—tailored to specific application requirements. In light of this, the demand for more accurate and physically comprehensive theoretical models has grown significantly. The concepts and models discussed in the preceding paragraphs can be readily extended to describe radiation‒matter interactions beyond laser radiation, including those involving electron or charged particle beams. These frameworks are applicable to a wide range of solid materials, including metals, semiconductors, and dielectrics. Notably, a strong parallel exists between laser and electron beam cladding processes, as both involve localized energy deposition, rapid melting, and resolidification, governed by similar thermal and material response dynamics.

The upcoming Special Issue of Materials, entitled "The Heat Equation: The Theoretical Basis for Materials Processing", aims to gather contributions focused on modified forms of the heat equation as well as on advanced analytical and numerical methods for their solution.

The submission of full research articles, communications, and comprehensive review papers is highly welcome.

Dr. Mihai Oane
Dr. Liviu Duta
Guest Editors

Dr. Alexandra Trefilov
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • heat equation
  • two temperature model
  • theoretical laser processing
  • theoretical material processing

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