Special Issue "Machine Learning and Intelligent Agents Applications: from Data Mining to Business Intelligence"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Artificial Intelligence".

Deadline for manuscript submissions: 10 April 2021.

Special Issue Editors

Prof. Dr. Agapito Ledezma Espino
Website
Guest Editor
Computer Science and Engineering Department, Carlos III University of Madrid, 28911 Leganés, Madrid, Spain
Interests: computer science; Artificial Intelligence
Special Issues and Collections in MDPI journals
Prof. Dr. Araceli Sanchis de Miguel
Website
Guest Editor
Computer Science and Engineering Department, Carlos III University of Madrid, 28911 Leganés, Madrid, Spain
Interests: computer science; Artificial Intelligence

Special Issue Information

Dear Colleagues,

In the mid-1990s, terms such as data mining, machine learning, or intelligent agents began to be part of the vocabulary not only of the academic world but also of companies encouraged by the digitization of companies and institutions. Initially, the techniques and methods associated with these terms were used as non-priority task support tools in companies, but over time, they became in the core of the business. In the last two decades, the number of applications of different machine learning techniques and intelligent agents has experienced exponential growth either directly named or under the umbrella of terms such as data mining, business intelligence, or data analytics. 

The exponential growth of the data available for analysis allows companies to have an asset that they can put at the service of the business through the application of machine learning and intelligent agents. In this Special Issue, we are particularly interested in the application of machine learning techniques and intelligent agents aimed at turning data into insights that are actable by companies/institutions. We encourage submissions of conceptual, empirical, and literature review work that focuses on this field. 

Possible topics of interest include but are not limited to machine learning and intelligent agents and their impact on: 

  • Economics and finance;
  • Supply chain management;
  • Human resources management;
  • Creating values;
  • Customer management;
  • Innovation;
  • Ethical aspects;
  • Sustainable development;
  • Agent-based simulation.

Prof. Dr. Agapito Ledezma Espino
Prof. Dr. Araceli Sanchis de Miguel
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Machine learning
  • Intelligent agents
  • Business intelligence
  • Agent-based simulation
  • Data analytics
  • Data mining.

Published Papers

This special issue is now open for submission.
Back to TopTop