Special Issue "Advances in Ultra-Wide Bandgap Devices"
Deadline for manuscript submissions: 30 November 2021.
Interests: active devices; semiconductor; design, simulation, fabrication, and advanced characterization of innovative wide bandgaps and ultra-wide bandgaps devices
Special Issues and Collections in MDPI journals
Gallium nitride (GaN)- and silicon carbide (SiC)-based devices are continuously maturing with a significantly growing market penetration for many applications. Ultra-wide bandgap semiconductors (UWBG), commonly defined as materials with bandgaps exceeding that of GaN (3.4 eV) and SiC (3.3 eV), are attracting increasing attention. The main reason for this is that many of the figures‐of‐merit for the device performance scale with an increasing bandgap result in potentially far superior performances. This clearly represents an exciting and challenging new area of research in semiconductor materials, physics, devices, and applications.
This Special Issue aims to highlight recent developments and the state of the art in the field of UWBG and devices, including both experimental results and theoretical developments. These include advances in all important aspects of key materials such as Ga2O3, AlN, BN, AlGaN, and diamond; as well as the modelling, simulation, design, epitaxy, fabrication technology, reliability, novel device architectures, advanced characterizations and applications to improve the performance of devices and circuits.
Dr. Farid Medjdoub
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- UWBG growth and material properties
- power electronics
- device simulation
- electrical and structural characterization