Advances in Flexible Electronics and Electronic Devices
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 20 August 2025 | Viewed by 66
Special Issue Editors
Interests: sensors; energy harvesting; epidermal electronics; e-skin
Special Issues, Collections and Topics in MDPI journals
Interests: self-powered device; luminescent materials; display systems; flexible multimode sensor
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Flexible electronics is reshaping the boundaries of modern devices, enabling revolutionary applications in wearables, health monitoring, IoT, and human–machine interfaces. This Special Issue aims to showcase cutting-edge research on novel flexible materials (e.g., organic semiconductors, 2D materials, stretchable polymers), advanced device designs (e.g., sensors, transistors, energy harvesting/storage systems), and scalable fabrication techniques (e.g., printed electronics, transfer printing, micro/nanofabrication). It also highlights emerging applications in biomedicine (e.g., epidermal electronics, implantable devices), environmental interactions (e.g., e-skin, soft robotics), and sustainable technologies (e.g., biodegradable electronics). We welcome original research, reviews, and interdisciplinary studies, particularly those addressing critical challenges such as mechanical stability, environmental durability, and signal processing integration. This Special Issue seeks to bridge the gap from lab to industry, fostering collaboration across materials, devices, and systems for next-generation flexible electronics.
Dr. Zuqing Yuan
Prof. Dr. Junlu Sun
Dr. Wenqiang Wu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible electronics
- stretchable materials
- printed electronics
- bioelectronics
- e-skin
- soft robotics
- biodegradable electronics
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