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High-Efficiency Machining Technologies and Advanced Tools for Hard and Brittle...
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High-Efficiency Machining Technologies and Advanced Tools for Hard and Brittle Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 June 2024) | Viewed by 7180

Special Issue Editors

Prof. Dr. Feng Jiang

E-Mail Website
Guest Editor
Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021, China
Interests: precision cutting; material constitutive model; numerical simulation
Prof. Dr. Guoqin Huang

E-Mail Website
Guest Editor
Institute of Manufacturing Engineering, Huaqiao University, Xiamen 361021, China
Interests: diamond abrasive tools
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Hard and brittle materials are extensively used in many industries like aerospace, automobile, energy, civil engineering, military, biomedical, electronics, optical, etc. The common hard and brittle materials include silicon and silicon-based materials, diamonds, ceramics, glasses, semiconductors, optical crystals, titanium/tungsten alloys, refractory metals, cemented carbide, and so on, which are difficult to machine using traditional machining techniques due to their hardness and toughness. Therefore, it is necessary to develop high-efficiency machining processes and advanced tools using new preparation methods, such as additive manufacturing method, to enhance the machinability of hard-to-machine materials.

The potential topics of interest include, but are not limited to:

  • The characteristic features of hard and brittle materials;
  • The fundamental machining mechanisms of hard and brittle materials;
  • High-efficiency/precision machining equipment and cutting tools;
  • Micromachining and microfabrication;
  • Surface integrity;
  • The numerical simulation of machining processes;
  • New methods of tool manufacturing;
  • The machining performance evaluation of advanced tools.

Prof. Dr. Feng Jiang
Prof. Dr. Guoqin Huang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • hard and brittle materials
  • monocrystalline silicon
  • sapphire
  • monocrystalline silicon carbide
  • high-efficiency and precision machining
  • fundamental machining processes including cutting, grinding, polishing, finishing, etc.
  • machine equipment
  • cutting tools and abrasive tools
  • additive manufacturing of advanced tools
  • micro/nano machining
  • numerical simulation

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Published Papers (4 papers)

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Research

16 pages, 9703 KiB  
Article
Modeling of Material Removal Rate for the Fixed-Abrasive Double-Sided Planetary Grinding of a Sapphire Substrate
by Gen Chen, Zhongwei Hu, Lijuan Wang and Yue Chen
Materials 2024, 17(15), 3688; https://doi.org/10.3390/ma17153688 - 25 Jul 2024
Cited by 1 | Viewed by 932
Abstract
Double-sided planetary grinding (DSPG) with a fixed abrasive is widely used in sapphire substrate processing. Compared with conventional free abrasive grinding, it has the advantages of high precision, high efficiency, and environmental protection. In this study, we propose a material removal rate ( [...] Read more.
Double-sided planetary grinding (DSPG) with a fixed abrasive is widely used in sapphire substrate processing. Compared with conventional free abrasive grinding, it has the advantages of high precision, high efficiency, and environmental protection. In this study, we propose a material removal rate (MRR) model specific to the fixed-abrasive DSPG process for sapphire substrates, grounded in the trajectory length of abrasive particles. In this paper, the material removal rate model is obtained after focusing on the theoretical analysis of the effective number of abrasive grains, the indentation depth of a single abrasive grain, the length of the abrasive grain trajectory, and the groove repetition rate. To validate this model, experiments were conducted on sapphire substrates using a DSPG machine. Theoretical predictions of the material removal rate were then juxtaposed with experimental outcomes across varying grinding pressures and rotational speeds. The trends between theoretical and experimental values showed remarkable consistency, with deviations ranging between 0.2% and 39.2%, thereby substantiating the model’s validity. Moreover, leveraging the insights from this model, we optimized the disparity in the material removal rate between two surfaces of the substrate, thereby enhancing the uniformity of the machining process across both surfaces. Full article
(This article belongs to the Special Issue High-Efficiency Machining Technologies and Advanced Tools for Hard and Brittle Materials)
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15 pages, 3997 KiB  
Article
Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire
by Zixing Yang, Hui Huang, Xinjiang Liao, Zhiyuan Lai, Zhiteng Xu and Yanjun Zhao
Materials 2024, 17(9), 2134; https://doi.org/10.3390/ma17092134 - 2 May 2024
Cited by 3 | Viewed by 2043
Abstract
Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a method for calculating the sawing [...] Read more.
Electroplated diamond wire sawing is widely used as a processing method to cut hard and brittle difficult-to-machine materials. Currently, obtaining the sawing capability of diamond wire saw through the wire bow is still difficult. In this paper, a method for calculating the sawing capability of diamond wire saw in real-time based on the wire bow is proposed. The influence of the renewed length per round trip, crystal orientation of sapphire, wire speed, and feed rate on the wire sawing capability has been revealed via slicing experiments. The results indicate that renewing the diamond wire saw, and reducing the wire speed and feed rate can delay the reduction in sawing capability. Furthermore, controlling the value of renewed length per round trip can make the diamond wire saw enter a stable cutting state, in which the capability of the wire saw no longer decreases. The sawing capability of diamond wire saw cutting in the A-plane of the sapphire is smaller than that of the C-plane, and a suitable feed rate or wire speed within the range of sawing parameters studied in this study can avoid a rapid decrease in the sawing capability of the wire saw during the cutting process. The knowledge obtained in this study provides a theoretical basis for monitoring the performance of the wire saw, and guidance for the wire cutting process in semiconductor manufacturing. In the future, it may even be possible to provide real-time performance parameters of diamond wire saw for the digital twin model of wire sawing. Full article
(This article belongs to the Special Issue High-Efficiency Machining Technologies and Advanced Tools for Hard and Brittle Materials)
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13 pages, 3924 KiB  
Article
Fabrication and Application of Grinding Wheels with Soft and Hard Composite Structures for Silicon Carbide Substrate Precision Processing
by Qiufa Luo, Jieming Chen, Jing Lu, Congming Ke, Guangqiu Hu and Hui Huang
Materials 2024, 17(9), 2079; https://doi.org/10.3390/ma17092079 - 28 Apr 2024
Cited by 2 | Viewed by 1880
Abstract
In silicon carbide processing, the surface and subsurface damage caused by fixed abrasive grinding significantly affects the allowance of the next polishing process. A novel grinding wheel with a soft and hard composite structure was fabricated for the ultra-precision processing of SiC substrates, [...] Read more.
In silicon carbide processing, the surface and subsurface damage caused by fixed abrasive grinding significantly affects the allowance of the next polishing process. A novel grinding wheel with a soft and hard composite structure was fabricated for the ultra-precision processing of SiC substrates, and the grinding performance of the grinding wheel was assessed in this study. Different types of gels, heating temperatures, and composition ratios were used to fabricate the grinding wheel. The grinding performance of the grinding wheel was investigated based on the surface integrity and subsurface damage of SiC substrates. The results showed that the grinding wheel with a soft and hard composite structure was successfully fabricated using freeze-dried gel with a heating temperature of 110 °C, and the component ratio of resin to gel was 4:6. A smooth SiC substrate surface with almost no cracks was obtained after processing with the grinding wheel. The abrasive exposure height was controlled by manipulating the type and ratio of the gel. Furthermore, the cutting depth in nanoscale could be achieved by controlling the abrasive exposure height. Therefore, the fabrication and application of the grinding wheels with soft and hard composite structures is important for the ultra-precision processing of large-size SiC substrates. Full article
(This article belongs to the Special Issue High-Efficiency Machining Technologies and Advanced Tools for Hard and Brittle Materials)
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15 pages, 22549 KiB  
Article
The Influence of Heat Treatment Temperature on Tensile Properties of Metal-Bonded Diamond Composites Fabricated via Selective Laser Melting
by Guangyao Han, Yangli Xu, Jinquan Wei, Guoqin Huang, Tingting Li, Yiqiang He, Zhiping Xie, Zihong Mai and Zeling Yang
Materials 2023, 16(20), 6683; https://doi.org/10.3390/ma16206683 - 13 Oct 2023
Cited by 1 | Viewed by 1315
Abstract
Selective Laser Melting (SLM) is an effective technology for fabricating new types of porous metal-bonded diamond tools with complex geometries. However, due to the high cooling rate and internal stresses during SLM fabrication, defects such as high porosities and interface gaps still need [...] Read more.
Selective Laser Melting (SLM) is an effective technology for fabricating new types of porous metal-bonded diamond tools with complex geometries. However, due to the high cooling rate and internal stresses during SLM fabrication, defects such as high porosities and interface gaps still need to be resolved before it can be considered for use in other applications. The influence of heat treatment temperature on internal characterization, interface microstructures, and tensile properties of AlSi7Mg-bonded diamond composites fabricated by SLM were investigated in this work. From experimental results, the porosities of HT-200, HT-350, and HT-500 specimens were 12.19%, 11.37%, and 11.14%, respectively, showing a slightly lower percentage than that of the No-HT specimen (13.34%). Here, HT represents “Heat Treatment”. For No-HT specimens, an obvious un-bonding area can be seen in the interface between AlSi7Mg and diamond, whereas a relative closer interface can be observed for HT-500 specimens. After heat treatment, the elastic modulus of specimens showed a relative stable value (16.77 ± 2.79~18.23 ± 1.72 GPa), while the value of yield strength decreased from 97.24 ± 4.48 to 44.94 ± 7.06 MPa and the value of elongation increased from 1.98 ± 0.05 to 6.62 ± 0.51%. This difference can be attributed mainly to the disappearance of the solid-solution hardening effect due to the increase of Si content after heat treatment. Full article
(This article belongs to the Special Issue High-Efficiency Machining Technologies and Advanced Tools for Hard and Brittle Materials)
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