2.5/3D Integrated Circuits: Challenges, Technologies and Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microelectronics".
Deadline for manuscript submissions: 15 January 2027 | Viewed by 85
Editor
Special Issue Information
Dear Colleagues,
2.5D/3D integrated circuits are at the heart of post-Moore-era microelectronics innovation. As traditional transistor scaling approaches its physical limits, vertical stacking and heterogeneous integration have become critical pathways to sustain performance growth, enhance energy efficiency, and reduce interconnect latency. These technologies break through the bandwidth, power, and density bottlenecks of conventional 2D chips, offering transformative potential for high-performance computing, AI accelerators, data centers, and mobile devices. 2.5D/3D integration schemes—including interposer-based integration, hybrid bonding, monolithic 3D integration, and compute-in-memory architectures—provide viable technical routes to overcome the memory wall and achieve heterogeneous functional integration.
This Special Issue, “2.5/3D Integrated Circuits: Challenges, Technologies and Applications”, aims to foster the exchange of cutting-edge research and industrial insights into the design, manufacturing, thermal management, power integrity, testing strategies, and deployment of 3D integrated systems. We encourage contributions that address real-world challenges and breakthrough solutions in this rapidly evolving field, bridging the gap between advanced packaging theories and practical system implementations.
The main topics of this Special Issue include, but are not limited to:
- Design and modeling of 2.5D/3D ICs;
- 3D interconnect and heterogeneous integration technologies;
- Thermal management and cooling solutions;
- Wide-bandgap semiconductor applications;
- Power distribution networks and signal integrity;
- Reliability and testing in 3D integration;
- Compute-in-memory and near-memory computing architectures;
- 3D ICs for high-performance computing and AI acceleration;
- Advanced packaging materials and processes;
- EDA tools and design flows;
- Real-world application cases and reliability validation.
We cordially invite you to contribute your research findings and practical insights on these key enabling technologies, jointly advancing 2.5D/3D integrated circuits from laboratory prototypes to large-scale industrial applications.
Dr. Wei He
Guest Editor
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Keywords
- 2.5D/3D integrated circuits
- heterogeneous integration
- through-silicon via (TSV)
- hybrid bonding
- thermal management
- wide-bandgap semiconductor applications
- power integrity
- compute-in-memory
- advanced packaging
- reliability
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