Liu, Z.; Zhou, R.; Xiong, W.; He, Z.; Liu, T.; Li, Y.
Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain. Metals 2022, 12, 143.
https://doi.org/10.3390/met12010143
AMA Style
Liu Z, Zhou R, Xiong W, He Z, Liu T, Li Y.
Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain. Metals. 2022; 12(1):143.
https://doi.org/10.3390/met12010143
Chicago/Turabian Style
Liu, Zhangxing, Rongfeng Zhou, Wentao Xiong, Zilong He, Tao Liu, and Yongkun Li.
2022. "Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain" Metals 12, no. 1: 143.
https://doi.org/10.3390/met12010143
APA Style
Liu, Z., Zhou, R., Xiong, W., He, Z., Liu, T., & Li, Y.
(2022). Compressive Rheological Behavior and Microstructure Evolution of a Semi-Solid CuSn10P1 Alloy at Medium Temperature and Low Strain. Metals, 12(1), 143.
https://doi.org/10.3390/met12010143