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Study of Surface Metallization of Polyimide Film and Interfacial Characterization

Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan
Author to whom correspondence should be addressed.
Academic Editor: Håkan Hallberg
Metals 2017, 7(6), 189;
Received: 22 March 2017 / Revised: 12 May 2017 / Accepted: 20 May 2017 / Published: 25 May 2017
(This article belongs to the Special Issue Metallization of Non-Conductive Substrates)
PDF [23036 KB, uploaded 25 May 2017]


Nickel (Ni) metallization of polyimide (PI) was performed using a solution-based process including imide-ring opening reactions, the implanting of Ni ions, the reduction of catalytic Ni nanoparticles, and the electroless deposition of a Ni film. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition. A basic treatment of potassium hydroxide (KOH) is commonly used in the imide-ring opening reaction where a poly(amic acid) (PAA) layer forms on the PI surface. In this study, we report that the KOH concentration significantly affects the implanting, reduction, and deposition behavior of Ni. A uniform Ni layer can be grown on a PI film with full coverage through electroless deposition with a KOH concentration of 0.5 M and higher. However, excessive imide-ring opening reactions caused by 5 M KOH treatment resulted in the formation of a thick PAA layer embedded with an uneven distribution of Ni nanoparticles. This composite layer (PAA + Ni) causes wastage of the Ni catalyst and degradation of peel strength of the Ni layer on PI. View Full-Text
Keywords: metallization; Ni; polyimide; interfacial microstructure; nanoparticle metallization; Ni; polyimide; interfacial microstructure; nanoparticle

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Wu, P.-Y.; Lin, C.-H.; Chen, C.-M. Study of Surface Metallization of Polyimide Film and Interfacial Characterization. Metals 2017, 7, 189.

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