Applications of Image Analysis and Intelligent Vision

Dear Colleagues,

The proposed topical collection focuses on the emerging integration of Edge Artificial Intelligence (Edge AI) and computer vision for precision engineering systems, with particular emphasis on electronics and semiconductor manufacturing environments, as well as high-precision medical imaging applications. Recent advances in sensing technologies, embedded computing, and data-driven modeling have enabled intelligent perception capabilities to be deployed closer to physical processes and imaging devices, thereby supporting real-time monitoring, adaptive control, and autonomous decision-making.

The scope of this collection encompasses theoretical foundations, methodological innovations, and industrial or clinical applications related to:

• Edge-enabled visual sensing, inspection, and quality assessment in precision manufacturing;
• Real-time perception-driven process optimization and control;
• Digital twin systems integrating edge perception and system-level intelligence;
• AI-enabled defect detection, fault diagnosis, and predictive maintenance;
• Multi-modal data fusion for high-precision manufacturing and medical imaging systems;
• Deployment-aware learning, model compression, and hardware–software co-design;
• Edge AI-assisted medical image reconstruction, analysis, and intelligent diagnostics;
• Case studies and industrial or translational validation in semiconductor, electronics, and biomedical imaging domains.

The purpose of this collection is to bridge the gap between perception-level AI advancements and system-level intelligent engineering, promoting scalable, real-time, and deployment-ready solutions across both advanced manufacturing and medical imaging systems.

While the existing literature has extensively explored machine learning, computer vision, and digital twin technologies in manufacturing and medical imaging, most prior studies remain domain-isolated, algorithm-centric, or system-conceptual, with limited attention to deployment constraints, real-time integration, and edge-level intelligence orchestration.

Recent research has addressed specific aspects such as visual defect detection, digital twin modeling, or AI-driven medical image analysis. However, a systematic synthesis of edge perception, intelligent control, and digital twin frameworks across precision engineering domains—including semiconductor manufacturing and medical imaging—remains underdeveloped.

This topical collection will therefore supplement the current literature by:

• Advancing the integration of perception-driven AI with digital twin architectures across industrial and clinical systems;
• Emphasizing real-time, resource-constrained, and deployment-aware methodologies;
• Highlighting cross-domain intelligence from sensing to decision-making;
• Providing industrial and translational validation insights;
• Establishing a unified perspective on Edge AI-enabled intelligent cyber-physical ecosystems.

By consolidating interdisciplinary advances across AI, manufacturing science, biomedical engineering, and cyber-physical systems, the collection aims to accelerate the transition from algorithmic innovation to real-world deployment.

Dr. Ruoxin Wang
Dr. Jianning Chu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• edge AI
• computer vision
• precision manufacturing
• electronics manufacturing
• semiconductor manufacturing
• digital twin
• medical imaging
• intelligent inspection
• real-time manufacturing intelligence
• deployment-aware AI