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Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application
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Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Composites".

Deadline for manuscript submissions: closed (10 March 2024) | Viewed by 3922

Special Issue Editors

Dr. Junshan Hu

E-Mail Website
Guest Editor
College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Interests: composite machining/joining/repairing; hybrid bolted-bonded joints; joint–structure testing and modeling
Dr. Bin Luo

E-Mail Website
Guest Editor
School of Mechanical Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Interests: damage mechanism; hybrid bolted-bonded joint; cutting and joining process
Dr. Huanxiong Xia

E-Mail Website
Guest Editor
School of Mechanical Engineering, Beijing Institute of Technology, Beijing, China
Interests: bonding assembly; precision assembly; multi-physics modelling and simulation
Dr. Peng Zou

E-Mail Website
Guest Editor
Full Scale Aircraft Structural Static/Fatigue Laboratory, AVIC Aircraft Strength Research Institute of China, Xi’an 710065, China
Interests: composite adhesively bonded joint; damage tolerance; variable–stiffness composite design; multiscale simulation

Special Issue Information

Dear Colleagues,

This Special Issue is entitled “Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application”, to be published in the journal Materials (ISSN 199601944, IF: 3.748). Dr. Junshan Hu, Bin Luo, Huanxiong Xia and Peng Zou are serving as Guest Editors for this issue.

Adhesively bonded joints are used in a wide range of engineering structures, including airplanes, vehicles, vessels and buildings, and each of these applications has different test, design and analysis needs. The uses of adhesively bonded joints have demonstrated rapid growth because of their essential advantages in comparison with other joining methods, such as reduced structural weight, higher joint stiffness and superior anti-corrosion performance. Despite this, it should be noted that stress concentrations still exist in both the adhesive and the adherends due to the inherent discontinuity of materials at the bonding area whatever the material combinations are: metal–metal, metal–plastic, metal–composite, composite–composite, composite–concrete, plastic–plastic, or metal–ceramic, etc. Thus, the adhesive choices, bonding adherends, surface pretreatment, joint design, bonding process, and service condition, etc., need to be considered to drive the best performance of such prospective joint structures.

This Special Issue aims to share the latest contributions and achievements in the advanced testing, analysis, design and application of adhesively bonded joints in this area through high-quality original works, subsequently promoting its dissemination through this Open Access system.

Dr. Junshan Hu
Dr. Bin Luo
Dr. Huanxiong Xia
Dr. Peng Zou
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • adhesives
  • adhesive interface
  • adhesive surface treatment
  • bonding mechanisms
  • functionally graded adhesive joint
  • adhesive joint design
  • adhesive joint test
  • structural analysis and optimization
  • adhesive joint application
  • static and fatigue performance
  • numerical modeling/simulation

Published Papers (4 papers)

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Research

20 pages, 16885 KiB  
Article
Extended Finite Element Method (XFEM) Model for the Damage Mechanisms Present in Joints Bonded Using Adhesives Doped with Inorganic Fillers
by João P. J. R. Santos, Daniel S. Correia, Eduardo A. S. Marques, Ricardo J. C. Carbas, Frida Gilbert and Lucas F. M. da Silva
Materials 2023, 16(23), 7499; https://doi.org/10.3390/ma16237499 - 4 Dec 2023
Viewed by 853
Abstract
The use of adhesive bonding in diverse industries such as the automotive and aerospace sectors has grown considerably. In structural construction, adhesive joints provide a unique combination of low structural weight, high strength and stiffness, combined with a relatively simple and easily automated [...] Read more.
The use of adhesive bonding in diverse industries such as the automotive and aerospace sectors has grown considerably. In structural construction, adhesive joints provide a unique combination of low structural weight, high strength and stiffness, combined with a relatively simple and easily automated manufacturing method, characteristics that are ideal for the development of modern and highly efficient vehicles. In these applications, ensuring that the failure mode of a bonded joint is cohesive rather than adhesive is important since this failure mode is more controlled and easier to model and to predict. This work presents a numerical technique that enables the precise prediction of the bonded joint’s behavior regarding not only its failure mode, but also the joint’s strength, when inorganic fillers are added to the adhesive. To that end, hollow glass particles were introduced into an epoxy adhesive in different amounts, and a numerical study was carried out to simulate their influence on single lap joint specimens. The numerical results were compared against experimental ones, not only in terms of joint strength, but also their failure pattern. The neat adhesive, which showed 9% and 20% variations in terms of failure load and displacement, respectively. However, looking at the doped configurations, these presented smaller variations of about 2% and 10% for each respective variable. In all cases, by adding glass beads, crack initiation tended to change from adhesive to cohesive but with lower strength and ductility, correctly modeling the general experimental behavior as intended. Full article
(This article belongs to the Special Issue Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application)
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14 pages, 4930 KiB  
Article
Comparison of Repair Methods for Cracked Titanium Alloy Aircraft Structures with Single-Sided Adhesively Bonded Composite Patches
by Junshan Hu, Chengyu Li, Jinrong Fang, Shizhan Chen, Shanyong Xuan and Wei Tian
Materials 2023, 16(19), 6361; https://doi.org/10.3390/ma16196361 - 22 Sep 2023
Cited by 2 | Viewed by 991
Abstract
Composite patches are widely accepted as a useful practice for the repair of cracked aircraft components and the repair method is of vital importance to the final performance of the repaired structures. The present research experimentally studied the repair efficiency and processing stability [...] Read more.
Composite patches are widely accepted as a useful practice for the repair of cracked aircraft components and the repair method is of vital importance to the final performance of the repaired structures. The present research experimentally studied the repair efficiency and processing stability of pre-cured, prepreg (including unidirectional and plain weave prepregs) and wet-layup methods for use on cracked Ti-alloy panels through the configuration of a butt joint bonded with a one-sided composite patch. The efficiency and stability of these repair methods were elaborately evaluated and compared via the load bearing behavior, the microstructure of the bonding interface, and the structural failure morphology through two batches of testing specimens. Typical patterns were found in load-displacement curves where the initial damage and ultimate bearing load points divided them into elastic-linear, damage propagation and complete fracture phases. Although the co-cure process of both unidirectional prepreg and wet-layup methods can form a jigsaw-like demarcation interface between the adhesive layer and the composite patch to achieve a good bonding force and a high recovery of loading performance, the latter presents porous patches with a high coefficient of variation in load-carrying capacity. Conversely, the pre-cured laminate and the plain weave prepreg patches failed to restore the mechanical properties owing to the weak bonding interface and the low axial patch strength, respectively. The unidirectional prepreg patch was proven to be the optimal repair method for the cracked metallic structures when balancing repair efficiency and processing stability. Full article
(This article belongs to the Special Issue Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application)
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15 pages, 8308 KiB  
Article
Surface Treatments for Enhancing the Bonding Strength of Aluminum Alloy Joints
by Juncheng Luo, Jianhua Liu, Huanxiong Xia, Xiaohui Ao, Haojie Yin and Lei Guo
Materials 2023, 16(16), 5674; https://doi.org/10.3390/ma16165674 - 18 Aug 2023
Cited by 1 | Viewed by 889
Abstract
Aluminum alloy adhesive bonding joint widely appears in many industrial products. Improving the mechanical performances of aluminum alloy bonding joints has been attracting much effort. To acquire more excellent bonding strength, this paper focused on the effects of different surface treatments, including laser [...] Read more.
Aluminum alloy adhesive bonding joint widely appears in many industrial products. Improving the mechanical performances of aluminum alloy bonding joints has been attracting much effort. To acquire more excellent bonding strength, this paper focused on the effects of different surface treatments, including laser ablation and milling superposed by phosphoric acid anodizing (PAA). The treated surfaces were characterized by roughness and contact angle, and the effects of the geometric parameters of microstructures on wettability, failure mode, and shear strength were examined. The results indicate that those surfaces where the spacing is smaller than the diameter present a hydrophilic property and the corresponding specimens are mainly subject to cohesive failure, and vice versa. Additionally, laser ablation with a properly designed dimple pattern can greatly improve the bonding strength, and the maximum average shear strength of specimens with a thickness of 50 μm reaches 32.82 MPa, which is an increase of 28.15% compared with the original milling specimen. Moreover, fabricating groove or grid patterns on the surfaces and applying PAA treatment can also significantly enhance the bonding strength, reaching up to 36.28 MPa. Full article
(This article belongs to the Special Issue Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application)
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9 pages, 7159 KiB  
Article
Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading
by Zhigang Li, Kai Cheng, Jiajun Liu, Yigang He and Yong Xiao
Materials 2023, 16(15), 5253; https://doi.org/10.3390/ma16155253 - 26 Jul 2023
Cited by 2 | Viewed by 668
Abstract
Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)3Sn4 phase [...] Read more.
Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)3Sn4 phase to the (Cu,Ni)6Sn5 phase at the Ni-xCu/Sn interface. Furthermore, a Cu3Sn layer was observed exclusively at the Cu/Sn interface. The shear strength of the soldering joints after thermal aging exhibited an initial decrease followed by an increase, except for a significant enhancement at the Cu content of 60 wt.%. In addition, the evolution law of mechanical properties and failure mechanism of the thermal aging joints were elucidated based on the fracture microstructure and the fracture curve of the joints. Full article
(This article belongs to the Special Issue Advances in Adhesively Bonded Joints: Testing, Analysis, Design and Application)
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