Kim, K.-S.; Shah, A.W.; Kim, J.-P.; Sung, S.-Y.; Lee, K.-A.; Jeon, M.-S.
Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid. Metals 2025, 15, 958.
https://doi.org/10.3390/met15090958
AMA Style
Kim K-S, Shah AW, Kim J-P, Sung S-Y, Lee K-A, Jeon M-S.
Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid. Metals. 2025; 15(9):958.
https://doi.org/10.3390/met15090958
Chicago/Turabian Style
Kim, Kyu-Sik, Abdul Wahid Shah, Jin-Pyung Kim, Si-Young Sung, Kee-Ahn Lee, and Min-Su Jeon.
2025. "Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid" Metals 15, no. 9: 958.
https://doi.org/10.3390/met15090958
APA Style
Kim, K.-S., Shah, A. W., Kim, J.-P., Sung, S.-Y., Lee, K.-A., & Jeon, M.-S.
(2025). Fabrication, Microstructure, and High-Temperature Mechanical Properties of a Novel Al-Si-Mg Based Composite Reinforced with Cu-Mn Binary Phase and Submicron Dispersoid. Metals, 15(9), 958.
https://doi.org/10.3390/met15090958
