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Proceedings 2018, 2(13), 703; https://doi.org/10.3390/proceedings2130703

The Realization of Redistribution Layers for FOWLP by Inkjet Printing

1
CTR Carinthian Tech Research, 9524 Villach, Austria
2
Technical University Berlin, Microperipheric Center, 13355 Berlin, Germany
3
Fraunhofer IZM, 13355 Berlin, Germany
*
Author to whom correspondence should be addressed.
Published: 13 December 2018
(This article belongs to the Proceedings of Eurosensors 2018)
PDF [589 KB, uploaded 13 December 2018]

Abstract

The implementation of additive manufacturing technology (e.g., digital printing) to the electronic packaging segment has recently received increasing attention. In almost all types of Fan-out wafer level packaging (FOWLP), redistribution layers (RDLs) are formed by a combination of photolithography, sputtering and plating process. Alternatively, in this study, inkjet-printed RDLs were introduced for FOWLP. In contrast to a subtractive method (e.g., photolithography), additive manufacturing techniques allow depositing the material only where it is desired. In the current study, RDL structures for different embedded modules were realized by inkjet printing and further characterized by electrical examinations. It was proposed that a digital printing process can be a more efficient and lower-cost solution especially for rapid prototyping of RDLs, since several production steps will be skipped, less material will be wasted and the supply chain will be shortened.
Keywords: MEMS packaging; inkjet printing; fan-out wafer level packaging; rdl; rapid prototyping MEMS packaging; inkjet printing; fan-out wafer level packaging; rdl; rapid prototyping
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Roshanghias, A.; Ma, Y.; Dreissigacker, M.; Braun, T.; Bretthauer, C.; Becker, K.-F.; Schneider-Ramelow, M. The Realization of Redistribution Layers for FOWLP by Inkjet Printing . Proceedings 2018, 2, 703.

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