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Electronics
Special Issues
Printed and Flexible Electronics
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Printed and Flexible Electronics

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Flexible Electronics".

Deadline for manuscript submissions: 19 April 2024 | Viewed by 13499

Special Issue Editor

Prof. Dr. Yuning Li

E-Mail Website
Collection Editor
Department of Chemical Engineering, University of Waterloo, 200 University Ave West, Waterloo, ON N2L 3G1, Canada
Interests: printed electronics; organic thin film transistors; organic photovoltaics; sensors; photodetectors; organic semiconductors; batteries
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Printed and flexible electronics have drawn much attention in recent years. This interest has been driven by two main factors. On one hand, there is an increased availability of solution-processable organic materials or nanomaterials, which enables the fabrication of electronics using printing techniques at significantly lower costs in comparison to the traditional silicon technology; on the other hand, there have been increasing demands for flexible and lightweight devices due to the increasing use of portable electronics and the growing prevalence of the Internet of Things (IoT) technology. Printing techniques and some other deposition methods such as thermal evaporation, sputtering, and chemical vapor deposition (CVD), can be utilized alone or in combination to fabricate flexible electronics.   

The aim of this topical collection is to present the latest developments in printed and flexible electronics. It will cover various electronic devices including, but not limited to, field-effect transistors or thin-film transistors, logic circuits, photovoltaics or solar cells, memory devices, bio- and chemical sensors, smart labels, and photodetectors, both printed (solution-processed) and flexible.

Prof. Dr. Yuning Li
Collection Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Printed electronics
  • Flexible electronics
  • Plastic electronics
  • Organic electronics
  • Wearable electronics
  • Stretchable Electronics
  • Transistors
  • Photovoltaics
  • Light-emitting diodes
  • Sensors

Published Papers (4 papers)

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Research

10 pages, 2983 KiB  
Article
Washable, Low-Temperature Cured Joints for Textile-Based Electronics
by Jerzy Szalapak, Vitalij Scenev, Daniel Janczak, Lukas Werft, Sigrid Rotzler, Malgorzata Jakubowska, Malte von Krshiwoblozki, Christine Kallmayer and Martin Schneider-Ramelow
Electronics 2021, 10(22), 2749; https://doi.org/10.3390/electronics10222749 - 10 Nov 2021
Cited by 4 | Viewed by 1532
Abstract
Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes based on [...] Read more.
Low-temperature die-attaching pastes for wearable electronics are the key components to realize any type of device where components are additively manufactured by pick and place techniques. In this paper, the authors describe a simple method to realize stretchable, bendable, die-attaching pastes based on silver flakes to directly mount resistors and LEDs onto textiles. This paste can be directly applied onto contact pads placed on textiles by means of screen and stencil printing and post-processed at low temperatures to achieve the desired electrical and mechanical properties below 60 °C without sintering. Low curing temperatures lead to lower power consumption, which makes this paste ecological friendly. Full article
(This article belongs to the Special Issue Printed and Flexible Electronics)
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14 pages, 59553 KiB  
Article
Pinhole Formation in Printed Electronic Traces Fabricated via Molten Metal Droplet Jetting
by Manoj Meda, Viktor Sukhotskiy and Denis Cormier
Electronics 2021, 10(13), 1568; https://doi.org/10.3390/electronics10131568 - 29 Jun 2021
Cited by 2 | Viewed by 2268
Abstract
The fabrication of printed electronic devices via molten metal droplet jetting has enormous potential in flexible electronic device applications due to the extremely high electrical conductivity and excellent substrate adhesion of printed features. However, large pinholes (which could be detrimental to the feature [...] Read more.
The fabrication of printed electronic devices via molten metal droplet jetting has enormous potential in flexible electronic device applications due to the extremely high electrical conductivity and excellent substrate adhesion of printed features. However, large pinholes (which could be detrimental to the feature performance) have been experimentally observed when molten metal droplets of aluminum 4043 alloy are deposited and solidified on a polyimide (PI) substrate. In this study, we have shown that subjecting the polymer substrate to elevated temperature during droplet deposition considerably reduces the number and size of pinholes. The formation mechanism behind the large pinholes is interpreted as the release of the adsorbed/absorbed moisture from the polymer substrate into the solidifying droplet due to the rapid rise in temperature of the substrate upon droplet impact. Through numerical modelling, we have shown that the temperature of the polyimide substrate underneath the deposited droplet exceeds the boiling point of water while the metal droplet is still in liquid state, showing the possibility of water vapor escaping from the substrate and causing pinholes in the solidifying metal. Full article
(This article belongs to the Special Issue Printed and Flexible Electronics)
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18 pages, 14934 KiB  
Article
Wash Analyses of Flexible and Wearable Printed Circuits for E-Textiles and Their Prediction of Damages
by Shahood uz Zaman, Xuyuan Tao, Cédric Cochrane and Vladan Koncar
Electronics 2021, 10(11), 1362; https://doi.org/10.3390/electronics10111362 - 07 Jun 2021
Cited by 4 | Viewed by 2864
Abstract
The development of specific user-based wearable smart textiles is gaining interest. The reliability and washability of e-textiles, especially electronic-based components of e-textiles, are under particular investigation nowadays. This is because e-textiles cannot be washed like normal textile products and washing electronic products is [...] Read more.
The development of specific user-based wearable smart textiles is gaining interest. The reliability and washability of e-textiles, especially electronic-based components of e-textiles, are under particular investigation nowadays. This is because e-textiles cannot be washed like normal textile products and washing electronic products is not common practice in our daily life. To adopt the e-textile products in our daily life, new standards, based on product usage, should be developed especially for flexibility and washability. The wearable motherboards are the main component for e-textile systems. They should be washing reliable and flexible for better adoption in the system. In this manuscript, flexible wearable PCBs were prepared with different conductive track widths and protected with silicone coatings. The samples were washed for 50 washing cycles in the household washing machine, and provoked damages were investigated. The PCBs were also investigated for bending tests (simulating mechanical stresses in the washing machine), and resultant damages were discussed and co-related with washing damages. The bending test was performed by bending the FPCBs at 90° over the circular rod and under the known hanging load. Full article
(This article belongs to the Special Issue Printed and Flexible Electronics)
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12 pages, 18136 KiB  
Article
Eco-Friendly Materials for Daily-Life Inexpensive Printed Passive Devices: Towards “Do-It-Yourself” Electronics
by Brice Le Borgne, Bo-Yan Chung, Mehmet O. Tas, Simon G. King, Maxime Harnois and Radu A. Sporea
Electronics 2019, 8(6), 699; https://doi.org/10.3390/electronics8060699 - 21 Jun 2019
Cited by 12 | Viewed by 5496
Abstract
The need for the fabrication of a new generation of devices has developed with the next generation of ‘home’ engineers, which is resulting in an ever-increasing population interested in “do-it-yourself” electronics and the Internet of Things. However, this new trend should not be [...] Read more.
The need for the fabrication of a new generation of devices has developed with the next generation of ‘home’ engineers, which is resulting in an ever-increasing population interested in “do-it-yourself” electronics and the Internet of Things. However, this new trend should not be done at the expense of the environment. Almost all previous studies, related to the low-temperature processing of devices, fail to highlight the extent of the impact that the synthesis of these technologies have on both the environment and human health. In addition, the substrates typically used, are also often associated with major drawbacks such as a lack of biodegradability. In this paper, we fabricate a simple RC filter using various domestically available printing techniques, utilising readily available materials such as: carbon soots (carbon black) as an electric conductor, and egg white (albumen) as a dielectric. These devices have been fabricated on both polyethylene terephthalate (PET) and paper, which demonstrated the same performances on both substrates and revealed that recyclable substrates can be used without compromise to the devices’ performance. The filter was found to exhibit a cut-off frequency of 170 kHz, which made it suitable for high-frequency reception applications. Full article
(This article belongs to the Special Issue Printed and Flexible Electronics)
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