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Volume 15
Issue 9
10.3390/met15090958
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Article

Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid

by
Kyu-Sik Kim
1,
Abdul Wahid Shah
1,2,
Jin-Pyung Kim
3,
Si-Young Sung
3,
Kee-Ahn Lee
1,* and
Min-Su Jeon
1
1
Department of Materials Science and Engineering, Inha University, Incheon 22212, Republic of Korea
2
School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523000, China
3
Korea Automotive Technology Institute, Cheonan 31214, Republic of Korea
*
Author to whom correspondence should be addressed.
Metals 2025, 15(9), 958; https://doi.org/10.3390/met15090958 (registering DOI)
Submission received: 2 August 2025 / Revised: 26 August 2025 / Accepted: 26 August 2025 / Published: 28 August 2025
(This article belongs to the Special Issue Light Alloy and Its Application (2nd Edition))
Versions Notes

Abstract

This study reported the development of a novel Al-Si-Mg-based composite reinforced by micron-sized Cu-Mn binary solid solution phases and submicron-sized α-Al(Mn,Fe)Si dispersoids. The Cu-Mn binary solid solution phases were added to the melt in the form of an Al-3%CuMn master alloy, whereas α-Al(Mn,Fe)Si dispersoids were obtained via heat treatment. The microstructure analysis confirmed the presence of micron-sized Cu-Mn binary, eutectic Mg2Si, and Al15(FeMn)3Si2 intermetallic phases, submicron-sized α-Al(Mn,Fe)Si dispersoids, and nano-sized precipitates in the Al-based composite. At room temperature, tensile results represented a yield strength of 287 MPa and a tensile strength of 306 MPa, with an elongation of 17%. Moreover, the Al-based composite maintained a yield strength of 277 MPa up to 250 °C, with a slight increase in elongation. The composite also exhibited excellent high-temperature high-cycle fatigue properties and showed a high-cycle fatigue limit of 140 MPa at 130 °C, which is ~2.3 times higher than that of the commercial A319 alloy. A fractography study revealed that the secondary particles hindered the movement of dislocations, thus delaying crack initiation under cyclic loading at high temperatures. Additionally, Cu-Mn binary solid solutions and Al15(FeMn)3Si2 phases were found to be effective in reducing the crack propagation rate by hindering the movement of the propagated crack.
Keywords: Al-Si-Mg-(Cu-Mn) composite; micron and submicron particles; microstructure; mechanical properties; thermal stability Al-Si-Mg-(Cu-Mn) composite; micron and submicron particles; microstructure; mechanical properties; thermal stability

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MDPI and ACS Style

Kim, K.-S.; Shah, A.W.; Kim, J.-P.; Sung, S.-Y.; Lee, K.-A.; Jeon, M.-S. Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid. Metals 2025, 15, 958. https://doi.org/10.3390/met15090958

AMA Style

Kim K-S, Shah AW, Kim J-P, Sung S-Y, Lee K-A, Jeon M-S. Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid. Metals. 2025; 15(9):958. https://doi.org/10.3390/met15090958

Chicago/Turabian Style

Kim, Kyu-Sik, Abdul Wahid Shah, Jin-Pyung Kim, Si-Young Sung, Kee-Ahn Lee, and Min-Su Jeon. 2025. "Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid" Metals 15, no. 9: 958. https://doi.org/10.3390/met15090958

APA Style

Kim, K.-S., Shah, A. W., Kim, J.-P., Sung, S.-Y., Lee, K.-A., & Jeon, M.-S. (2025). Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid. Metals, 15(9), 958. https://doi.org/10.3390/met15090958

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