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Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain

1
Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China
2
City College, Kunming University of Science and Technology, Kunming 650093, China
*
Author to whom correspondence should be addressed.
Academic Editor: Thomas Schenk
Metals 2022, 12(1), 143; https://doi.org/10.3390/met12010143
Received: 15 December 2021 / Revised: 7 January 2022 / Accepted: 10 January 2022 / Published: 12 January 2022
Copper–tin alloys are widely used in the machining and molding of sleeves, bearings, bearing housings, gears, etc. They are a material used in heavy-duty, high-speed and high-temperature situations and subject to strong friction conditions due to their high strength, high modulus of elasticity, low coefficient of friction and good wear and corrosion resistance. Although copper–tin alloys are excellent materials, a higher performance of mechanical parts is required under extreme operating conditions. Plastic deformation is an effective way to improve the overall performance of a workpiece. In this study, medium-temperature compression tests were performed on a semi-solid CuSn10P1 alloy using a Gleeble 1500D testing machine at different temperatures (350−440 °C) and strain rates (0.1−10 s−1) to obtain its medium-temperature deformation characteristics. The experimental results show that the filamentary deformation marks appearing during the deformation are not single twins or slip lines, but a mixture of dislocations, stacking faults and twins. Within the experimental parameters, the filamentary deformation marks increase with increasing strain and decrease with increasing temperature. Twinning subdivides the grains into lamellar sheets, and dislocation aggregates are found near the twinning boundaries. The results of this study are expected to make a theoretical contribution to the forming of copper–tin alloys in post-processing processes such as rolling and forging. View Full-Text
Keywords: semi-solid Cu-Sn alloy; plastic deformation; dislocation; stacking fault; deformation twin semi-solid Cu-Sn alloy; plastic deformation; dislocation; stacking fault; deformation twin
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MDPI and ACS Style

Liu, Z.; Zhou, R.; Xiong, W.; He, Z.; Liu, T.; Li, Y. Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain. Metals 2022, 12, 143. https://doi.org/10.3390/met12010143

AMA Style

Liu Z, Zhou R, Xiong W, He Z, Liu T, Li Y. Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain. Metals. 2022; 12(1):143. https://doi.org/10.3390/met12010143

Chicago/Turabian Style

Liu, Zhangxing, Rongfeng Zhou, Wentao Xiong, Zilong He, Tao Liu, and Yongkun Li. 2022. "Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain" Metals 12, no. 1: 143. https://doi.org/10.3390/met12010143

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