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Advanced Micro/Nanomaterials for Electronic Packaging and Energy Storage

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".

Deadline for manuscript submissions: 20 December 2026 | Viewed by 608

Editors

State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
Interests: printing electronics; flexible devices; zinc-ion batteries; nanomaterials
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Guest Editor
Department of Chemistry, University of Zululand, Private Bag X1001, KwaDlangezwa 3880, South Africa
Interests: nanomaterials; thin films; photo-catalysis; electrocatalysis; Zn-air batteries
Shaanxi Key Laboratory of Nanomaterials and Nanotechnology, Xi’an University of Architecture and Technology, Xi’an, China
Interests: aqueous batteries; cathode materials; nanomaterials

Special Issue Information

Dear Colleagues,

The rapid evolution of micro- and nano-scale materials is reshaping the landscape of electronic packaging and energy technologies. This Special Issue, ‘Advanced Micro/Nanomaterials for Electronic Packaging and Energy Storage’, aims to gather cutting-edge research that addresses the growing demand for high-performance, reliable, and energy-efficient systems. We welcome contributions that explore novel material design, interface engineering, thermal and electrical management, mechanical reliability, and multifunctional integration at micro/nano dimensions.

Studies in the following areas are particularly encouraged:

  • Advanced interconnects;
  • Packaging materials;
  • Flexible and stretchable electronics;
  • Next-generation energy storage and conversion;
  • Micro-/nano-electrode materials;
  • Nanocomposites for supercapacitors.

By highlighting fundamental mechanisms, innovative fabrication strategies, and application-driven demonstrations, this Special Issue seeks to provide a comprehensive platform for researchers developing next-generation materials solutions that enable more compact, sustainable, and robust electronic and energy devices. Potential authors should aim to present impactful advances that bridge material innovation with practical engineering needs.

Dr. Shang Wang
Dr. Malik Dishad Khan
Dr. Shuyue Li
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro/nano-scale materials
  • electronic packaging
  • energy harvesting and storage
  • interface engineering
  • thermal management
  • multifunctional integration

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Published Papers (1 paper)

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Research

11 pages, 4677 KB  
Article
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging
by Pengrong Lin, Zirui Tong, Shimeng Xu, Yiping Wang, Shang Wang and Yanhong Tian
Materials 2026, 19(11), 2182; https://doi.org/10.3390/ma19112182 - 22 May 2026
Viewed by 427
Abstract
Silver pastes are promising joining materials for use in advanced electronic packaging, particularly in power electronics, due to their capacity for low-temperature joining and high-temperature operation. However, spherical silver particles suffer from low sintering efficiency and high porosity due to their limited contact [...] Read more.
Silver pastes are promising joining materials for use in advanced electronic packaging, particularly in power electronics, due to their capacity for low-temperature joining and high-temperature operation. However, spherical silver particles suffer from low sintering efficiency and high porosity due to their limited contact areas. In this study, a submicron triangular silver flake paste was investigated to overcome these limitations. A high joint strength of 35.2 MPa with a low porosity of 9.48% was achieved at 250 °C via pressureless sintering. A relatively high thermal conductivity (134.9 W/(m·K)) was also achieved. This enhanced sintering performance is attributed to a unique mechanism involving distinct same-layer and inter-layer sintering processes at different temperatures. With these findings, we demonstrate that the submicron triangular silver flake paste is a high-strength, high-thermal-conductivity, low-temperature bonding material for advanced electronic packaging. Full article
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