Recent Advances in Integrated Circuit Design
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".
Deadline for manuscript submissions: 15 October 2026 | Viewed by 394
Editors
Interests: design of analog/mixed-signal; power management IC design ASIC-based systems for biosensing; edge-AI computing; neuromorphic architectures; integrating materials innovation with system-level IC co-design
Special Issues, Collections and Topics in MDPI journals
Interests: microdevice fabrication; microelectronics DNA based sensing; wearable biosensors; AC electrokinetic based cell detection platforms droplet microfluidic systems
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Integrated circuit (IC) design continues to play a transformative role in modern electronics, enabling advancements across communication systems, artificial intelligence (AI), healthcare technologies, automotive electronics, energy systems, and edge computing platforms. As semiconductor technologies scale into deep submicron and heterogeneous integration domains, new challenges and opportunities arise in performance optimization, power efficiency, signal integrity, reliability, and system-level integration.
Recent progress in analog/mixed-signal circuits, RF and mm-wave systems, AI accelerators, neuromorphic architectures, and ASIC-enabled sensing platforms has significantly expanded the capabilities of next-generation electronic systems. At the same time, emerging applications such as Edge-AI, Internet of Things (IoT), wearable and implantable biosensors, electric mobility, and smart infrastructure demand highly optimized, low-power, and scalable IC solutions.
This Special Issue aims to highlight recent innovations, methodologies, modeling techniques, and prototype demonstrations in integrated circuit design. We are particularly interested in contributions that bridge device-level innovations, circuit architectures, and system-level applications, as well as interdisciplinary approaches combining materials, electronics, and artificial intelligence.
Topics of interest include, but are not limited to:
- Analog and mixed-signal integrated circuit design
- RF, mm-wave, and high-speed communication circuits
- AI accelerators and neuromorphic computing architectures
- ASIC design for biosensing and biomedical applications
- Low-power and energy-efficient IC techniques
- Power management and energy harvesting circuits
- Design methodologies for advanced CMOS and emerging technologies
- 3D integration, heterogeneous integration, and chiplet architectures
- Signal integrity, noise reduction, and high-performance data converters
- IC solutions for IoT, Edge computing, and smart mobility systems
We welcome original research articles, review papers, and case studies that demonstrate innovative circuit techniques, experimental validation, or system-level integration strategies that advance the field of integrated circuit design.
We look forward to your valuable contributions.
Dr. Balakumar Muniandi
Dr. Renny Edwin Fernandez
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- integrated circuit design
- analog and mixed-signal circuits
- ASIC design
- AI accelerators
- Edge-AI SoC
- low-power VLSI
- neuromorphic circuits
- RF and mm-wave circuits
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