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Article

Study on Microstructure and Properties of Silver-Plated Alumina-Reinforced Copper Matrix Composites

Key Laboratory of Advanced Structural Materials, Ministry of Education and School of Materials Science and Engineering, Changchun University of Technology, Changchun 130012, China
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Metals 2026, 16(1), 46; https://doi.org/10.3390/met16010046 (registering DOI)
Submission received: 27 November 2025 / Revised: 23 December 2025 / Accepted: 26 December 2025 / Published: 29 December 2025
(This article belongs to the Section Metal Matrix Composites)

Abstract

Alumina (Al2O3) reinforced copper matrix composites are widely used in the electronic industry, rail transit, and other fields due to their excellent electrical conductivity, ductility, and wear resistance. However, due to problems such as non-wetting and thermal expansion differences between alumina and Cu, weak interfacial bonding can easily reduce physical and thermal properties. A uniform silver layer was deposited on Al2O3 via chemical plating to enhance interface bonding with copper. Al2O3@Ag/Cu composites with 1–3 wt.% Al2O3 were prepared by rapid hot-press sintering. The effects of plating temperature and Al2O3 content on microstructure and properties were investigated. The results show that the optimum coating temperature is 25 °C, and a thin and uniform silver coating can be formed. This effectively improved Al2O3–Cu interface bonding while maintaining 77.8% of copper’s thermal conductivity (320.7 W/(m·K)). The composites showed improved wear resistance with increasing Al2O3 content. At 3 wt.% Al2O3@Ag, the wear rate was 3.36 × 10−5 mm3/(N·m), 84.4% lower than pure copper, with plow groove wear as the main mechanism.
Keywords: copper matrix composites; Al2O3; thermal conductivity; mechanical properties; tribological property copper matrix composites; Al2O3; thermal conductivity; mechanical properties; tribological property

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MDPI and ACS Style

Zhang, X.; Ye, H.; Liu, K.; Dong, P.; Chen, Y.; Zou, H. Study on Microstructure and Properties of Silver-Plated Alumina-Reinforced Copper Matrix Composites. Metals 2026, 16, 46. https://doi.org/10.3390/met16010046

AMA Style

Zhang X, Ye H, Liu K, Dong P, Chen Y, Zou H. Study on Microstructure and Properties of Silver-Plated Alumina-Reinforced Copper Matrix Composites. Metals. 2026; 16(1):46. https://doi.org/10.3390/met16010046

Chicago/Turabian Style

Zhang, Xinyue, Huadong Ye, Ke Liu, Pan Dong, Yerong Chen, and Haohao Zou. 2026. "Study on Microstructure and Properties of Silver-Plated Alumina-Reinforced Copper Matrix Composites" Metals 16, no. 1: 46. https://doi.org/10.3390/met16010046

APA Style

Zhang, X., Ye, H., Liu, K., Dong, P., Chen, Y., & Zou, H. (2026). Study on Microstructure and Properties of Silver-Plated Alumina-Reinforced Copper Matrix Composites. Metals, 16(1), 46. https://doi.org/10.3390/met16010046

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