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Preparation and Application of Pulsed Laser Deposition High-Performance Thin Films

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 20 March 2026 | Viewed by 614

Special Issue Editors


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National Institute for Laser, Plasma and Radiation Physics, 409 Atomistilor Street, 077125 Bucharest, Romania
Interests: fractal physics; laser–matter interaction; plasma diagnostics; drug delivery; polymer dynamics
Special Issues, Collections and Topics in MDPI journals
Department Analyses of Functional Materials, Institute of Physics Czech Academy of Sciences, Prague, Czech Republic
Interests: fabrication of thin films by physical vapor deposition techniques; development of new hybrid deposition systems combining deposition techniques and processes such as laser ablation, magnetron sputtering, plasma jet, r.f. discharges, and electron beam evaporations; characterization of functional properties of thin films and nanostructures for sensors and optoelectronics applications
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue, "Preparation and Application of Pulsed Laser Deposition High-Performance Thin Films", highlights original research and advancements in pulsed laser deposition (PLD). It explores recent developments in fundamental and applied research to improve the performance, functionality, and scalability of thin films for applications in photonics, sensors, and functional coatings.

Topics of interest include modeling laser–matter interactions, thin film characterization, deposition control using plasma diagnostics, and the creation of novel materials with enhanced electrical, magnetic, optical, and sensory properties. We welcome contributions on functional materials such as complex oxides, nitrides or carbide. This Special Issue will also highlight the progress on controlling thin-film-specific properties through tailoring the multivariable dependencies that PLD allows.

We particularly encourage submissions integrating machine learning and artificial intelligence to refine and optimize the deposition process, fostering interdisciplinary approaches to PLD. By showcasing innovative methods and applications, this Special Issue aims to be a valuable resource for scientists, engineers, and practitioners in thin film technology.

Dr. Stefan-Andrei Irimiciuc
Dr. Jan Lancok
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • pulsed laser deposition
  • oxides
  • nitrides
  • oxynitrides
  • chalcogenide
  • metals
  • sensors
  • laser-matter interaction
  • high-entropy coatings
  • nanostructured materials
  • surface engineering
  • functional coatings
  • epitaxy

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Published Papers (1 paper)

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Research

21 pages, 5029 KB  
Article
Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits
by Chaofan Liang, Chongxin Tian, Yanmei Zhang, Xiuli He, Yanhua Bian, Binxin Dong, Gang Yu and Shaoxia Li
Materials 2025, 18(22), 5154; https://doi.org/10.3390/ma18225154 - 13 Nov 2025
Viewed by 333
Abstract
Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless [...] Read more.
Precision solder deposition for 3D or flexible substrates remains a persistent challenge in electronic packaging. This study introduces a hybrid process that integrates stencil printing with laser-induced forward transfer (LIFT), employing a customized line-scan trajectory to fabricate high-aspect-ratio solder deposits under large-gap, contactless conditions. Solder paste patterns were first printed on a glass carrier and subsequently transferred using pulsed laser scanning, with high-speed imaging employed to resolve the transfer dynamics. Three transfer regimes—stable, unstable, and no transfer—were identified, with the stable regime exhibiting sequential stages governed by vaporization-induced pressure and the viscoelastic response of the solder paste. The initial aspect ratio (AR) was found to critically influence separation behavior, with AR = 0.3 marking the transition between bridging and cantilevered morphologies. Transferred deposits consistently achieved final aspect ratios approaching 0.7; notably, low-AR (<0.15) patterns showed a 2.2-fold height increase. The process maintains a robust energy window (0.937–1.112 J/cm2), offering both mechanistic insight into transfer stability and practical guidance for optimizing solder paste deposition in advanced packaging applications. Full article
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