Advancement in Additive Manufacturing and Signal Interference Detection in Communication Network
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 15 September 2025 | Viewed by 639
Special Issue Editors
Interests: 3D printed antenna; satellite communication; microwave communication; antenna design
Special Issues, Collections and Topics in MDPI journals
Interests: metasurface design; mmWave antennas; rain attenuation; antenna design and wave propagation
Special Issues, Collections and Topics in MDPI journals
Interests: antenna design and wave propagation; microwave and millimeter wave communication; engineering electromagnetics; metasurface
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The advancement in communication media are increasing in recent scenario with progress in additive manufacturing and error detection in commuication path. Error detection has been growing concern in defined communication media where the effect can be due to rain especially in higher frequency of operation, signal interference resulted due to unwanted carriers such as Network Termination Devices in satellite and microwave field. In this special issue, we are focusing on the development of novel three dimensional (3D) printed surface along with applicable signal tracing especially focusing on the inference level.
The topics of interests include but not limited to:
- Advancement in 5G/B5G/6G technologies;
- Network Termination Devices management and signal intensity level;
- Satellite communication path and signal tracing in slant path;
- Utilization of 3D printed surfaces to detect the error margin;
- Characterization of novel materials;
- Use of filaments, resin to realize the complex geometrical surfaces;
- Ulization of metal 3D printing technologies;
- Artificial intelligence and use of Neural Network in communication design scenarios;
- Spectrum Analyzer to detect the interferance level;
- Use of time division technology for defined time slot;
- 3D printed beam steerable surface design;
- Complex array configurable antenna sources;
- Novel concept for patch design and resonant cavity antenna;
- Use of copper painted solution on 3D printed antenna surfaces;
- Ralization of 3D printed sources and its effect on sattellite and microwave communication.
Dr. Sujan Shrestha
Dr. Dong-You Choi
Prof. Dr. Karu P. Esselle
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- advancement in 5G/B5G/6G technologies
- network termination devices management and signal intensity level
- satellite communication path and signal tracing in slant path
- utilization of 3D printed surfaces to detect the error margin
- characterization of novel materials
- use of filaments, resin to realize the complex geometrical surfaces
- ulization of metal 3D printing technologies
- artificial intelligence and use of Neural Network in communication design scenarios.
- spectrum analyzer to detect the interferance level
- use of time division technology for defined time slot
- 3D printed beam steerable surface design
- complex array configurable antenna sources
- novel concept for patch design and resonant cavity antenna
- use of copper painted solution on 3D printed antenna surfaces
- ralization of 3D printed sources and its effect on sattellite and microwave communication
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.
